PERIODIC PLASMA ANNEALING IN AN ALD-TYPE PROCESS
First Claim
Patent Images
1. An atomic layer deposition process for forming a thin film on a substrate in a reaction space, comprising in sequence:
- a) depositing a layer of a first thickness by;
contacting the substrate with a vapor phase pulse of a metal source chemical;
removing excess metal source chemical from the reaction space;
contacting the substrate with a vapor phase pulse of one or more plasma-excited reducing species during a first period of time; and
removing excess plasma-excited reducing species and reaction by-products from the reaction space;
b) repeating step a) for a first number of cycles until the layer of the first thickness is formed;
c) contacting the substrate with a vapor phase pulse of one or more plasma-excited reducing species during a second period of time, the second period being not less than about twice as long as the first period; and
d) repeating steps a) through c) for a second number of cycles until a film of a second thickness is formed over the substrate.
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Abstract
Methods for performing periodic plasma annealing during atomic layer deposition are provided along with structures produced by such methods. The methods include contacting a substrate with a vapor-phase pulse of a metal source chemical and one or more plasma-excited reducing species for a period of time. Periodically, the substrate is contacted with a vapor phase pulse of one or more plasma-excited reducing species for a longer period of time. The steps are repeated until a metal thin film of a desired thickness is formed over the substrate.
136 Citations
42 Claims
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1. An atomic layer deposition process for forming a thin film on a substrate in a reaction space, comprising in sequence:
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a) depositing a layer of a first thickness by; contacting the substrate with a vapor phase pulse of a metal source chemical; removing excess metal source chemical from the reaction space; contacting the substrate with a vapor phase pulse of one or more plasma-excited reducing species during a first period of time; and removing excess plasma-excited reducing species and reaction by-products from the reaction space; b) repeating step a) for a first number of cycles until the layer of the first thickness is formed; c) contacting the substrate with a vapor phase pulse of one or more plasma-excited reducing species during a second period of time, the second period being not less than about twice as long as the first period; and d) repeating steps a) through c) for a second number of cycles until a film of a second thickness is formed over the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. An atomic layer deposition process for forming a thin film on a substrate in a reaction space, comprising in sequence:
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a) depositing a layer of a first thickness by; contacting the substrate with a vapor phase pulse of a metal source chemical; removing excess metal source chemical from the reaction space; contacting the substrate with a gas phase pulse of one or more reducing species during a first period of time; and removing excess reducing species and reaction by-products from the reaction space; b) repeating step a) for a first number of cycles until the layer of the first thickness is formed; c) contacting the substrate with a vapor phase pulse of one or more plasma-excited reducing species during a second period of time, the second period being not less than twice as long as the first period; and d) repeating steps a) through c) for a second number of cycles until a film of a second thickness is formed over the substrate. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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33. An atomic layer deposition process for forming a metal nitride film on a substrate in a reaction space, comprising the sequential steps of:
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a) contacting the substrate with a vapor-phase pulse of a metal source chemical; b) contacting the substrate with a vapor phase pulse of one of a reducing agent and a first nitrogen source chemical; c) contacting the substrate with a vapor phase pulse of the other of the reducing agent and the nitrogen source chemical; and d) repeating steps a) through c) for a first number of cycles until a first thickness of between a fraction of an angstrom and one hundred angstroms of material is deposited since either the ALD process began or an annealing step occurred; e) contacting the substrate with a vapor phase pulse of one or more plasma-excited reducing agent and a second nitrogen source chemical for a second period of time; and f) repeating steps a) through e) for a second number of cycles until a metal nitride thin film of a second thickness is formed over the substrate. - View Dependent Claims (34, 35, 36, 37, 38)
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- 39. A semiconductor device comprising a metal film over a substrate, the metal film defining one or more vias having a width of less than about two-tenths of a micrometer, the metal film comprising no more than about 5 atomic % oxygen.
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42. A semiconductor device comprising a via having a feature size of less than about two-tenths of a micrometer and a metal nitride film over a substrate, the metal nitride film comprising no more than about 5 atomic % oxygen.
Specification