Block Copolymerized Polyimide Ink Composition for Printing

• US 20080275181A1
• Filed: 05/24/2005
• Published: 11/06/2008
• Est. Priority Date: 05/27/2004
• Status: Abandoned Application

• Current Assignee: PI R&D Co.,Ltd., Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Inventors: Miyazaki, Kenji, Goshima, Toshiyuki, Nakajima, Shintaro, Kyo, Eika, Win, Maw Soe, Kashiwagi, Tohru, Hayashi, Noriki, Okuyama, Hiroshi, Yamabayashi, Naoyuki, Kasabo, Fumio, Tanaka, Ippei, Nakagama, Shoji, Yamada, Katsuya
• Application Number:
  US11/597,694
• Publication Number:
  US 20080275181A1
• Time in Patent Office: Days
• US Class Current: 524/600
• CPC Class Codes: C09D 11/102 containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2203/0783 Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673

Abstract

The object is to provide a polyimide ink composition having good printing properties and good continuous printing properties, which composition can be dried at a low temperature of not higher than 220° C., and which composition gives a coating film, after being dried, having excellent dimensional stability, heat resistance, low modulus of elasticity, flexibility, resistance to warping, chemical resistance, adhesiveness with substrates, and plating resistance. This object is accomplished by a polyimide ink composition for printing, comprising a mixed solvent containing an benzoic acid ester solvent and a glyme solvent, and a polyimide soluble in the mixed solvent; wherein the polyimide is obtained by polycondensing a polyimide oligomer with a tetracarboxylic dianhydride component(s) and/or a diamine component(s) having no siloxane bond in molecular skeleton thereof the polyimide oligomer being prepared by polycondensing a tetracarboxylic dianhydride component(s) and a diamine component(s) having siloxane bonds in molecular skeleton thereof in the presence of a base catalyst(s), or a mixed catalyst including a lactone(s) and/or an acidic compound(s) and a base(s); the content of the diamine component(s) having siloxane bonds based on the total diamine components being 15 to 85% by weight.

Claims

1. A polyimide ink composition for printing, comprising a mixed solvent containing a benzoic acid ester solvent and a glyme solvent, and a polyimide soluble in said mixed solvent;

wherein said polyimide is obtained by polycondensing a polyimide oligomer with a tetracarboxylic dianhydride component(s) and/or a diamine component(s) having no siloxane bond in molecular skeleton thereof, said polyimide oligomer being prepared by polycondensing a tetracarboxylic dianhydride component(s) and a diamine component(s) having siloxane bonds in molecular skeleton thereof in the presence of a base catalyst(s), or a mixed catalyst including a lactone(s) and/or an acidic compound(s) and a base(s);

the content of said diamine component(s) having siloxane bonds based on the total diamine components being 15 to 85% by weight.

2. The polyimide ink composition for printing, according to claim 1, wherein said diamine component(s) having no siloxane bond is an aromatic diamine(s) and/or aromatic diamine carboxylic acid(s).

3. The polyimide ink composition for printing, according to claim 1, wherein said diamine(s) having siloxane bonds in the molecular skeleton thereof has(have) the structure represented by the following General Formula (I):

4. The polyimide ink composition for printing, according to claim 1, wherein said polyimide has a weight average molecular weight (molecular weight in terms of styrene) of 30,000 to 200,000.

5. The polyimide ink composition for printing, according to any one of claims 1 to 3, wherein said composition has a polyimide content of 30 to 50% by weight.

6. The polyimide ink composition for printing, according to any one of claims 1 to 3, further comprising a filler in an amount of 5 to 20 parts by weight with respect to 95 to 80 parts by weight of said polyimide.

7. The polyimide ink composition for printing, according to claim 6, wherein said filler is an insulating inorganic filler, resin-coated inorganic filler and/or resin filler.

8. The polyimide ink composition for printing, according to claim 6, wherein said filler is particles having an average particle size of 0.001 μ

m to 10 μ

m.

9. The polyimide ink composition for printing, according to claim 6, wherein said filler is at least one selected from the group consisting of silica particles, spherical or amorphous silica, hydrated metal compounds, aluminum oxide, titanium dioxide, phosphorus compounds, epoxy resins, melamine polyphosphate, melem, melamine cyanurate, maleimide resins, polyurethane resins, polyimides, polyamides and triazine.

10. The polyimide ink composition for printing, according to any one of claims 1 to 3, further comprising as a coloring agent a halogen-free phthalocyanine which is an organic pigment in an amount of 2 to 10% by weight based on the amount of said polyimide.

11. A method for forming a polyimide ink film, said method comprising directly applying or patterning said polyimide ink composition according to any one of claims 1 to 3 by a printing method or precision dispensing method in one operation.

12. An electric circuit board having an insulating protective film, said electric circuit board being produced by a process comprising:

forming, by the method of claim 11, a polyimide ink film(s) as a protective insulating layer(s) on a wiring(s) on a flexible circuit board; and

heat-treating the resulting structure.

13. The electric circuit board according to claim 12, wherein said protective insulating layer(s) has(have) a modulus of elasticity of not more than 1000 N/mm².