Abrupt Metal-Insulator Transition Wafer, and Heat Treatment Apparatus and Method For the Wafer
First Claim
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1. A wafer with the characteristics of abrupt metal-insulator transition (MIT), the wafer comprising:
- a substrate with the characteristics of abrupt MIT; and
a metal layer formed by coating or depositing a paste with good electrical and thermal conductivity on the substrate.
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Abstract
Provided are a wafer with the characteristics of abrupt metal-insulator transition (MIT), and a heat treatment apparatus and method that make it possible to mass-produce a large-diameter wafer without directly attaching the wafer to a heater or a substrate holder. The heat treatment apparatus includes a heater applying heat to a wafer having the characteristics of abrupt MIT and one surface covered with a thermally opaque film, and a plurality of fixing units formed along an edge portion of a top surface of the heater to fix the wafer to the heater.
8 Citations
18 Claims
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1. A wafer with the characteristics of abrupt metal-insulator transition (MIT), the wafer comprising:
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a substrate with the characteristics of abrupt MIT; and a metal layer formed by coating or depositing a paste with good electrical and thermal conductivity on the substrate. - View Dependent Claims (2)
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3. A heat treatment apparatus comprising:
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a heater applying heat to a wafer having the characteristics of abrupt MIT and one surface covered with a thermally opaque film; and a plurality of fixing units formed along an edge portion of a top surface of the heater to fix the wafer to the heater. - View Dependent Claims (4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A heat treatment method comprising:
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preparing a substrate with the characteristics of abrupt MIT; covering a first surface of the substrate with a thermally opaque film to form a wafer; fixing the wafer to the heater with a plurality of fixing units in such a way that the thermally opaque film is exposed; and applying heat to the wafer. - View Dependent Claims (15, 16, 17, 18)
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Specification