SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES HAVING UPPER PATTERN ALIGNED WITH LOWER PATTERN MOLDED BY SEMICONDUCTOR SUBSTRATE AND METHODS OF FORMING THE SAME
First Claim
1. A semiconductor integrated circuit device comprising:
- a semiconductor substrate having an active region;
an upper pattern disposed in a predetermined region of the semiconductor substrate, the upper pattern protruding upward from a top surface of the active region and extending downward from the top surface of the active region; and
a lower pattern including a buried plug and a buried capping pattern disposed on the buried plug, the buried plug disposed below the top surface of the active region and contacting the upper pattern through the predetermined region of the semiconductor substrate, and the buried capping pattern protruding from the top surface of the active region and surrounding the upper pattern,wherein the upper pattern has different widths on the buried plug.
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Abstract
Provided are semiconductor integrated circuit (IC) devices having an upper pattern aligned with a lower pattern molded by a semiconductor substrate and methods of forming the same. In the semiconductor IC devices, the lower pattern contacts the upper pattern using an active region and/or an isolation layer. The methods include preparing a semiconductor substrate having an active region. A lower pattern is formed on the active region. The lower pattern is surrounded by the active region and protrudes from a top surface of the active region. An upper pattern is disposed on the lower pattern. The upper pattern contacts the lower pattern.
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Citations
36 Claims
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1. A semiconductor integrated circuit device comprising:
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a semiconductor substrate having an active region; an upper pattern disposed in a predetermined region of the semiconductor substrate, the upper pattern protruding upward from a top surface of the active region and extending downward from the top surface of the active region; and a lower pattern including a buried plug and a buried capping pattern disposed on the buried plug, the buried plug disposed below the top surface of the active region and contacting the upper pattern through the predetermined region of the semiconductor substrate, and the buried capping pattern protruding from the top surface of the active region and surrounding the upper pattern, wherein the upper pattern has different widths on the buried plug. - View Dependent Claims (2, 3, 4)
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5. A semiconductor integrated circuit device comprising:
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a semiconductor substrate having an isolation layer; an upper pattern disposed in a predetermined region of the semiconductor substrate, the upper pattern protruding upward from a top surface of the isolation layer and extending downward from the top surface of the isolation layer; and a lower pattern including a buried plug and a buried capping pattern disposed on the buried plug, the buried plug disposed below the top surface of the isolation layer to be surrounded by the upper pattern through the predetermined region of the semiconductor substrate to contact the upper pattern, and the buried capping pattern protruding from the top surface of the isolation layer and surrounding the upper pattern, wherein the upper pattern has the same width on the buried plug. - View Dependent Claims (6, 7)
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8. A semiconductor integrated circuit device comprising:
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a semiconductor substrate having an active region and an isolation layer surrounding the active region; first and second upper patterns disposed in predetermined regions of the semiconductor substrate, the first upper pattern protruding upward from a top surface of the active region and extending downward from the top surface of the active region, the second upper pattern protruding upward from a top surface of the isolation layer and extending downward from the top surface of the isolation layer; a first lower pattern including a first buried plug and a first buried capping pattern disposed on the first buried plug, the first buried plug disposed below the top surface of the active region and contacting the first upper pattern through one of the predetermined regions of the semiconductor substrate, and the first buried capping pattern protruding from the top surface of the active region and surrounding the first upper pattern; and a second lower pattern including a second buried plug and a second buried capping pattern disposed on the second buried plug, the second buried plug disposed below the top surface of the isolation layer to be surrounded by the second upper pattern through another one of the predetermined regions of the semiconductor substrate to contact the second upper pattern, and the second buried capping pattern protruding from the top surface of the isolation layer and surrounding the second upper pattern, wherein the first upper pattern has different widths on the first buried plug, and wherein the second upper pattern has the same width on the second buried plug. - View Dependent Claims (9, 10, 11, 12)
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13. A method of forming a semiconductor integrated circuit device, comprising:
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preparing a semiconductor substrate having an active region; forming a trench in the active region; forming a lower pattern in the trench, the lower pattern having a buried plug and a buried capping pattern stacked sequentially, the buried capping pattern protruding from a top surface of the active region defining the trench; forming an interlayer insulating layer on the active region to cover the lower pattern; forming a connection hole in the interlayer insulating layer, the connection hole exposing the buried plug and a portion of the active region adjacent to the buried plug; and forming an upper pattern filling the connection hole. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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21. A method of forming a semiconductor integrated circuit device, comprising:
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preparing a semiconductor substrate having an isolation layer; forming a trench in the isolation layer; forming a lower pattern in the trench, the lower pattern having a buried plug and a buried capping pattern stacked sequentially, the buried capping pattern protruding from a top surface of the isolation layer defining the trench; forming an interlayer insulating layer on the isolation layer to cover the lower pattern; forming a connection hole in the interlayer insulating layer, the connection hole exposing the buried plug and a portion of the isolation layer adjacent to the buried plug and under the buried plug; and forming an upper pattern filling the connection hole. - View Dependent Claims (22, 23, 24, 25, 26, 27)
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28. A method of forming a semiconductor integrated circuit device, comprising:
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preparing a semiconductor substrate having an active region and an isolation layer surrounding the active region; forming first and second trenches in the active region and the isolation layer, respectively; forming first and second lower patterns in the first and second trenches, respectively, the first lower pattern having a first buried plug and a first buried capping pattern stacked sequentially, the second lower pattern having a second buried plug and a second buried capping pattern stacked sequentially, the first and second buried capping patterns protruding from top surfaces of the active region and the isolation layer, respectively; forming an interlayer insulating layer on the active region and the isolation layer to cover the first and second lower patterns; forming first and second connection holes in the interlayer insulating layer, the first connection hole exposing the first buried plug and a portion of the active region adjacent to the first buried plug, the second connection hole exposing the second buried plug and a portion of the isolation layer adjacent to the second buried plug and under the second buried plug; and forming first and second upper patterns filling the first and second connection holes, respectively. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36)
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Specification