Wired circuit board
First Claim
Patent Images
1. A wired circuit board comprising:
- a metal supporting board;
a metal foil formed on the metal supporting board;
a first insulating layer formed on the metal supporting board so as to cover the metal foil; and
a conductive pattern formed on the first insulating layer and having a plurality of wires,wherein the metal foil is arranged along a lengthwise direction of each of the wires so as not to be opposed to part of the wires in a thickness direction and so as to be opposed to a remainder of the wires in the thickness direction.
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Accused Products
Abstract
The wired circuit board includes a metal supporting board, a metal foil formed on the metal supporting board, a first insulating layer formed on the metal supporting board so as to cover the metal foil, and a conductive pattern formed on the first insulating layer and having a plurality of wires. The metal foil is arranged along a lengthwise direction of each of the wires so as not to be opposed to part of the wires in a thickness direction and so as to be opposed to a remainder of the wires in the thickness direction.
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Citations
7 Claims
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1. A wired circuit board comprising:
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a metal supporting board; a metal foil formed on the metal supporting board; a first insulating layer formed on the metal supporting board so as to cover the metal foil; and a conductive pattern formed on the first insulating layer and having a plurality of wires, wherein the metal foil is arranged along a lengthwise direction of each of the wires so as not to be opposed to part of the wires in a thickness direction and so as to be opposed to a remainder of the wires in the thickness direction. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification