Wired circuit board

• US 20080278858A1
• Filed: 05/09/2008
• Published: 11/13/2008
• Est. Priority Date: 05/10/2007
• Status: Active Grant

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Yokai, Takahiko, Ishii, Jun
• Granted Patent: US 8,760,815 B2
• Time in Patent Office: Days
• US Class Current: 360/245.9
• CPC Class Codes: G11B 5/484 Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit
• CPC Class Codes: G11B 5/486 with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
• CPC Class Codes: H05K 1/0253 Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings H05K1/0251 takes precedence
• CPC Class Codes: H05K 1/0278 Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/09081 Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
• CPC Class Codes: H05K 2201/093 Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein reduction of cross-talk, noise or interference by patterned shielding planes, ground planes or power planes H05K1/0224
• CPC Class Codes: H05K 2201/09318 Core having one signal plane and one power plane
• CPC Class Codes: H05K 2201/09663 Divided layout, i.e. conductors divided in two or more parts branched layout H05K2201/09254
• CPC Class Codes: H05K 2201/0969 Apertured conductors
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602

Abstract

The wired circuit board includes a metal supporting board, a metal foil formed on the metal supporting board, a first insulating layer formed on the metal supporting board so as to cover the metal foil, and a conductive pattern formed on the first insulating layer and having a plurality of wires. The metal foil is arranged along a lengthwise direction of each of the wires so as not to be opposed to part of the wires in a thickness direction and so as to be opposed to a remainder of the wires in the thickness direction.

Claims

1. A wired circuit board comprising:

a metal supporting board;

a metal foil formed on the metal supporting board;

a first insulating layer formed on the metal supporting board so as to cover the metal foil; and

a conductive pattern formed on the first insulating layer and having a plurality of wires,

wherein the metal foil is arranged along a lengthwise direction of each of the wires so as not to be opposed to part of the wires in a thickness direction and so as to be opposed to a remainder of the wires in the thickness direction.

2. The wired circuit board according to claim 1, wherein the metal supporting board is formed with an opening opposed to the part of the wires in the thickness direction.

3. The wired circuit board according to claim 1, wherein the wired circuit board is a suspension board with circuit.

4. The wired circuit board according to claim 3,

wherein the metal supporting board is formed with an opening having a generally U-shape in plane view opposed to the part of the wires in the thickness direction, and

comprises a tongue portion sandwiched by the opening and for mounting a magnetic head, and an outrigger portion arranged on the outer side of the opening.

5. The wired circuit board according to claim 1, wherein the metal foil opposed to the wires has an area of 70% or more per 100% of the area of the wires.

6. The wired circuit board according to claim 1, further comprising a first metal thin film interposed between the metal foil and the metal supporting board.

7. The wired circuit board according to claim 6, further comprising a second insulating layer interposed between the first metal thin film and the metal supporting board.