Mounting Assembly for Optoelectronic Devices

• US 20080278954A1
• Filed: 04/05/2006
• Published: 11/13/2008
• Est. Priority Date: 04/05/2005
• Status: Abandoned Application

• Current Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: TIR Systems Limited (Koninklijke Philips N.V.)
• Inventors: Speier, Ingo
• Application Number:
  US10/597,493
• Publication Number:
  US 20080278954A1
• Time in Patent Office: Days
• US Class Current: 362/373
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/52 electrically powered, e.g. refrigeration systems
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/8121 using a reflow oven
• CPC Class Codes: H01L 2224/81815 Reflow soldering
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 2224/90 Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 24/90 Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0665 Epoxy resin
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/182 : associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/09072 : Hole or recess under component or special relationship between hole and component
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10477 : Inverted

Abstract

The present invention provides a mounting assembly for one or more light-emitting elements, wherein the mounting assembly is configured such that the one or more light-emitting elements are inferiorly connected to a carrier. The carrier comprises one or more light transmission regions, wherein each of the one or more light-emitting elements is aligned with a light transmission region enabling light to pass through the carrier. The inferior mounting of the light-emitting elements can provide ease of thermal access to a cooling interface associated with the one or more light-emitting elements by a thermal management system.

Claims

1. A light-emitting apparatus connectible to a thermal management system, the apparatus comprising:

a) a carrier including one or more light transmission regions; and

b) one or more light-emitting elements for generating light, each of the one or more light-emitting elements mounted on a substrate having a cooling interface, the substrate being inferiorly mounted onto the carrier in order that each of the one or more light-emitting elements are proximate to one of the one or more light transmission regions, wherein the cooling interface is directed away from the carrier and is adapted for connection to a thermal management system;

wherein the one or more light-emitting elements are adapted for connection to a source of power for activation thereof.

2. The light-emitting apparatus according to claim 1, wherein each of the one or more light transmission regions are defined by either an opening within the carrier or transparent portion of the carrier.

3. The light-emitting apparatus according to claim 1, wherein the substrate comprises circuit traces electrically coupled to the one or more light-emitting elements or the substrate comprises multiple electrically conductive planes electrically coupled to the one or more light-emitting elements.

4. The light-emitting apparatus according to claim 1, wherein the substrate comprises contact pads providing electrical and mechanical connection to the carrier.

5. The light-emitting apparatus according to claim 1, wherein the carrier comprises indexing features for aligning the substrate with the carrier.

6. The light-emitting apparatus according to claim 1, wherein one or more optics are mounted onto the substrate and optically coupled to the one or more light-emitting elements.

7. The light-emitting apparatus according to claim 1, wherein each of the one or more light transmission regions are defined by an opening within the carrier and wherein one or more light-emitting elements are configured to be inserted into one or more of the openings.

8. The light-emitting apparatus according to claim 1, wherein the carrier is fabricated from a thermally conductive material.

9. The light-emitting apparatus according to claim 1, wherein the carrier is fabricated from FR4 board.

10. The light-emitting apparatus according to claim 1, wherein the carrier mates with an insert and said insert is configured to provide extraction of the light and shaping the light into a beam.

11. The light-emitting apparatus according to claim 1, wherein the carrier is fabricated from a transparent material.

12. The light-emitting apparatus according to claim 1, wherein one or more of the light transmission regions is configured as a transparent optical element, wherein the transparent optical element is selected from the group comprising a dome lens, Fresnel lens, lenticular lens array and diffuser.

13. A light-emitting apparatus connectible to a thermal management system, the apparatus comprising:

a) a carrier including one or more light transmission regions; and

b) one or more light-emitting elements for generating light, each of the one or more light-emitting elements having a cooling interface, said light-emitting elements being directly inferiorly mounted onto the carrier in order that each of the one or more light-emitting elements are proximate to one of the one or more light transmission regions, wherein each cooling interface is directed away from the carrier and each cooling interface is adapted for connection to a thermal management system;

wherein the one or more light-emitting elements are adapted for connection to a source of power for activation thereof.

14. The light-emitting apparatus according to claim 13, wherein each of the one or more light transmission regions are defined by either an opening within the carrier or transparent portion of the carrier.

15. The light-emitting apparatus according to claim 13, wherein the carrier comprises indexing features for aligning the one or more light-emitting elements with the carrier.

16. The light-emitting apparatus according to claim 13, wherein each of the one or more light transmission regions are defined by an opening within the carrier and wherein one or more light-emitting elements are configured to be inserted into one or more of the openings.

17. The light-emitting apparatus according to claim 13, wherein the carrier is fabricated from a thermally conductive material.

18. The light-emitting apparatus according to claim 13, wherein the carrier is fabricated from FR4 board.

19. The light-emitting apparatus according to claim 13, wherein the carrier mates with an insert and said insert is configured to provide extraction of the light and shaping the light into a beam.

20. The light-emitting apparatus according to claim 13, wherein the carrier is fabricated from a transparent material.

21. The light-emitting apparatus according to claim 13, wherein one or more of the light transmission regions is configured as a transparent optical element, wherein the transparent optical element is selected from the group comprising a dome lens, Fresnel lens, lenticular lens array and diffuser.

22. A method for forming a light-emitting apparatus connectible to a thermal management system, the method comprising the steps of:

a) providing a carrier having one or more light transmission regions;

b) aligning one or more light-emitting elements with one of the light transmission regions, each of the one or more light-emitting elements having a cooling interface;

c) inferiorly coupling the one or more light-emitting elements to the carrier;

thereby forming the light-emitting apparatus.