MEMS STRUCTURES, METHODS OF FABRICATING MEMS COMPONENTS ON SEPARATE SUBSTRATES AND ASSEMBLY OF SAME

• US 20080279498A1
• Filed: 09/27/2007
• Published: 11/13/2008
• Est. Priority Date: 05/11/2007
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm, Inc.
• Inventors: Sampsell, Jeffrey Brian, Floyd, Philip Don, Gally, Brian James
• Granted Patent: US 7,719,752 B2
• Time in Patent Office: Days
• US Class Current: 385/8
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 2207/092 Buried interconnects in the substrate or in the lid
• CPC Class Codes: B81B 3/007 For controlling stiffness, e.g. ribs
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: G02B 5/284 of etalon type comprising a resonant cavity other than a thin solid film, e.g. gas, air, solid plates etalons for fibre optic multiplexing G02B6/29358; etalons for spectral measurement G01J3/26
• CPC Class Codes: H01L 31/04 adapted as photovoltaic [PV] conversion devices testing thereof during manufacture H01L22/00; testing thereof after manufacture H02S50/10
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

Methods of fabricating a microelectromechanical systems (MEMS) device with reduced masking and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. In some embodiments in which the MEMS device serves as an interferometric modulator, the front substrate is also provided with black masks to prevent or mitigate bright areas in the actuated state of the MEMS device. Static interferometric modulators can also be formed by shaping or preformation and lamination. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.

Claims

1. A method of making a MEMS device, the method comprising:

providing a transparent electrode assembly comprising a transparent substrate and an at least partially transparent electrode formed over the transparent substrate;

providing a carrier comprising a reflective electrode formed thereover; and

attaching the transparent electrode assembly to the carrier such that the reflective electrode faces the at least partially transparent electrode to form a cavity.

2. The method of claim 1, wherein the MEMS device is an interferometric modulator, and wherein the cavity is configured to interferometrically modulate light.

3. The method of claim 1, wherein the at least partially transparent electrode and the reflective electrode are configured to be capable of relative movement to define a cavity of variable size.

4. The method of claim 1, wherein the reflective electrode is deflectable into the cavity.

19. The device of claim 1, further comprising a second substrate opposing the front substrate, the second substrate comprising a plurality of rails, each of the rails having a surface facing the cavities of the front substrate, the rails extending substantially parallel to one another, wherein each of the plurality of movable electrodes is interposed between the front substrate and one of the rails.

5. A method of making an interferometric device array, the method comprising:

providing a front substrate comprising supports defining cavities on the front substrate, the front substrate further comprising front electrodes formed in the cavities;

providing a carrier comprising movable electrodes formed thereover; and

attaching the front substrate to the carrier such that the movable electrodes face at least a portion of the front electrodes to form one or more interferometric devices.

6. The method of claim 5, wherein the front electrodes and movable electrodes are spaced apart to form an interferometric cavity.

7. The method of claim 5, wherein the front substrate is formed of a substantially transparent material.

8. The method of claim 5, wherein the front electrodes comprise at least one layer formed of an at least partially transparent material.

9. The method of claim 5, wherein each of the front electrodes serves as a stationary electrode for an interferometric device.

10. The method of claim 5, wherein the front substrate is attached to the carrier such that the supports separate the movable electrodes from the front electrodes.

11. A microelectromechanical system (MEMS) device comprising:

a front substrate comprising a plurality of supports defining cavities on the front substrate; and

a plurality of movable electrodes supported by the supports, each of the movable electrodes comprising;

first portions overlying the supports, the first portions having a first thickness; and

second portions neighboring first portions, the second portions not overlying the supports, the second portions having a second thickness, wherein the second thickness is greater than the first thickness.

12. The MEMS device of claim 11, wherein the supports are integrally formed with and of the same material as the front substrate.

13. The MEMS device of claim 11, wherein the supports are formed of a material different from that of the front substrate.

14. The MEMS device of claim 11, wherein the MEMS device comprises interferometric modulators, and wherein the front substrate is formed of a substantially transparent material.

15. The MEMS device of claim 14, further comprising a first plurality of optical stacks formed in the cavities;

and a second plurality of optical stacks interposed between the supports and the first portions of the movable electrodes.

16. The device of claim 15, wherein the first plurality of optical stacks have substantially the same thickness as that of the second plurality of optical stacks.

17. The MEMS device of claim 11, wherein the movable electrodes comprise conductive strips extending parallel to one another, each of the conductive strips being configured to serve as electrodes for multiple interferometric modulators.

18. The device of claim 11, wherein the plurality of supports comprise rails extending laterally in a direction substantially perpendicular to the movable electrodes.

20. The device of claim 11, wherein the first portions of each of the movable electrodes are bonded to the supports of the front substrate.

21. An array of microelectromechanical systems (MEMS) devices, comprising:

a front substrate comprising a plurality of supports defining cavities on the front substrate, each of the cavities having a bottom surface;

a backplate substantially opposing and overlying the front substrate, the backplate having a surface facing the cavities of the front substrate, the surface being most removed from the front substrate; and

a plurality of mechanical strips interposed between the supports and the surface of the backplate, each of the mechanical strips serving as moving electrodes for multiple MEMS devices,

wherein a distance between the bottom surface of one of the cavities and the most removed surface of the backplate is between about 6,500 Å and

about 20 μ

m.

22. The array of claim 21, wherein the backplate is substantially planar.

23. The array of claim 21, wherein the backplate includes recesses formed into the backplate, the recesses including recess surfaces facing the cavities of the front substrate, the most removed surface being one of the recess surfaces, and wherein the backplate further includes a plurality of back supports extending from the backplate toward the front substrate, the back supports defining the recesses therebetween.

24. The array of claim 23, wherein the plurality of back supports comprise rails extending substantially parallel to one another, the rails defining a plurality of recesses, wherein the device further comprises an excess mechanical material within the plurality of recesses.

25. The array of claim 21, wherein the MEMS devices comprise interferometric modulators.

26. A microelectromechanical system (MEMS) device, comprising:

a substrate comprising a plurality of supports integrally formed with and of the same material as the substrate; and

a plurality of mechanical elements defining moving electrodes, the mechanical elements being supported on top of the supports.

27. The MEMS device of claim 26, wherein the plurality of supports comprise a plurality of rails extending substantially parallel to one another, the rails defining troughs alternating with the rails.

28. The MEMS device of claim 27, wherein the mechanical elements comprise a plurality of mechanical strips extending substantially perpendicular to the troughs, and wherein the troughs and the mechanical strips together define cavities at intersections between the troughs and the mechanical strips.

29. The MEMS device of claim 28, wherein the plurality of supports further comprise posts in each cavity.

30. The MEMS device of claim 27, wherein the MEMS device comprises an interferometric modulator, and wherein the MEMS device further comprises an optical stack in at least one of the troughs.

31. The MEMS device of claim 27, wherein the mechanical elements comprise a plurality of mechanical strips crossing the troughs, each strip comprising a plurality of moving electrodes.

32. A microelectromechanical system (MEMS) device comprising:

a substrate having a surface, the substrate including a plurality of troughs formed into the surface, the troughs extending substantially parallel to one another, wherein the surface of the substrate defines a higher region of the substrate whereas the troughs defines lower regions of the substrate; and

a plurality of fixed electrodes formed on the lower regions of the substrate.

33. The MEMS device of claim 32, wherein the troughs are of different depths.

34. The MEMS device of claim 33, wherein the MEMS device comprises an interferometric modulator display device, and wherein the troughs of different depths are configured to generate different colors.

35. The MEMS device of claim 32, further comprising a layer on the higher region of the substrate, the layer being formed of the same material as that of the fixed electrodes.

36. The MEMS device of claim 35, wherein the fixed electrodes are discontinuous with the layer.

37. The MEMS device of claim 32, further comprising movable electrodes supported on the higher region of the substrate, the movable electrodes being collapsible into the troughs.

38. A front substrate for a microelectromechanical system (MEMS), comprising:

a substrate comprising a plurality of supports defining a plurality of cavities on the substrate, the supports being integrally formed with and of the same material as the substrate; and

a conductive layer formed in the cavities between the supports.

39. The front substrate of claim 38, wherein the supports define the plurality of cavities to have different depths.

40. A method of making an interferometric modulator, the method comprising:

forming a plurality of supports from a substrate, the supports being integrally formed with and of the same material as the substrate; and

forming a plurality of mechanical elements defining moving electrodes such that the mechanical elements are supported on the supports.

41. The method of claim 40, wherein each of the plurality of mechanical elements comprises a bilayer including a reflective layer and a deformable layer.

42. The method of claim 40, wherein each of the plurality of mechanical elements comprises a reflective layer and deformable layer, the reflective layer being suspended from the deformable layer.

43. The method of claim 40, wherein forming the plurality of supports comprises embossing the substrate.

44. The method of claim 40, wherein forming the plurality of supports comprises etching the substrate.

45. The method of claim 40, wherein the substrate is formed of glass, and wherein forming the plurality of supports comprises:

inscribing the substrate to define inscribed portions; and

selectively etching the inscribed portions of the substrate.

46. A method of making a microelectromechanical system (MEMS), the method comprising:

providing a planar substrate; and

forming support structures integral with the substrate to define heights of MEMS cavities, wherein the MEMS cavities have floors, and wherein the MEMS cavities are configured to accommodate motion of moving electrodes therein; and

forming a conductive layer on the floors of the cavities.

47. The method of claim 46, further comprising depositing electrically conductive material on top surfaces of the support structures and on a cavity floor between the support structures such that the material is discontinuous between the support structures and the floor.

48. The method of claim 46, wherein forming the support structures comprises embossing the substrate.

49. The method of claim 46, wherein forming the support structures comprises etching the substrate.

50. The method of claim 46, wherein the substrate is formed of glass, and wherein forming the support structures comprises:

inscribing the substrate to define inscribed portions; and

selectively etching the inscribed portions of the substrate.

51. A microelectromechanical system (MEMS) device, comprising:

a front substrate comprising a plurality of electrodes formed over the front substrate;

a carrier substantially opposing the front substrate such that the electrodes are interposed between the carrier and the front substrate, the carrier comprising a plurality of rails extending from the carrier; and

a plurality of movable electrodes interposed between the front substrate and the rails of the carrier.

52. The device of claim 51, wherein the MEMS device comprises an interferometric modulator, and wherein the plurality of electrodes are formed of at least partially transparent material.

53. The device of claim 51, wherein the plurality of moveable electrodes extend parallel to one another, and are aligned with the rails of the carrier.

54. The device of claim 51, wherein the rails of the carrier are integrally formed with and of the same material as the carrier.

55. The device of claim 51, wherein the rails of the carrier are formed of a material different from that of the carrier.

56. The device of claim 51, wherein the front substrate further comprises a plurality of supports that are formed of a material different from that of the front substrate.

57. The device of claim 51, wherein the front substrate further comprises a plurality of supports that are integrally formed with and of the same material as the front substrate.

58. The device of claim 51, wherein the carrier serves as a permanent backplate for the MEMS device.

59. The device of claim 51, wherein the carrier serves as a temporary carrier which is removable from the front substrate.

60. The device of claim 59, wherein the temporary carrier is removable by ashing or peeling.

61. The device of claim 51, wherein the carrier is formed of a polymeric material.

62. The device of claim 51, wherein the carrier further comprises a release film formed on the carrier.

63. The device of claim 62, wherein the carrier is formed of a porous material.

64. The device of claim 51, wherein the rails define troughs alternating with the rails, and wherein the front substrate further comprises a second support extending from one of the plurality of supports into an opposing one of the troughs.

65. The device of claim 64, wherein the carrier further comprises an excess movable electrode material within the one of the troughs, the excess movable electrode material being the same as that of the movable electrodes, and wherein the second support contacts the excess movable electrode material.

66. The device of claim 51, wherein the rails have rail surfaces facing the front substrate, wherein the carrier further comprises trenches formed into the rail surfaces, and wherein the carrier further comprises posts in the trenches, the posts extending toward the front substrate.

67. A carrier for attaching to a microelectromechanical system (MEMS) front substrate with a stationary electrode formed thereover, the carrier comprising:

a substrate including a plurality of rails, the rails defining troughs alternating with the rails; and

an electrode layer comprising first portions formed over the rails and second portions formed within the troughs, the electrode layer being discontinuous between the troughs and the rails.

68. The carrier of claim 67, wherein the first portions of the electrode layer formed over the rails are configured to be movable toward the stationary electrode upon assembled with the MEMS front substrate.

69. The carrier of claim 67, further comprising a release layer interposed between the electrode layer and the rails, wherein the release layer covers substantially the entire portion of the substrate surface.

70. The carrier of claim 69, wherein the substrate is formed of a porous material.

71. The carrier of claim 67, further comprising a sacrificial layer interposed between the electrode layer and the rails, wherein the sacrificial layer is discontinuous between the rails.

72. The carrier of claim 67, wherein the rails are integrally formed with and of the same material as the substrate.

73. A method of making a microelectromechanical system (MEMS) array comprising a front substrate having a first surface, the front substrate comprising a plurality of fixed lower electrodes formed over the first surface, the method comprising:

shaping a carrier substrate so as to have mesas integrally formed from the carrier substrate, the mesas defining troughs alternating with the mesas; and

depositing a mechanical layer over the mesas and within the troughs of the carrier substrate, the mechanical layer being discontinuous between the troughs and the mesas.

74. The method of claim 73, further comprising attaching the carrier substrate to the front substrate such that the mesas face the first surface of the front substrate.

75. The method of claim 74, further comprising removing the carrier from the front substrate after attaching the carrier substrate to the front substrate, wherein removing the carrier comprises leaving the mechanical layer over the front substrate while removing the carrier.

76. A microelectromechanical system (MEMS) device, comprising:

a front substrate comprising a first support extending from the front substrate;

a backplate having a surface substantially opposing the front substrate such that the first support is interposed between the front substrate and the surface of the backplate;

a moving electrode interposed between the front substrate and backplate, the moving electrode comprising a portion supported on the first support; and

a second support extending from one of the first support of the front substrate and the surface of the backplate, wherein the second support is positioned between the first support of the front substrate and the surface of the backplate.

77. The device of claim 76, wherein the first support comprises at least one of a post and a rail.

78. The device of claim 76, wherein the second support comprises a post.

79. The device of claim 76, wherein the portion of the moving electrode is interposed between the first support and the second support.

80. The device of claim 76, wherein the portion of the moving electrode comprises an opening and wherein the second support extends through the opening of the portion of the moving electrode.

81. The device of claim 76, wherein the second support is laterally spaced apart from the portion of the moving electrode.

82. The device of claim 76, wherein the MEMS device comprises an interferometric modulator.

83. A microelectromechanical system (MEMS) device, comprising:

a front substrate having a first surface, the front substrate comprising an optical stack formed over the first surface;

a backplate opposing the front substrate, the backplate having a second surface facing the first surface, the backplate comprising posts extending from the second surface toward the first surface such that the height of the posts defines a distance between the first surface and the second surface; and

a plurality of movable electrode strips extending substantially parallel to one another, the strips being interposed between the first surface and the second surface.

84. The device of claim 83, wherein the first surface of the front substrate includes an array region within which the movable electrode strips are positioned, and wherein the front substrate includes no post on the array region of the first surface.

85. A microelectromechanical system (MEMS) device, comprising:

a front substrate;

a backplate opposing the front substrate, the backplate having a surface facing the front substrate;

a plurality of movable electrode strips extending substantially parallel to one another, the strips being interposed between the front substrate and the backplate, portions of the strips being movable toward the front substrate; and

a plurality of posts extending from the surface of the backplate such that the posts are arranged to limit movement of the portions of the strips toward the surface.

86. The device of claim 85, wherein the plurality of movable electrode strips are suspended from the plurality of posts.

87. A method of making microelectromechanical system (MEMS) device, the method comprising:

providing a front substrate comprising a first support extending from the front substrate;

providing a backplate having a surface;

attaching the front substrate to the backplate such that the first support is interposed between the front substrate and the surface of the backplate; and

forming a second support between the first support of the front substrate and the surface of the backplate such that the second support extends from one of the first support of the front substrate and the surface of the backplate.

88. The method of claim 87, wherein the first support comprises at least one of a post and a rail.

89. The method of claim 87, wherein the second support comprises a post.

90. The method of claim 87, further comprising providing a moving electrode between the front substrate and the backplate such that a portion of the moving electrode is supported on the first support.

91. The method of claim 90, wherein forming the second support comprises forming the second support such that the portion of the moving electrode is interposed between the first support and the second support.

92. The method of claim 90, wherein forming the second support comprises forming the second support such that the second support penetrates the portion of the moving electrode.

93. The method of claim 90, wherein forming the second support comprises forming the second support such that the second support is laterally spaced apart from the portion of the moving electrode.

94. The method of claim 87, wherein forming the second support comprises forming the second support on the first support of the front substrate before attaching the front substrate to the backplate.

95. The method of claim 87, wherein forming the second support comprises forming the second support before attaching the front substrate to the backplate such that the second support is integrally formed with and of the same material as the first support.

96. The method of claim 87, wherein forming the second support comprises forming the second support on the surface of the backplate before attaching the front substrate to the backplate.

97. The method of claim 87, wherein forming the second support comprises forming the second support before attaching the front substrate to the backplate such that the second support is integrally formed with and of the same material as the backplate.

98. A microelectromechanical system (MEMS) device comprising:

a front substrate having a first surface, the front substrate including an array region and a peripheral region on the first surface;

a backplate having a second surface facing the first surface, the first and second surfaces having a gap therebetween, the backplate including an array region and a peripheral region on the second surface;

a conductive line extending on the peripheral region of the front substrate; and

a conductive structure extending between the peripheral regions of the front substrate and the backplate, the conductive structure contacting the conductive line.

99. The device of claim 98, wherein the conductive structure is positioned on top of the conductive line.

100. The device of claim 98, wherein the conductive structure penetrates through the conductive line.

101. A carrier assembly for making an interferometric modulator including a front substrate comprising substantially transparent electrodes formed thereon, the carrier assembly comprising:

a releasable structure having a surface; and

a plurality of elongated conductive strips formed over the surface, the elongated conductive strips extending in a direction substantially parallel to one another.

102. The carrier assembly of claim 101, wherein the releasable structure comprises a substrate.

103. The carrier assembly of claim 101, wherein the releasable structure comprises a film.

104. The carrier assembly of claim 101, wherein each of the elongated conductive strips has a length and a width, and wherein a ratio of the length to the width is between about 10:

1 to about 1,000,000;

1.

105. The carrier assembly of claim 101, wherein the conductive strips define electrodes for multiple interferometric modulators.

106. The carrier assembly of claim 101, wherein the releasable structure is formed of molybdenum.

107. The carrier assembly of claim 101, further comprising a substrate that supports the releasable structure such that the releasable structure is interposed between the substrate and the plurality of conductive strips.

108. The carrier assembly of claim 107, wherein the releasable structure is a release layer formed on substantially the entire portion of the substrate.

109. The carrier assembly of claim 107 wherein the substrate comprises through-holes.

110. The carrier assembly of claim 107, wherein the substrate is formed of a porous material.

111. The carrier assembly of claim 107, wherein the substrate is formed of a material which is removable by one of etching, ashing, and physically peeling from the front substrate without damaging the front substrate.

112. The carrier assembly of claim 107, wherein the substrate further comprises at least one post formed on a surface of the substrate, the post supporting the conductive strips, and wherein the at least one post is integrally formed with and of the same material as the substrate.

113. The carrier assembly of claim 112, wherein the releasable structure is a sacrificial layer which laterally surrounds the at least one post, the sacrificial layer partially supporting the conductive strips.

114. An interferometric modulator comprising:

a carrier assembly comprising;

a releasable structure having a surface, and

a plurality of elongated conductive strips formed over the surface, the elongated conductive strips extending in a direction substantially parallel to one another; and

a front substrate comprising a plurality of supports and substantially transparent electrodes, the front substrate being attached to the carrier assembly such that the conductive strips are supported by the supports.

115. A method of making an interferometric modulator comprising a front substrate comprising a plurality of supports defining cavities on the front substrate, the front substrate further comprising lower electrodes formed in the cavities, the method comprising:

providing a releasable structure having a surface;

depositing a movable electrode material over the surface;

providing a mask over the movable electrode material so as to selectively expose portions of the movable electrode material;

selectively etching the movable electrode material using the mask, thereby forming a plurality of movable electrode strips, the movable electrode strips extending in a direction substantially parallel to one another; and

positioning the releasable structure over the front substrate such that the movable electrode strips face the cavities of the front substrate.

116. The method of claim 115, wherein the releasable structure comprises a substrate.

117. The method of claim 115, wherein the releasable structure includes a substantially planar surface, and wherein the movable electrode material is deposited on the substantially planar surface.

118. The method of claim 115, further comprising removing the releasable structure after positioning the releasable structure.

119. The method of claim 118, wherein the releasable structure is formed of molybdenum.

120. The method of claim 118, wherein removing the releasable structure comprises at least one of ashing, etching, and physically peeling the releasable layer.

121. The method of claim 118, wherein the releasable structure is formed of a polymeric material.

122. The method of claim 115, further comprising providing a substrate prior to providing the releasable structure, wherein providing the releasable structure comprises forming the releasable structure on the substrate.

123. The method of claim 122, further comprising forming a post over the substrate before providing the releasable structure,

wherein providing the releasable structure comprises forming a releasable layer such that the releasable layer laterally surrounds the post and such that the post and releasable layer together form a substantially planar surface, and

wherein the movable electrode material is deposited on the substantially planar surface.

124. The method of claim 122, wherein the substrate is formed of a porous material, and wherein the method further comprises providing an etchant through the substrate, thereby removing the releasable structure after positioning the releasable structure.

125. The method of claim 122, wherein the substrate comprises through-holes, and wherein the method further comprises providing an etchant through the through-holes of the substrate, thereby removing the releasable structure after positioning the releasable structure.

126. A microelectromechanical system (MEMS) device, comprising:

a front substrate comprising an array region and a peripheral region, the front substrate comprising a plurality of supports defining a plurality of lower regions therebetween in the array region, the front substrate further comprising a land in the peripheral region, at least a portion of the land having substantially the same height as the supports in the array region;

a plurality of conductors formed over the land in the peripheral region, the conductors being electrically isolated from one another; and

a conductive layer formed on the lower regions of the front substrate.

127. The device of claim 126, wherein the conductors comprise at least one of routing traces and movable electrode strips.

128. The device of claim 126, wherein the plurality of supports are formed of a material different from that of the front substrate, and wherein the land is formed of a material different from that of the front substrate.

129. The device of claim 126, wherein the plurality of supports are integrally formed with and of the same material as the front substrate, and wherein the land is integrally formed with and of the same material as the front substrate.

130. The device of claim 126, wherein the front substrate further comprises a plurality of trenches in the peripheral region, the trenches electrically isolating the conductive traces from one another.

131. The device of claim 126, wherein the plurality of supports define a plurality of cavities in the array region, and wherein the conductive layer forms fixed electrodes in the cavities.

132. The device of claim 131, wherein the conductive layer in the cavities comprises the same material as that of the conductive traces.

133. The device of claim 131, further comprising a conductive layer on the plurality of supports, and wherein the conductive layer on the plurality of supports comprises the same material as that of the conductive layer in the cavities.

134. The device of claim 126, wherein the plurality of supports comprises rails.

135. The device of claim 126, wherein the plurality of conductive traces are formed on the land, wherein the front substrate further comprises an insulating layer formed on portions of the plurality of conductive traces, wherein the conductive traces have substantially the same thickness as the conductive layer formed on the lower regions of the front substrate, and wherein the conductive traces are formed of the same material as that of the conductive layer.

136. The device of claim 126, further comprising a plurality of movable electrodes formed over the front substrate, each of the movable electrodes extending from over the array region to over the peripheral region, a portion of each of the movable electrodes electrically contacting a portion of one of the conductive traces.

137. The device of claim 136, further comprising a conductive adhesive material interposed between the portion of each of the movable electrodes and the portion of one of the conductive traces.

138. A carrier for combining with a front substrate of an interferometric modulator, the front substrate comprising substantially transparent electrodes formed thereon, the carrier comprising:

a substrate including an array region and a peripheral region;

a plurality of movable electrode strips formed over the array region of the substrate, the strips extending substantially parallel to one another; and

a plurality of routing traces formed over the substrate, each of the traces extending from a respective one of the strips to the peripheral region.

139. A microelectromechanical system (MEMS) device, comprising:

a front substrate including an array region and a peripheral region, the front substrate comprising a plurality of rails extending parallel to one another in the array region, the rails defining a plurality of troughs in the array region, the front substrate further comprising trenches in the peripheral region, each of the trenches extending from a respective one of the troughs; and

row routing traces formed in the trenches, the row routing traces extending from the troughs in the array region to the at least one portion of the peripheral region, the row routing traces being electrically isolated from one another.

140. The device of claim 139, wherein the trenches define lower regions in the peripheral region, wherein the lower regions rise as they extend from the array region to the at least one portion of the peripheral region.

141. The device of claim 139, further comprising a row driver positioned over the at least one portion of the peripheral region, and an anisotropic conductive film (ACF) electrically connecting the row driver to the row routing traces.

142. A microelectromechanical system (MEMS) device, comprising:

a front substrate having a surface comprising an array region and a peripheral region surrounding the array region, the front substrate comprising;

an annular sealing region on the surface of the front substrate, the sealing region substantially surrounding the array region, the sealing region having a first width extending in a direction toward the array region;

a recess formed into the substrate, the recess having a second width extending in the direction, the second width being greater than the first width, the recess extending across a portion of the sealing region, the recess defining an elevation lower than that of the surface of the front substrate;

a first conductive layer formed on the surface of the front substrate; and

a second conductive layer formed in the recess, wherein the first and second conductive layers are discontinuous with each other.

143. The device of claim 142, further comprising an insulating layer on the first conductive layer, wherein the recess has sidewalls, and wherein the insulating layer further comprises a portion extending to the sidewalls of the recess.

144. The device of claim 143, further comprising a conductive sealant formed on the insulating layer over the sealing region, and wherein the sealant contacts the second conductive layer while being electrically isolated from the first conductive layer by the portion of the insulating layer on the sidewall of the recess.

145. A method of making a microelectromechanical system (MEMS) device, the method comprising:

providing a front substrate having a surface comprising an array region and a routing region;

forming an isolation trench in the routing region of the surface of the front substrate, the isolation trench including a bottom surface and sidewalls, the bottom surface of the isolation trench defining an elevation lower than that of the surface of the front substrate; and

forming a conductive layer on the surface of the substrate and the bottom surface of the isolation trench such that the conductive layer is discontinuous between the surface of the substrate and the isolation trench.

146. The method of claim 145, further comprising forming a conductor on the surface of the substrate such that the conductor crosses over the isolation trench.

147. The method of claim 146, wherein forming the conductor comprises forming the conductor so as to contact the conductive layer on the bottom surface of the isolation trench, and wherein the method further comprises forming an insulating layer between the conductor and the conductive layer on the surface of the substrate and between the conductor and the sidewalls of the isolation trench.

148. The method of claim 147, wherein the front substrate further comprises an annular sealing region at least partially overlapping with the routing region, the sealing region substantially surrounding the array region, the sealing region having a first width extending in a direction toward the array region;

and wherein the isolation trench has a second width extending in the direction, the second width being greater than the first width, the isolation trench extending across a portion of the sealing region.

149. The method of claim 148, further comprising masking at least a portion of the surface with a shadow mask after forming the conductive layer and before forming the insulating layer, the shadow mask comprising a connector crossing the sealing region over a portion of the isolation trench, wherein forming the insulating layer comprises depositing an insulating material on the surface of the front substrate with the shadow mask over the surface.

150. The device of claim 149, wherein forming the conductor comprises forming a conductive sealant on the insulating layer over the sealing region.

151. A method of making an interferometric modulator, the method comprising:

providing a substrate comprising cavities on a surface thereof;

providing a liquid mixture comprising a light-absorbing material over the surface of the substrate such that the liquid mixture fills at least portions of the cavities; and

partially removing a component of the liquid mixture from the cavities of the substrate after providing the liquid mixture such that at least a portion of the light-absorbing material remains in the cavities.

152. The method of claim 151, wherein partially removing the component comprises drying the component of the liquid mixture.

153. An interferometric modulator comprising:

a substrate having a surface, the substrate comprising a plurality of supports formed on the surface of the substrate; and

a light-absorbing material formed on the surface of the substrate, substantially all of the material being positioned in corners where the supports meet the surface.

154. The interferometric modulator of claim 153, wherein the supports are integrally formed with and of the same material as the substrate.

155. The interferometric modulator of claim 153, wherein the supports comprise rails and/or posts.

156. The interferometric modulator of claim 153, wherein the light-absorbing material comprises copper oxide.

157. The interferometric modulator of claim 153, wherein the light-absorbing material comprises graphite.

158. The interferometric modulator of claim 153, wherein the light-absorbing material comprises carbon black.

159. A method of making an interferometric modulator, the method comprising:

forming support structures over a substrate; and

depositing a black mask material over the substrate after forming the support structures.

160. The method of claim 159, wherein the support structures define cavities having floors, and wherein the method further comprises leaving substantially all of the black mask material in corners where the support structures meet the floors of the cavities.

161. The method of claim 159, wherein depositing the black mask material comprises providing a liquid mixture comprising the black mask material over the substrate.

162. The method of claim 161, wherein the black mask material comprises copper oxide.

163. The method of claim 161, wherein the black mask material comprises graphite.

164. The method of claim 161, wherein the black mask material comprises carbon black.

165. The method of claim 161, wherein the liquid mixture comprises an organic solvent.

166. The method of claim 159, further comprising drying the liquid mixture from over the substrate.

167. The method of claim 159, further comprising forming optical stacks on top of the support structures and on the floors of the cavities.

168. The method of claim 159, wherein the optical stack on top of the support structures serves as a black mask.

169. A method of making a static interferometric display device, the method comprising:

providing a first substrate comprising a partially transparent layer formed thereon, the first substrate being formed of a substantially transparent material;

providing a second substrate comprising a mirror layer formed thereon, wherein at least one of the first and second substrates includes cavities patterned based on an image which the static interferometric device is configured to display; and

laminating the first substrate with the second substrate, wherein the partially transparent layer faces the second substrate, wherein the mirror layer faces the first substrate, and wherein the cavities of one of the substrates face the other of the substrates.

170. The method of claim 169, wherein the first substrate includes the cavities, and wherein the second substrate is substantially planar.

171. The method of claim 169, wherein the first substrate is substantially planar, and wherein the second substrate includes the cavities.

172. The method of claim 169, wherein the cavities have multiple depths so as to interferometrically generate multiple colors.

173. A method of making a static interferometric display device, the method comprising:

providing a first substrate comprising a first surface including a plurality of cavities, the cavities having at least one depth, the cavities being patterned at least partially based on an image which the static interferometric display device is configured to display;

providing a second substrate including a second surface; and

attaching the first substrate to the second substrate such that the first surface faces the second surface.

174. The method of claim 173, wherein providing the first substrate comprises shaping the first substrate using one of an embossing process, a photolithography and etching process, and an inscribing process.

175. The method of claim 173, wherein providing the first substrate comprises forming support structures defining the cavities, the support structures being integrally formed with and of the same material as the first substrate.

176. The method of claim 175, further comprising forming a partially reflective layer or a mirror layer on top of the support structures.

177. The method of claim 173, wherein providing the first substrate comprises defining the cavities such that the cavities have smoothly transitioning depths.

178. The method of claim 173, wherein the first substrate is formed of a substantially transparent material, wherein providing the first substrate comprises forming a partially reflective layer in the cavities of the first substrate, and wherein providing the second substrate comprises forming a mirror layer on the second surface of the second substrate.

179. The method of claim 178, further comprising filling at least a portion of the cavities of the first substrate with a substantially transparent material after forming the partially reflective layer and prior to attaching the first substrate to the second substrate.

180. The method of claim 179, further comprising forming a mirror layer on the substantially transparent material after filling the at least a portion of the cavities and prior to attaching the first substrate to the second substrate.

181. The method of claim 173, wherein the second substrate is formed of a substantially transparent material, wherein providing the first substrate comprises forming a mirror layer in the cavities of the first substrate;

and wherein providing the second substrate comprises forming a partially reflective layer on the second surface of the second substrate.

182. The method of claim 181, further comprising filling at least a portion of the cavities of the first substrate with a substantially transparent material after forming the mirror layer and prior to attaching the first substrate to the second substrate.

183. A static interferometric display device comprising:

a first substrate including a first surface, the first substrate including cavities defined on the first surface, the cavities being patterned at least partially based on an image which the static interferometric display device is configured to display, wherein the first substrate is formed of a substantially transparent material;

a second substrate attached to the first substrate, the second substrate including a second surface facing the first surface; and

a partially reflective layer in the cavities of the first substrate.

184. The device of claim 183, wherein the first substrate comprises support structures defining the cavities, the support structures being integrally formed with and of the same material as the first substrate.

185. The device of claim 183, wherein the cavities have smoothly transitioning depths.

186. The device of claim 183, further comprising a mirror layer on the second surface of the second substrate.

187. The device of claim 183, wherein the second substrate is formed of a reflective material.

188. The device of claim 187, wherein the second substrate comprises a specular metallic foil.

189. The device of claim 183, further comprising a substantially transparent filler filling at least a portion of the cavities of the first substrate.

190. The device of claim 189, further comprising a mirror layer on the substantially transparent filler, wherein the mirror layer faces the cavities.

191. A static interferometric display device comprising:

a first substrate including a first surface, the first substrate including cavities defined on the first surface, the cavities being patterned at least partially based on an image which the static interferometric display device is configured to display;

a second substrate attached to the first substrate, the second substrate including a second surface facing the first surface, wherein the second substrate is formed of a substantially transparent material;

a mirror layer on the first surface of the first substrate; and

a partially reflective layer on the second surface of the second substrate.

192. The device of claim 191, further a substantially transparent filler filling at least a portion of the cavities of the first substrate.

193. The device of claim 191, wherein the first substrate comprises support structures defining the cavities, the support structures being integrally formed with and of the same material as the first substrate.

194. A static interferometric display device comprising:

a substrate including a first surface;

a partially reflective layer formed over the first surface;

a mirror layer formed over the first surface, the mirror layer being vertically spaced apart from the partially reflective layer; and

a plurality of fillers positioned laterally adjacent to one another, each of the fillers being interposed between the partially reflective layer and the mirror layer, the plurality of fillers being formed of an at least partially transparent material, the plurality of fillers being positioned to form an array over the first surface of the substrate, wherein the plurality of fillers have different thicknesses corresponding to different optical pathlengths to define a pattern of optical paths between the partially reflective layer and the mirror layer, based on an image which the static interferometric display device is configured to display.

195. The device of claim 194, wherein the mirror layer is positioned over the partially reflective layer.

196. The device of claim 194, wherein the mirror layer is positioned below the partially reflective layer.

197. The device of claim 194, wherein the substrate comprises cavities in the first surface.

198. The device of claim 194, wherein the first surface is stepped or continuously transitioning.

199. A static interferometric display device comprising:

a substrate including a surface, the substrate comprising an array of cavities in the surface, the cavities having different depths, each of the cavities including a bottom surface;

a partially reflective layer formed over the bottom surfaces in the cavities; and

a mirror layer formed over the bottom surfaces of the cavities, the mirror layer being vertically spaced apart from the partially reflective layer in the cavities,

wherein the partially reflective layer and the mirror layer define a plurality of different spacings therebetween in different ones of the cavities, the different spacings corresponding to different optical pathlengths to define a pattern of optical pathlengths between the partially reflective layer and the mirror layer, based on an image which the static interferometric display device is configured to display.

200. The device of claim 199, wherein the substrate comprises support structures defining the cavities, the support structures being integrally formed with and of the same material as the substrate.

201. The device of claim 199, wherein the cavities have smoothly transitioning depths.

202. The device of claim 199, wherein the mirror layer is positioned below the partially reflective layer.

203. The device of claim 199, wherein the mirror layer is positioned over the partially reflective layer.

204. The device of claim 199, further comprising a plurality of fillers formed in the cavities, the plurality of fillers being interposed between the partially reflective layer and the mirror layer, the plurality of fillers being formed of an at least partially transparent material, the plurality of fillers being positioned to form an array over the substrate, wherein the plurality of fillers are configured to define a pattern of optical paths between the partially reflective layer and the mirror layer, based on an image which the static interferometric display device is configured to display.

205. The device of claim 204, wherein the mirror layer is coated over the plurality of fillers.

206. The device of claim 199, wherein the mirror layer comprises a specular metallic foil.