HOUSING FOR AN ELECTRONIC DEVICE AND METHOD OF MAKING THE SAME

• US 20080280083A1
• Filed: 11/28/2007
• Published: 11/13/2008
• Est. Priority Date: 05/09/2007
• Status: Abandoned Application

• Current Assignee: FIH (Hong Kong) Limited (Hon Hai Precision Industry Co., Ltd.), Shenzhen Futaihong Precision Industrial Company Limited (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Shenzhen Futaihong Precision Industrial Company Limited (Hon Hai Precision Industry Co., Ltd.), Sutech Trading Limited
• Inventors: TANG, JIE, LI, WU-BING, ZHANG, SONG, FU, XIONG-BO, WANG, CHUN-BAO, QIU, JIN-LIN
• Application Number:
  US11/946,300
• Publication Number:
  US 20080280083A1
• Time in Patent Office: Days
• US Class Current: 428/35.8
• CPC Class Codes: C25D 3/12 of nickel or cobalt
• CPC Class Codes: C25D 5/12 at least one layer being of nickel or chromium
• CPC Class Codes: Y10T 428/13 Hollow or container type article [e.g., tube, vase, etc.]
• CPC Class Codes: Y10T 428/1355 Elemental metal containing [e.g., substrate, foil, film, coating, etc.]

Abstract

A housing (10) is applied to an electronic device. The housing includes a transparent base (12) and a first metal coating (14). The base contains a first surface (122). The first metal coating is formed on the first surface of the base. A plurality of first through holes (142) is defined in the metal coating. The first through holes are in an arrayed pattern.

Claims

1. A housing for an electronic device, comprising:

a transparent base having a first surface;

a first metal coating being formed on the first surface of the transparent base, a plurality of first through holes being defined in the first metal coating, the first through holes being formed and arranged in an arrayed pattern.

2. The housing as claimed in claim 1, further comprising a second metal coating, wherein the base further includes a second surface opposite to the first surface, the second metal coating is formed on the second surface of the base, a plurality of second through holes are defined in the second metal coating, and each of the second through holes respectively corresponds to one of the first through holes.

3. The housing as claimed in claim 2, wherein each first through hole is coaxial with a corresponding second through hole.

4. The housing as claimed in claim 1, wherein the base further includes a second surface opposite to the first surface, a second coating is formed on the second surface of the base, an opening is defined in the second metal coating, and the area of the opening covers the vertical projected area of the first through holes.

5. The housing as claimed in claim 1, wherein the base is made of plastic material.

6. The housing as claimed in claim 1, wherein each first through hole is circular.

7. A method for making a housing for an electronic device, comprising steps of:

forming a transparent base, the base having a first surface;

forming a first metal coating on the first surface of the base; and

forming a plurality of first through holes in the in the first metal coating, the first through holes being arranged in an arrayed pattern.

8. The method as claimed in claim 7, wherein the first metal coating is formed on the first surface of the base by plating.

9. The method as claimed in claim 8, wherein the step of plating the base with the first metal coating comprises steps of:

performing roughness treatment on the surface of the base;

rinsing out the base with soft water;

adding readily oxidizable materials onto the surface of the base;

forming a layer of palladium Stannum alloy on the surface of the base;

removing the stannum from the layer on the base;

immersing the base into a nickel solution so as to form a palladium nickel layer on the surface of the base;

rinsing out the leaving nickel solution on the base with soft water; and

plating the base in a nickel electrolyte so as to form the first metal coating.

10. The method as claimed in claim 9, wherein the base is cleaned using alkaline solution before roughness treatment.

11. The method as claimed in claim 9, wherein vitriol solution and chromium solution are used to perform roughness treatment on the surface of the base.

12. The method as claimed in claim 11, wherein the method of plating the base further comprises a step of using alkaline solution to counteract the acid leaving in the housing before adding readily oxidizable materials onto the surface of the base.

13. The method as claimed in claim 7, further comprising a step of plating the housing in a nickel electrolyte again after the metal coating being defined the first through holes.

14. The method as claimed in claim 9, wherein the through holes are formed by a laser engraving machine.

15. The method as claimed in claim 9, wherein the base is made of plastic material.