USB memory device

• US 20080280466A1
• Filed: 05/08/2007
• Published: 11/13/2008
• Est. Priority Date: 05/08/2007
• Status: Abandoned Application

• Current Assignee: Imation Corporation (Glassbridge Enterprises, Inc.)
• Original Assignee: Imation Corporation (Glassbridge Enterprises, Inc.)
• Inventors: Sitz, Dean E., Reard, Michael E.
• Application Number:
  US11/801,195
• Publication Number:
  US 20080280466A1
• Time in Patent Office: Days
• US Class Current: 439/131
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07732 the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks housings for electrical equipment in general, see H05K5/02
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 2203/1322 Encapsulation comprising more than one layer
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 5/0278 of USB type details relating to connectors H01R27/00

Abstract

A USB memory device includes a circuit board, a connector, and a one-piece housing. The circuit board includes opposed major faces having a plurality of electrical contacts and a memory chip disposed on one of the major faces. The USB connector is coupled to a first end of the circuit board. The one-piece housing is over-molded over the circuit board and a portion of the connector, such that an interior of the one-piece housing contacts an entirety of the opposed major faces including the plurality of electrical contacts and the memory chip.

Claims

1. A USB memory device comprising:

a circuit board including opposed major faces having a plurality of electrical contacts and a memory chip disposed on one of the major faces;

a USB connector coupled to a first end of the circuit board; and

a one-piece housing over-molded over the circuit board and a portion of the connector;

an interior of the one-piece housing contacting an entirety of the opposed major faces including the plurality of electrical contacts and the memory chip.

2. The USB memory device of claim 1, wherein the one-piece housing comprises a silicone rubber that is configured to flow at room temperature during molding to contact the entirety of the opposed major faces including the plurality of electrical contacts and the memory chip.

3. The USB memory device of claim 2, wherein the electrical contacts and the memory chip are spaced one from the other to define a plurality of interstices, and the silicone rubber fills an entirety of the interstices.

4. The USB memory device of claim 1, wherein the one-piece housing comprises a sleeve in contact with the circuit board, and a casing over-molded over the sleeve and a portion of the connector.

5. The USB memory device of claim 4, wherein the sleeve comprises an epoxy sleeve, and the casing comprises one of a rubber and a thermoplastic elastomer.

6. The USB memory device of claim 1, wherein the USB connector comprises a base coupled to a first end of the circuit board and a leading end separated from the base, the one-piece housing over-molded over the base of the connector.

7. The USB memory device of claim 1, wherein the one-piece housing comprises one homogenous polymer characterized by an absence of an adhesive disposed between the housing and the circuit board.

8. A method of over-molding a USB memory device, the method comprising:

providing a circuit board including opposed major faces having a plurality of electrical contacts and a memory chip disposed on one of the major faces, and a USB connector coupled to a first end of the circuit board; and

molding a polymer material directly onto the circuit board to contact an entirety of the opposed major faces including the plurality of electrical contacts and the memory chip.

9. The method of claim 8, wherein molding a polymer material over the circuit board comprises room temperature molding a polymer material over the circuit board.

10. The method of claim 9, wherein molding a polymer material over the circuit board comprises molding a polymer material over the circuit board at a mold pressure of less than about 20 psi.

11. The method of claim 8, wherein the plurality of electrical contacts define a plurality of interstices, and molding a polymer material directly onto the circuit board comprises over-molding the circuit board with a polymer material that fills the plurality of interstices.

12. The method of claim 8, wherein molding a polymer material over the circuit board comprises molding a polymer material over a portion of the USB connector coupled to a first end of the circuit board.

13. The method of claim 8, wherein molding a polymer material over the circuit board comprises:

potting the circuit board in a sleeve of epoxy; and

over-molding the sleeve of epoxy with a polymer casing.

14. A USB memory device comprising:

a circuit board including opposed major faces having electrical contacts and a memory chip that are separated one from another to define interstices;

a USB connector coupled to a first end of the circuit board; and

means for sealing an entirety of the interstices of the opposed major faces.

15. The USB memory device of claim 14, wherein the means for sealing an entirety of the interstices comprises over-molding a one-piece housing over the circuit board.

16. The USB memory device of claim 15, wherein over-molding a one-piece housing over the circuit board comprises over-molding a one-piece housing over the circuit board and a portion of the connector.

17. The USB memory device of claim 14, wherein the means for sealing an entirety of the interstices comprises flowing a silicone rubber at room temperature over an entirety of the opposed major faces.

18. The USB memory device of claim 14, wherein the means for sealing an entirety of the interstices comprises hermetically sealing the opposed major faces of the circuit board with a polymer.

19. The USB memory device of claim 14, wherein the means for sealing an entirety of the interstices comprises potting the circuit board in an epoxy sleeve and over-molding the sleeve and a portion of the connector with a polymer casing.

20. The USB memory device of claim 19, wherein the epoxy sleeve comprises a room temperature flowable epoxy and the polymer casing comprises a thermoplastic polymer that flows at above room temperature.