DETERMINING DIE TEST PROTOCOLS BASED ON PROCESS HEALTH
First Claim
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1. A method, comprising:
- receiving a first set of parameters associated with a subset of a plurality of die on a wafer;
determining a die health metric for at least a portion of the plurality of die based on the first set of parameters, the die health metric including at least one non-yield process component generated using parameters associated with the fabrication of the die and at least one performance component generated using parameters associated with an electrical performance characteristic of the die; and
testing at least one of the die, wherein a protocol of the testing is determined based on the associated die health metric.
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Abstract
A method includes receiving a first set of parameters associated with a subset of a plurality of die on a wafer. A die health metric is determined for at least a portion of the plurality of die based on the first set of parameters. The die health metric includes at least one process component associated with the fabrication of the die and at least one performance component associated with an electrical performance characteristic of the die. At least one of the die is tested. A protocol of the testing is determined based on the associated die health metric.
31 Citations
23 Claims
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1. A method, comprising:
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receiving a first set of parameters associated with a subset of a plurality of die on a wafer; determining a die health metric for at least a portion of the plurality of die based on the first set of parameters, the die health metric including at least one non-yield process component generated using parameters associated with the fabrication of the die and at least one performance component generated using parameters associated with an electrical performance characteristic of the die; and testing at least one of the die, wherein a protocol of the testing is determined based on the associated die health metric. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A system, comprising:
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a plurality of metrology tools operable to measure a first set of parameters associated with a subset of a plurality of die on a wafer; and a die health unit operable to determine a die health metric for at least a portion of the plurality of die based on the first set of parameters, the die health metric including at least one process component generated using parameters associated with the fabrication of the die and at least one non-yield performance component generated using parameters associated with an electrical performance characteristic of the die; and a test unit operable to test at least one of the die, wherein a protocol of the testing is determined based on the associated die health metric. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A system, comprising:
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means for receiving a first set of parameters associated with a subset of a plurality of die on a wafer; means for determining a die health metric for at least a portion of the plurality of die based on the first set of parameters, the die health metric including at least one process component generated using parameters associated with the fabrication of the die and at least one non-yield performance component generated using parameters associated with an electrical performance characteristic of the die; and means for testing at least one of the die, wherein a protocol of the testing is determined based on the associated die health metric.
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Specification