MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD

• US 20080283282A1
• Filed: 07/24/2008
• Published: 11/20/2008
• Est. Priority Date: 10/26/1999
• Status: Active Grant

• Current Assignee: Ibiden Co., Ltd.
• Original Assignee: Ibiden Co., Ltd.
• Inventors: Tanabe, Tetsuya, Satake, Hiroaki, Iwata, Yutaka, Kawasaki, Yogo
• Granted Patent: US 7,999,194 B2
• Time in Patent Office: Days
• US Class Current: 174/258
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0347 Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
• CPC Class Codes: H05K 2201/09509 : Blind vias, i.e. vias having one side closed
• CPC Class Codes: H05K 2201/09536 : Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
• CPC Class Codes: H05K 2201/0959 : Plated through-holes or plated blind vias filled with insulating material
• CPC Class Codes: H05K 2201/096 : Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2203/0796 : Oxidant in aqueous solution, e.g. permanganate
• CPC Class Codes: H05K 3/0055 : After-treatment, e.g. cleaning or desmearing of holes
• CPC Class Codes: H05K 3/0094 : Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
• CPC Class Codes: H05K 3/3457 : Solder materials or compositions; Methods of application thereof
• CPC Class Codes: H05K 3/381 : by special treatment of the substrate
• CPC Class Codes: H05K 3/382 : by special treatment of the metal
• CPC Class Codes: H05K 3/426 : initial plating of through-holes in substrates without metal
• CPC Class Codes: H05K 3/429 : Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/4602 : characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base

Abstract

Through holes 36 are formed to penetrate a core substrate 30 and lower interlayer resin insulating layers 50, and via holes 66 are formed right on the through holes 36, respectively. Due to this, the through holes 36 and the via holes 66 are arranged linearly, thereby making it possible to shorten wiring length and to accelerate signal transmission speed. Also, since the through holes 36 and the via holes 66 to be connected to solder bumps 76 (conductive connection pins 78), respectively, are directly connected to one another, excellent reliability in connection is ensured.

Claims

1. A multi-layer printed circuit board comprising:

a core substrate having a plurality of penetrating holes and having a first surface and a second surface;

a plurality of buildup layers over the first and second surfaces of the core substrate, respectively, each of the buildup layers comprising a plurality of interlayer resin insulating layers and a plurality of conductor layers alternately provided, the plurality of interlayer resin insulating layers including a lower interlayer resin insulating layer formed adjacent to the core substrate;

a plurality of through holes formed in the plurality of penetrating holes of the core substrate, respectively, and through the lower interlayer resin insulating layers and filled with a resin filler including inorganic particles; and

a plurality of via holes filled with a resin filler including inorganic particles and formed in the lower interlayer resin insulating layers.

2. A multi-layer printed circuit board according to claim 1, wherein the resin filler in the through holes and the resin filler in the via holes are a same resin filler.

3. A multi-layer printed circuit board according to claim 1, wherein the inorganic particles in at least one of the resin filler in the through holes and the resin filler in the via holes comprise at least one compound selected from the group consisting of aluminum compounds, calcium compounds, potassium compounds, magnesium compounds and silicon compounds.

4. A multi-layer printed circuit board according to claim 1, wherein the inorganic particles in at least one of the resin filler in the through holes and the resin filler in the via holes comprise at least one compound selected from the group consisting of alumina, aluminum hydroxide, calcium carbonate, calcium hydroxide, magnesia, dolomite, basic magnesium carbonate, talc, silica and zeolite.

5. A multi-layer printed circuit board according to claim 1, wherein at least one of the resin filler in the through holes and the resin filler in the via holes contains the inorganic particles in 10 to 50 wt %.

6. A multi-layer printed circuit board according to claim 1, wherein at least one of the resin filler in the through holes and the resin filler in the via holes contains the inorganic particles in 20 to 40 wt %.

7. A multi-layer printed circuit board according to claim 1, wherein the inorganic particles in at least one of the resin filler in the through holes and the resin filler in the via holes have at least one of a spherical shape, a circular shape, an ellipsoidal shape, a pulverized shape and a polygonal shape.

8. A multi-layer printed circuit board according to claim 1, wherein the inorganic particles in at least one of the resin filler in the through holes and the resin filler in the via holes have at least one of a spherical shape, a circular shape and an ellipsoidal shape.