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MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD

  • US 20080283282A1
  • Filed: 07/24/2008
  • Published: 11/20/2008
  • Est. Priority Date: 10/26/1999
  • Status: Active Grant
First Claim
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1. A multi-layer printed circuit board comprising:

  • a core substrate having a plurality of penetrating holes and having a first surface and a second surface;

    a plurality of buildup layers over the first and second surfaces of the core substrate, respectively, each of the buildup layers comprising a plurality of interlayer resin insulating layers and a plurality of conductor layers alternately provided, the plurality of interlayer resin insulating layers including a lower interlayer resin insulating layer formed adjacent to the core substrate;

    a plurality of through holes formed in the plurality of penetrating holes of the core substrate, respectively, and through the lower interlayer resin insulating layers and filled with a resin filler including inorganic particles; and

    a plurality of via holes filled with a resin filler including inorganic particles and formed in the lower interlayer resin insulating layers.

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