Please download the dossier by clicking on the dossier button x
×

PACKAGE AND PACKAGING ASSEMBLY OF MICROELECTROMECHANICAL SYSYEM MICROPHONE

  • US 20080283942A1
  • Filed: 10/11/2007
  • Published: 11/20/2008
  • Est. Priority Date: 05/15/2007
  • Status: Active Grant
First Claim
Patent Images

1. A package of a microelectromechanical system (MEMS) microphone, comprising:

  • a substrate having at least a conductive layer and at least a dielectric layer disposed on the substrate;

    a MEMS microphone arranged on a bottom surface of the substrate and electrically connected to the conductive layer of the substrate;

    a sealing element arranged on the bottom surface of the substrate and around the MEMS microphone; and

    at least a conductive connecting element arranged on the bottom surface of the substrate,wherein when the substrate is mounted on a printed circuit board by the sealing element and the conductive connecting element, the sealing element, the printed circuit board, and the substrate construct an acoustic housing, and the acoustic housing has at least an acoustic hole.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×