PACKAGE AND PACKAGING ASSEMBLY OF MICROELECTROMECHANICAL SYSYEM MICROPHONE

• US 20080283942A1
• Filed: 10/11/2007
• Published: 11/20/2008
• Est. Priority Date: 05/15/2007
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Huang, Chao-Ta, Chien, Hsin-Tang
• Granted Patent: US 7,923,791 B2
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/093 Conductive package seal
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10083 Electromechanical or electro-acoustic component, e.g. microphone
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A package of a MEMS microphone is suitable for being mounted on a printed circuit board. The package includes a substrate, at least one MEMS microphone, and a conductive sealing element. The MEMS microphone is arranged on the substrate, and electrically connected to a conductive layer on a bottom surface of the substrate. The conductive sealing element is arranged on the substrate and around the MEMS microphone for connecting the printed circuit board, and constructs an acoustic housing with the printed circuit board and the substrate. The acoustic housing has at least one acoustic hole passing through the substrate. The acoustic hole has a metal layer on the inner wall thereof for connecting the conductive layer on the bottom surface of the substrate to another conductive layer on the top surface of the substrate.

Claims

1. A package of a microelectromechanical system (MEMS) microphone, comprising:

a substrate having at least a conductive layer and at least a dielectric layer disposed on the substrate;

a MEMS microphone arranged on a bottom surface of the substrate and electrically connected to the conductive layer of the substrate;

a sealing element arranged on the bottom surface of the substrate and around the MEMS microphone; and

at least a conductive connecting element arranged on the bottom surface of the substrate,

wherein when the substrate is mounted on a printed circuit board by the sealing element and the conductive connecting element, the sealing element, the printed circuit board, and the substrate construct an acoustic housing, and the acoustic housing has at least an acoustic hole.

2. The package of the MEMS microphone as claimed in claim 1, wherein the substrate further comprises:

at least a via arranged in the substrate.

3. The package of the MEMS microphone as claimed in claim 2, wherein the via arranged in the substrate is a conductive via, and a plurality of the conductive layers is electrically connected by the conductive via passing through the dielectric layer.

4. The package of the MEMS microphone as claimed in claim 1, wherein the sealing element is conductive, and is electrically connected to the conductive layer of the substrate.

5. The package of the MEMS microphone as claimed in claim 1, wherein the acoustic hole passes through at least one of the substrate and the printed circuit board.

6. The package of the MEMS microphone as claimed in claim 1, further comprising:

at least an IC chip arranged on the bottom surface of the substrate, electrically connected to the substrate, and located in the acoustic housing, wherein the MEMS microphone is disposed on the IC chip, and is electrically connected to the IC chip or electrically connected to the conductive layer of the substrate.

7. The package of the MEMS microphone as claimed in claim 1, further comprising:

at least an IC chip arranged on the bottom surface of the substrate, electrically connected to the conductive layer of the substrate, and located in the acoustic housing, wherein the MEMS microphone is disposed on the bottom surface of the substrate, and is electrically connected to the IC chip or electrically connected to the conductive layer of the substrate.

8. The package of the MEMS microphone as claimed in claim 1, further comprising:

at least an IC chip arranged on the bottom surface of the substrate or a top surface of the substrate opposite to the bottom surface, electrically connected to the conductive layer of the substrate, and located outside the acoustic housing.

9. The package of the MEMS microphone as claimed in claim 1, wherein the conductive connecting element is a solder ball or a solder lead.

10. The package of the MEMS microphone as claimed in claim 1, wherein the sealing element is a metal ring or a solder ring.

11. The package of the MEMS microphone as claimed in claim 1, wherein the sealing element is circle, square, or polygonal.

12. A package of a MEMS microphone, comprising:

a substrate having at least a conductive layer and at least a dielectric layer disposed on the substrate;

a MEMS microphone disposed on a bottom surface of the substrate, and electrically connected to the conductive layer of the substrate;

a conductive sealing element arranged on the bottom surface of the substrate, electrically connected to the conductive layer on the bottom surface of the substrate and around the MEMS microphone;

at least a conductive connecting element arranged on the bottom surface of the substrate; and

at least an acoustic hole arranged on the substrate, wherein the acoustic hole has a metal layer on an inner wall thereof, and the acoustic hole passes through the substrate and is connected to the conductive layer of the substrate,

wherein when the substrate is mounted on a printed circuit board by the conductive sealing element and the conductive connecting element, the conductive sealing element is electrically connected to a conductive layer of the printed circuit board, and constructs an acoustic housing with the printed circuit board and the substrate.

13. The package of the MEMS microphone as claimed in claim 12, wherein the substrate further comprises:

at least a via arranged in the substrate.

14. The package of the MEMS microphone as claimed in claim 13, wherein the via arranged in the substrate is a conductive via, and a plurality of the conductive layers is electrically connected by the conductive via passing through the dielectric layer.

15. The package of the MEMS microphone as claimed in claim 12, further comprising:

at least an IC chip disposed on the bottom surface of the substrate, electrically connected to the substrate, and located in the acoustic housing, wherein the MEMS microphone is disposed on the IC chip, and is electrically connected to the IC chip or electrically connected to the conductive layer of the substrate.

16. The package of the MEMS microphone as claimed in claim 12, further comprising:

at least an IC chip arranged on the bottom surface of the substrate, electrically connected to the substrate, and located in the acoustic housing, wherein the MEMS microphone is disposed on the bottom surface of the substrate, and is electrically connected to the IC chip or electrically connected to the conductive layer of the substrate.

17. The package of the MEMS microphone as claimed in claim 12, further comprising:

at least an IC chip arranged on the bottom surface of the substrate or a top surface of the substrate opposite to the bottom surface, electrically connected to the conductive layer of the substrate, and located outside the acoustic housing.

18. The package of the MEMS microphone as claimed in claim 12, wherein the conductive connecting element is a solder ball or a solder lead.

19. The package of the MEMS microphone as claimed in claim 12, wherein the conductive sealing element is a metal ring or a solder ring.

20. The package of the MEMS microphone as claimed in claim 12, wherein the conductive sealing element is circle, square, or polygonal.

21. A packaging assembly of a MEMS microphone, comprising:

a substrate having at least a first conductive layer and at least a dielectric layer disposed on the substrate;

a MEMS microphone arranged on a bottom surface of the substrate and electrically connected to the first conductive layer of the substrate;

a sealing element arranged on the bottom surface of the substrate and around the MEMS microphone;

at least a conductive connecting element arranged on the bottom surface of the substrate; and

a printed circuit board comprising a second conductive layer,

wherein when the printed circuit board is connected to the substrate through the sealing element and the conductive connecting element, the sealing element, the printed circuit board, and the substrate construct an acoustic housing, and the acoustic housing has at least an acoustic hole.

22. The packaging assembly of the MEMS microphone as claimed in claim 21, wherein the substrate further comprises:

at least a via arranged in the substrate.

23. The packaging assembly of the MEMS microphone as claimed in claim 22, wherein the via arranged in the substrate is a conductive via, and a plurality of the first conductive layers is electrically connected by the conductive via passing through the dielectric layer.

24. The packaging assembly of the MEMS microphone as claimed in claim 21, wherein the sealing element is conductive, and is electrically connected to the first conductive layer of the substrate and the second conductive layer of the printed circuit board.

25. The packaging assembly of the MEMS microphone as claimed in claim 21, wherein the acoustic hole passes through at least one of the substrate and the printed circuit board.

26. The packaging assembly of the MEMS microphone as claimed in claim 21, further comprising:

at least an IC chip arranged on the bottom surface of the substrate, and electrically connected to the first conductive layer of the substrate, wherein the MEMS microphone is disposed on the IC chip, and electrically connected to the IC chip or the first conductive layer on the bottom surface of the substrate.

27. The packaging assembly of the MEMS microphone as claimed in claim 21, further comprising:

at least an IC chip arranged on the bottom surface of the substrate, electrically connected to the first conductive layer of the substrate, and located in the acoustic housing, wherein the MEMS microphone is disposed on the bottom surface of the substrate, and is electrically connected to the IC chip or electrically connected to the first conductive layer of the substrate.

28. The packaging assembly of the MEMS microphone as claimed in claim 21, further comprising:

at least an IC chip arranged on the bottom surface of the substrate or a top surface of the substrate opposite to the bottom surface, electrically connected to the first conductive layer of the substrate, and located outside the acoustic housing.

29. The packaging assembly of the MEMS microphone as claimed in claim 21, wherein the conductive connecting element is a solder ball or a solder lead.

30. The packaging assembly of the MEMS microphone as claimed in claim 21, wherein the sealing element is a metal ring or a solder ring.

31. The packaging assembly of the MEMS microphone as claimed in claim 21, wherein the sealing element is circle, square, or polygonal.

32. A packaging assembly of a MEMS microphone, comprising:

a substrate having at least a first conductive layer and at least a dielectric layer disposed on the substrate;

a MEMS microphone disposed on a bottom surface of the substrate and electrically connected to the first conductive layer of the substrate;

a conductive sealing element arranged on the bottom surface of the substrate, electrically connected to the first conductive layer on the bottom surface of the substrate, and around the MEMS microphone;

at least a conductive connecting element arranged on the bottom surface of the substrate;

at least an acoustic hole arranged on the substrate, wherein the acoustic hole has a metal layer on an inner wall thereof, and the acoustic hole passes through the substrate and is connected to the first conductive layer of the substrate; and

a printed circuit board comprising a second conductive layer,

wherein when the substrate is mounted on the printed circuit board through the conductive sealing element and the conductive connecting element, the conductive sealing element is electrically connected to the second conductive layer of the printed circuit board, and constructs an acoustic housing with the printed circuit board and the substrate.

33. The packaging assembly of the MEMS microphone as claimed in claim 32, wherein the substrate further comprises:

at least a via arranged in the substrate.

34. The packaging assembly of the MEMS microphone as claimed in claim 33, wherein the via arranged in the substrate is a conductive via, and a plurality of the first conductive layers is electrically connected by the conductive via passing through the dielectric layer.

35. The packaging assembly of the MEMS microphone as claimed in claim 32, further comprising:

at least an IC chip arranged on the bottom surface of the substrate, electrically connected to the substrate, and located in the acoustic housing, wherein the MEMS microphone is disposed on the IC chip, and is electrically connected to the IC chip or electrically connected to the first conductive layer on the bottom surface of the substrate.

36. The packaging assembly of the MEMS microphone as claimed in claim 32, further comprising:

at least an IC chip arranged on the bottom surface of the substrate, electrically connected to the substrate, and located in the acoustic housing, wherein the MEMS microphone is disposed on the bottom surface of the substrate, and is electrically connected to the IC chip or electrically connected to the first conductive layer of the substrate.

37. The packaging assembly of the MEMS microphone as claimed in claim 32, further comprising:

at least an IC chip arranged on the bottom surface of the substrate or a top surface of the substrate opposite to the bottom surface, electrically connected to the first conductive layer of the substrate, and located outside the acoustic housing.

38. The packaging assembly of the MEMS microphone as claimed in claim 32, wherein the conductive connecting element is a solder ball or a solder lead.

39. The packaging assembly of the MEMS microphone as claimed in claim 32, wherein the conductive sealing element is a metal ring or a solder ring.

40. The packaging assembly of the MEMS microphone as claimed in claim 32, wherein the conductive sealing element is circle, square, or polygonal.