Electronic Device Comprising a Mems Element

• US 20080283943A1
• Filed: 11/07/2006
• Published: 11/20/2008
• Est. Priority Date: 11/17/2005
• Status: Abandoned Application

• Current Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Dekker, Ronald, Duemling, Martin, Polhmann, Hauke
• Application Number:
  US12/093,996
• Publication Number:
  US 20080283943A1
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B81C 1/00293 maintaining a controlled atmosphere with processes not provided for in B81C1/00285
• CPC Class Codes: B81C 2203/0145 Hermetically sealing an opening in the lid
• CPC Class Codes: H01L 2224/13 of an individual bump connector

Abstract

The device (100) comprises a MEMS element (60) in a cavity (30) that is closed by a packaging portion (17) on a second side (2) of the substrate (10). Contact pads (25) are defined on a flexible resin layer (13) on an opposite first side (1) of the substrate. Electrical connections (32) extend through the resin layer (13) to at least one element of the device (100). The device (100) is suitably made with the use of a temporary carrier (42), and opening of etching holes (18) from the second side (2) of the substrate (10).

Claims

1. A method of manufacturing an electronic device that comprises a microelectromechanical (MEMS) element, which is provided with a fixed electrode and a movable electrode that is defined in a cavity and is movable towards and from the fixed electrode between a first gapped position and a second position, said method comprising:

providing a substrate with a first and an opposite second side and with a sacrificial portion, the substrate including the electrodes of the MEMS element;

providing contact pads on the first side of the substrate;

applying a temporary carrier on the contact pads;

providing at least one etching hole in the substrate from the second side to give access to the cavity;

removing the sacrificial portion of the substrate through the at least one etching hole;

closing the at least one etching hole; and

removing the temporary carrier,

wherein

the contact pads are provided on a flexible resin layer that is present on the electrodes of the MEMS element, wherein electrical connections extend through the resin layer to at least one element in the device; and

the substrate is provided with a packaging portion on the second side of the substrate through which the etching holes extend, while the sacrificial portion is at least partially present between the movable electrode and the packaging portion.

2. The method as claimed in claim 1, further comprising patterning the substrate into a first substrate island that includes the MEMS element.

3. The method as claimed in claim 2, wherein patterning of the substrate is carried out simultaneously with formation of the etching holes.

4. The method as claimed in claim 1, further comprising applying bumps on the contact pads prior to providing the temporary carrier.

5. The method as claimed in claim 1, wherein the at least one etching hole is closed by the deposition of a sealing layer.

6. The method as claimed in claim 5, wherein the sealing layer is deposited with chemical vapor deposition.

7. The method as claimed in claim 5, wherein a protecting layer is provided on the second side after applying the sealing layer on the second side of the substrate.

8. The method as claimed in claim 2, wherein separation lanes are defined in an area outside any of the substrate islands.

9. An electronic device comprising a substrate of a semiconductor material with a first and an opposite second side and a microelectromechanical (MEMS) element which is provided with a fixed and a movable electrode, which is defined in a closed cavity and is movable towards and from the fixed electrode between a first gapped position and a second position, the cavity being opened through holes in the substrate that are exposed on the second side of the substrate, said electrodes being coupled to contact pads on the first side, wherein a resin layer is present between the electrodes of the MEMS element and the contact pads, wherein the substrate is provided with a packaging portion on the second side of the substrate through which the etching holes extend, wherein the cavity is at least partially present between the movable electrode and the packaging portion.

10. The electronic device as claimed in claim 9, wherein the substrate is patterned into a first substrate island that comprises the MEMS element.

11. The electronic device as claimed in claim 9, wherein a circuit is present on the first side to interconnect the MEMS elements with further elements within the device, wherein the resin layer covers the circuit and is separated with a passivation layer, and the contact pads are present on the resin layer with vertical interconnects extending through the resin layer to couple the contact pads to the circuit.

12. The electronic device as claimed in claim 11, wherein the passivation layer is present on the resin layer at the first side, the passivation layer leaving the bond pads at least partially exposed.

13. The electronic device as claimed in claim 10, wherein a second substrate island is present in and on which further elements of the circuit are defined, and wherein a conductor between the elements in the first and the second island is geometrically substructured so as to be deformable.