METALLIC INK
First Claim
Patent Images
1. A method of forming a conductive film comprising:
- depositing a film containing a plurality of copper nanoparticles on a surface of a substrate; and
exposing at least a portion of the film to light to make the exposed portion conductive.
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Abstract
Forming a conductive film comprising depositing a non-conductive film on a surface of a substrate, wherein the film contains a plurality of copper nanoparticles and exposing at least a portion of the film to light to make the exposed portion conductive. Exposing of the film to light photosinters or fuses the copper nanoparticles.
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Citations
51 Claims
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1. A method of forming a conductive film comprising:
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depositing a film containing a plurality of copper nanoparticles on a surface of a substrate; and exposing at least a portion of the film to light to make the exposed portion conductive. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51)
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24. A method of forming a conductive film on a fiber in a roll-to-roll process comprising:
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coating the short fibers or chopped fiber with a nanoparticle ink solution; pre-curing the nanoparticle ink solution on the fiber to form a non-conductive film on the fiber; and exposing at least a portion of the non-conductive film to light to make the film conductive. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32)
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Specification