ADDITION OF BALLAST HYDROCARBON GAS TO DOPED POLYSILICON ETCH MASKED BY RESIST

• US 20080286972A1
• Filed: 07/10/2008
• Published: 11/20/2008
• Est. Priority Date: 01/27/2005
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: International Business Machines Corporation
• Inventors: Dalton, Timothy J., Yan, Hongwen, Natzle, Wesley C., Zhang, Ying, Wise, Richard S., Pastel, Paul W.
• Granted Patent: US 8,198,103 B2
• Time in Patent Office: Days
• US Class Current: 438/695
• CPC Class Codes: H01L 21/32137 of silicon-containing layers
• CPC Class Codes: H01L 21/32139 using masks
• CPC Class Codes: Y10S 438/909 Controlled atmosphere

Abstract

A chemical composition and method for providing uniform and consistent etching of gate stacks on a semiconductor wafer, whereby the composition includes an etchant and an added ballast gas added. The gate stacks are formed using this combined etchant and ballast gas composition. The ballast gas may either be similar to, or the equivalent of, a gaseous byproduct generated within the processing chamber. The ballast gas is added in either an overload amount, or in an amount sufficient to compensate for varying pattern factor changes across the water. This etchant and added ballast gas form a substantially homogeneous etchant across the entire wafer, thereby accommodating for or compensating for these pattern factor differences. When etching the wafer using this homogeneous etchant, a passivation layer is formed on exposed wafer surfaces. The passivation layer protects the lateral sidewalls of the gate stacks during etch to result in straighter gate stacks.

Claims

1. A method for etching a gate on a semiconductor wafer comprising:

providing a semiconductor wafer having a photo resist layer with varying patterns with varying concentrations of hydrocarbons over a gate layer;

providing said semiconductor wafer within a processing chamber;

flowing an etchant into said processing chamber;

contacting said etchant to said semiconductor wafer to generate varying concentrations of a hydrocarbon-containing reaction by-product across said varying patterns of said photo resist layer;

adding a gas within said processing chamber to compensate for said varying concentrations of said hydrocarbon-containing reaction by-product across said varying patterns by forming a homogeneous etchant having a uniform concentration of hydrocarbons across the entire said semiconductor wafer;

maintaining said homogeneous etchant across said entire semiconductor wafer by controlling an amount of said hydrocarbon gas added to said processing chamber;

etching a gate in said gate layer by contacting said gate layer with said homogeneous etchant; and

simultaneously, depositing a passivation layer over all exposed surfaces during said etching using said homogeneous etchant having said uniform concentration of hydrocarbons to provide uniform etching results.

2. The method of claim 1 wherein said gas comprises a hydrocarbon containing gas having a chemical formula C_xH_y, wherein x is an integer ranging from 1 to 10, and y is an integer ranging from 2 to 22.

3. (canceled)

4. A method for etching a gate on a semiconductor wafer comprising:

providing a semiconductor wafer within a processing chamber, said semiconductor wafer having a patterned photo resist layer with varying concentrations of hydrocarbons over a gate layer;

flowing an etchant into said processing chamber;

contacting said etchant to said semiconductor wafer to generate a hydrocarbon-containing reaction by-product that is diffused throughout said etchant at varying concentrations across said semiconductor wafer;

adding a hydrocarbon gas within said processing chamber to equilibrate said varying concentrations of said hydrocarbon-containing reaction by-product and provide a homogeneous etchant across the entire said semiconductor wafer; and

etching a gate into said gate layer using said patterned photo resist layer by contacting said gate layer with said homogeneous etchant, while simultaneously depositing a passivation layer over all exposed surfaces during said etching to provide uniform etching results.

7. The method of claim 4 further including the step of providing a hard mask layer between said photo resist layer and said gate layer.

8. The method of claim 4 wherein said etchant is selected from the group consisting of a halogen-based plasma in the presence of an oxygen gas, a halogen-based plasma in the presence of a nitrogen gas, and mixtures thereof.

9. The method of claim 4 wherein said hydrocarbon-containing reaction by-product comprises gaseous by-products desorbed from a surface of said photo resist layer.

10. The method of claim 9 wherein said photo resist layer comprises a soft mask photo resist material.

14. The method of claim 4 wherein said hydrocarbon gas is added within said processing chamber in an amount that compensates for the varying amounts of said reaction by-product desorbed from said varying patterned photo resist layer and diffused at varying concentrations throughout said etchant.

15. The method of claim 4 wherein said patterned photo resist layer comprises a patterned hydrocarbon containing resist layer such that upon contact with said etchant, hydrocarbon containing species are desorbed from said patterned hydrocarbon containing resist layer and diffused throughout said etchant at varying concentrations across said semiconductor wafer, and said hydrocarbon gas is added to said processing chamber to equilibrate said varying concentrations of said hydrocarbon containing species throughout said etchant.

16. The method of claim 4 wherein said hydrocarbon gas has a chemical formula C_xH_y, wherein x is an integer ranging from 1 to 10, and y is an integer ranging from 2 to 22.

21. The method of claim 4 further including the step of maintaining said uniform concentration of hydrocarbons in said homogeneous etchant by controlling an amount of said hydrocarbon gas added to said processing chamber.

22. The method of claim 4 wherein said etchant, said hydrocarbon-containing reaction by-product, and said hydrocarbon gas together provide a homogeneous etchant within said processing chamber having a uniform concentration of hydrocarbons across the entire said semiconductor wafer.

23. The method of claim 22 further including maintaining said uniform concentration of hydrocarbons in said homogeneous etchant across said semiconductor wafer by controlling an amount of said hydrocarbon gas added within said processing chamber.

5. (canceled)

6. (canceled)

11-13. -13. (canceled)

17-20. -20. (canceled)