Direct Package Mold Process For Single Chip SD Flash Cards

• US 20080286990A1
• Filed: 07/18/2008
• Published: 11/20/2008
• Est. Priority Date: 12/02/2003
• Status: Abandoned Application

• Current Assignee: Super Talent Electronics, Inc.
• Original Assignee: Super Talent Electronics, Inc.
• Inventors: Nan, Nan, Ma, Abraham C., Hiew, Siew S., Kim, Jin Kyu
• Application Number:
  US12/175,753
• Publication Number:
  US 20080286990A1
• Time in Patent Office: Days
• US Class Current: 439/55
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1431 Logic devices
• CPC Class Codes: H01L 2924/1434 Memory
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/09472 Recessed pad for surface mounting recess in pad H05K2201/09745; Recessed electrode of component
• CPC Class Codes: H05K 2201/10159 : Memory
• CPC Class Codes: H05K 2203/1316 : Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence

Abstract

A Secure Digital device including a PCBA having passive components mounted on a PCB using surface mount technology (SMT) techniques, and active components (e.g., controller and flash memory) mounted using chip-on-board (COB) techniques. The components are mounted only on one side of the PCB, and then a molded plastic casing is formed over both sides of the PCB such that the components are encased in the plastic, and a thin plastic layer is formed over the PCB surface opposite to the components. The molded plastic casing is formed to include openings that expose metal contacts provided on the PCB, and ribs that separate the openings. In one embodiment the metal contacts are formed on the same side as the thin plastic layer, and in an alternate embodiment the metal contacts are formed on a block that is mounted on the PCB during the SMT process.

Claims

1. A memory card device comprising:

a printed circuit board assembly (PCBA) including;

a printed circuit board (PCB) having opposing first and second surfaces, the printed circuit board (PCB) including,

a plurality of metal contacts mounted on the first surface of the PCB and connected to corresponding conductive traces,

at least one passive component surface mounted on a selected one of the first and second surfaces of the PCB,

at least one unpackaged integrated circuit (IC) die wire bonded to said selected one of the first and second surfaces of the PCB; and

an integral molded plastic casing comprising thermoset plastic and including an upper wall formed on the first surface, wherein the molded plastic casing is formed such that said at least one passive component and said at least one IC die are encased by said thermoset plastic, and wherein said upper wall defines a plurality of openings disposed to expose said plurality of metal contacts.

2. The memory card device according to claim 1,

wherein said at least one passive component is surface mounted onto a first surface region and secured to first contact pads by solder, and

wherein said at least one unpackaged IC die includes:

a controller IC die mounted on a second surface region of said PCB and secured to second contact pads by first wire bonds, and

a first memory IC die mounted on a third surface region of said PCB and secured to third contact pads by second wire bonds.

3. The memory card device according to claim 2, wherein said at least one unpackaged IC die also includes a second memory IC die mounted on the first memory IC die and secured to the third contact pads by third wire bonds.

4. The memory card device according to claim 1,

wherein said plurality of metal contacts are formed directly on the first surface, and

wherein said at least one passive component and said at least one unpackaged IC die are mounted on said second surface and encased by said second wall of said molded plastic casing.

5. The memory card device according to claim 1, further comprising a connector pad block mounted on said first surface, wherein said plurality of metal contacts are formed on said connector pad block and electrically connected to corresponding contact pads, and

wherein said at least one passive component and said at least one unpackaged integrated circuit (IC) die are mounted on said first surface and encased by said first wall of said molded plastic casing.

6. The memory card device according to claim 5, wherein the lower surface is exposed outside of said integral molded plastic casing.

7. The memory card according to claim 1,

wherein the molded plastic casing defines a write-protect notch, and

wherein the memory card further comprises a write protect switch including a switch button that is slidably disposed in the write-protect notch.

8. The memory card according to claim 7, wherein the a write protect switch comprises a wire rod soldered to the PCB and exposed in said write-protect notch, and a switch button slidably attached to said wire rod.

9. The memory card according to claim 7, wherein the a write protect switch comprises a plastic molded body disposed adjacent to said write-protect notch, and a switch button disposed in said write protect notch and slidably attached to a sliding slot defined in said plastic molded body.

10. The memory card device according to claim 1, wherein said memory card device comprises one of a SD device and a MMC device.

11. A memory card device comprising:

a printed circuit board assembly (PCBA) including;

a printed circuit board (PCB) having opposing first and second surfaces,

at least one passive component and at least one active component mounted onto the first surface of the PCB, and

a connector pad block mounted on said first surface, the connector pad block including an insulating base and a plurality of metal contacts formed on said insulating base and electrically connected to corresponding contact pads disposed on said first surface; and

an integral molded plastic casing comprising thermoset plastic and including an upper wall formed on the first surface, whereby said at least one passive component and said at least one active component are encased by said thermoset plastic forming said upper wall, wherein said upper wall defines a plurality of openings disposed to expose said plurality of metal contacts, and wherein the second surface of the PCB is exposed outside of said integral molded plastic casing.

12. The memory card device of claim 11,

wherein said at least one passive component is surface mounted onto a first surface region of said first surface and secured to first contact pads by solder,

wherein said at least one active component includes:

an unpackaged controller integrated circuit (IC) die mounted on a second surface region of the first surface and connected to second contact pads by first wire bonds, and

an unpackaged first memory IC die mounted on a second surface region of the first surface and connected to third contact pads by second wire bonds, and

wherein said connector pad block is mounted on a third region of said first surface and secured to fourth contact pads by solder.

13. The memory card device according to claim 12, wherein said at least one unpackaged IC die also includes a second memory IC die mounted on the first memory IC die and secured to the third contact pads by third wire bonds.

14. A method for producing a plurality of memory card devices, the method comprising:

producing a printed circuit board (PCB) panel including a plurality of PCB regions, each PCB region including a plurality of metal contacts disposed on an upper surface of said each PCB region;

attaching at least one passive component and at least one integrated circuit to one of said upper surface and an opposing lower surface of each said PCB region;

mounting the PCB panel into a molding apparatus such that said upper surface of each said PCB region is disposed over a lower molding die and said metal contacts are pressed against raised supports;

forming a molded casing over at least one of the first surface and the second surface of each PCB region such that said at least one passive component and said at least one IC die of each PCB region are covered by thermal set plastic; and

singulating said PCB panel by cutting said PCB panel such that the PCB panel is separated into said plurality of memory card devices, wherein each memory card device includes a PCB region and a corresponding said molded casing.

15. The method according to claim 14, wherein each raised support provided in the lower molding die includes at least one vacuum suction hole, and wherein mounting said PCB panel includes generating suction such that each metal contact is held against an associated one of said raised supports by said suction applied through said at least one vacuum suction hole.

16. The method according to claim 14, wherein mounting the PCB panel comprises disposing one of a release film and a non-stick coating onto the lower mold die.

17. The method according to claim 14,

wherein producing said PCB panel comprises forming each said PCB region to include opposing first and second surfaces, a plurality of metal contacts disposed on the first surface, a plurality of first contact pads disposed on the second surface, a plurality of second contact pads disposed on the second surface, and a plurality of conductive traces formed on the PCB region such that each conductive trace is electrically connected to at least one of an associated metal contact, a first contact pad and a second contact pad;

and

wherein attaching said at least one passive component and said at least one integrated circuit to each said PCB comprises;

attaching said at least one passive component to the first contact pads using a surface mount technique, and

attaching said at least one unpackaged IC die to the second contact pads using a chip-on-board technique.

18. The method of claim 17, wherein attaching said at least one passive component comprises:

printing a solder paste on said first contact pads;

mounting said at least one component on said first contact pads; and

reflowing the solder paste such that said at least one component is fixedly soldered to said first contact pads.

19. The method of claim 17, further comprising grinding a wafer including said at least one IC die such that a thickness of said wafer is reduced during said grinding, and then dicing said wafer to provide said at least one IC die.

20. The method of claim 19, wherein attaching at least one IC die comprises bonding a first IC die to the second surface of the PCB and wire bonding the first IC die to said second contact pad.