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Electronic device having molded resin case, and molding tool and method of manufacturing the same

  • US 20080287008A1
  • Filed: 05/13/2008
  • Published: 11/20/2008
  • Est. Priority Date: 05/18/2007
  • Status: Abandoned Application
First Claim
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1. An electronic device comprising:

  • an electronic circuit section that includes a connector terminal;

    a case that seals the electronic circuit section in such a manner that the connector terminal protrudes to an outside of the case; and

    a connector housing that is integrated with the case and that has an approximately cylindrical shape to surround an outer circumference of the connector terminal, wherein;

    the case and the connector housing are made of resin with a molding tool that includes a case cavity, a connector-housing cavity, and a holding portion, by filling resin into the case cavity and the connector-housing cavity in a state where the electronic circuit section is held by the holding portion;

    the connector-housing cavity has the approximately cylindrical shape and one end portion of the connector-housing cavity is communicated with the case cavity; and

    the holding portion protrudes to the case cavity from a portion of an inner surface that defines the case cavity and that is partitioned by the connector-housing cavity.

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