PROJECTION OBJECTIVE WITH DECENTRALIZED CONTROL

• US 20080288108A1
• Filed: 06/19/2008
• Published: 11/20/2008
• Est. Priority Date: 12/22/2005
• Status: Abandoned Application

• Current Assignee: Carl Zeiss AG (Carl-Zeiss-Stiftung)
• Original Assignee: Carl Zeiss AG (Carl-Zeiss-Stiftung)
• Inventors: Gross, Torsten
• Application Number:
  US12/141,989
• Publication Number:
  US 20080288108A1
• Time in Patent Office: Days
• US Class Current: 700/254
• CPC Class Codes: G02B 7/005 Motorised alignment
• CPC Class Codes: G03F 7/70266 Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction
• CPC Class Codes: G03F 7/70525 Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure

Abstract

The invention relates to an objective, such as a projection objective for semiconductor microlithography. The objective can include an optical element that is adjustable by a manipulator unit with an actuator and a sensor. The manipulator unit can be driven by a control system via a data bus. The manipulator unit can have a decentralized control subsystem arranged in the region of the manipulator unit. The control subsystem can be connected to the control system via the data bus.

Claims

1. An objective, comprising:

an optical element;

a manipulator unit connected to the optical element, the manipulator unit comprising;

an actuator;

a sensor; and

a decentralized control system; and

a control system capable of being connected to the manipulator unit,

wherein the decentralized control subsystem of the manipulator unit is capable of being connected to the control system via a data bus, the actuator and sensor of the manipulator unit are adapted to adjust the optical element, and the objective is configured to be used in semiconductor microlithography.

2. The objective of claim 1, wherein the decentralized control subsystem is adapted to control the actuator.

3. The objective of claim 1, wherein the decentralized control subsystem is adapted to receive and process signals from the sensor.

4. The objective of claim 1, wherein the decentralized control subsystem is adapted to control the actuator based on data received from the control system.

5. The objective of claim 1, wherein the decentralized control subsystem has at least one microprocessor and memory.

6. The objective of claim 5, wherein the memory of the decentralized control subsystem is capable of storing calibration data for the actuator and sensor of the manipulator unit.

7. The objective of claim 1, wherein the objective further comprises a housing in which the optical element is disposed, and the decentralized control subsystem of the manipulator unit is attached to the housing.

8. The objective of claim 7, wherein the decentralized control subsystem of the manipulator unit is attached to an outer surface of the housing.

9. The objective of claim 1, further comprising a power supply unit connected to the decentralized control subsystem.

10. The objective of claim 9, wherein the power supply unit is adapted to supply power to the decentralized control subsystem based on data received from the decentralized control subsystem.

11. The objective of claim 1, wherein the objective comprises a plurality of optical elements, each of the optical elements being connected to an associated manipulator unit.

12. The objective of claim 1, further comprising a cooling device adapted to control the temperature of the manipulator unit.

13. The objective of claim 12, wherein the cooling device comprises a peltier element, the peltier element being thermally coupled to the manipulator unit.

14. The objective of claim 12, wherein the cooling device comprises a heating foil, the heating foil being thermally coupled to the manipulator unit.

15. The objective of claim 1, wherein the decentralized control subsystem is adapted to drive the actuator by pulse width modulation.

16. An apparatus, comprising:

an illumination device; and

the objective of claim 1,

wherein the apparatus is a projection exposure apparatus configured to be used in semiconductor microlithography.

17. A method comprising using a projection exposure apparatus to make semiconductor components, wherein the projection exposure apparatus comprises:

an illumination device; and

the objective of claim 1.

18. An objective, comprising:

a housing;

an optical element disposed in the housing; and

a manipulator unit connected to the optical element, the manipulator unit comprising a control subsystem that is attached to the housing,

wherein the objective is configured to be used in semiconductor microlithography.

19. The objective of claim 18, wherein the control subsystem of the manipulator unit is attached to an outer side of the housing.

20. The objective of claim 18, wherein the control subsystem is adapted to control the manipulator unit.

21. The objective of claim 18, further comprising a control system capable of being connected to the control subsystem via a data bus.

22. The objective of claim 21, wherein the control subsystem is adapted to control the manipulator unit based on data received from the control system.

23. The objective of claim 18, further comprising a cooling device adapted to control the temperature of the manipulator unit.

24. The objective of claim 18, wherein the decentralized control subsystem is adapted to drive the actuator by pulse width modulation.