MICROSCALE OPTOELECTRONIC DEVICE PACKAGES
First Claim
1. An optoelectronic device article comprising:
- a substrate containing at least one electrically conductive microvia;
at least one emitter diode adapted to emit radiation and disposed in or on the substrate;
at least one ESD diode disposed in or on the substrate; and
a first electrically conductive path between the at least one emitter diode and the at least one microvia, the path being in electrical communication with the at least one ESD diode.
3 Assignments
0 Petitions
Accused Products
Abstract
An optoelectronic device article comprises a substrate containing at least one electrically conductive microvia, at least one emitter diode and at least one ESD diode, optionally formed in situ, disposed in or on the substrate, and an electrically conductive path between the foregoing elements. A reflector cavity may be defined in the substrate for receiving the emitter diode(s), with retention elements on the substrate used to retain a lens material. High flux density and high emitter diode spatial density may be attained. Thermal sensors, radiation sensors, and integral heat spreaders comprising one or more protruding fins may be integrated into the article.
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Citations
85 Claims
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1. An optoelectronic device article comprising:
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a substrate containing at least one electrically conductive microvia; at least one emitter diode adapted to emit radiation and disposed in or on the substrate; at least one ESD diode disposed in or on the substrate; and a first electrically conductive path between the at least one emitter diode and the at least one microvia, the path being in electrical communication with the at least one ESD diode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60)
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61. An optoelectronic device article comprising:
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a substrate containing at least one electrically conductive microvia; at least one emitter diode adapted to emit radiation and disposed in or on the substrate; at least one ESD diode disposed in or on the substrate; and a first electrically conductive path between the at least one emitter diode and the at least one microvia, the path being in electrical communication with the at least one ESD diode; wherein the optoelectronic device article has a flux density of at least about 250 mW/mm2 per watt of input power, as measured at an upper surface of the device article. - View Dependent Claims (62, 63)
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64. An optoelectronic device article comprising:
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a substrate containing a plurality of electrically conductive microvias; a plurality of emitter diodes adapted to emit radiation and disposed in or on the substrate; at least one ESD diode disposed in or on the substrate; and for each emitter diode of the plurality of emitter diodes, a first electrically conductive path between the emitter diode and a microvia of the plurality of microvias, the path being in electrical communication with the at least one ESD diode; wherein the plurality of emitter diodes is arranged with a spatial density of at least about 20 square millimeters of emitter diodes per cm2. - View Dependent Claims (65, 66, 67)
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68. An optoelectronic device article comprising:
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a substrate containing at least one electrically conductive microvia; at least one emitter diode adapted to emit radiation and disposed in or on the substrate; at least one ESD diode disposed in or on the substrate; a first electrically conductive path between the at least one emitter diode and the at least one microvia, the path being in electrical communication with the at least one ESD diode; and an electrically isolated thermal contact pad in thermal communication with the at least one emitter diode - View Dependent Claims (69, 70)
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71. An optoelectronic device article comprising:
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a substrate containing at least one electrically conductive microvia; at least one emitter diode adapted to emit radiation and disposed in or on the substrate; at least one ESD diode disposed in or on the substrate; a first electrically conductive path between the at least one emitter diode and the at least one microvia, the path being in electrical communication with the at least one ESD diode; and at least one thermal sensing element in thermal communication with the at least one emitter diode. - View Dependent Claims (72, 73, 74)
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75. An optoelectronic device article comprising:
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a substrate containing at least one electrically conductive microvia; at least one emitter diode adapted to emit radiation and disposed in or on the substrate; at least one ESD diode disposed in or on the substrate; a first electrically conductive path between the at least one emitter diode and the at least one microvia, the path being in electrical communication with the at least one ESD diode; and at least one radiation sensing element adapted to provide a radiation sensing element output signal to any of (A) the at least one emitter diode and (B) a control element associated with the at least one emitter diode. - View Dependent Claims (76, 77, 78)
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79. A method comprising:
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forming a retention element in or on a substrate, said retention element being adapted to retain any of an encapsulant and a lens; providing an emitter diode in or on the substrate; providing an ESD diode in or on the substrate; defining a microvia through the substrate; and forming an electrically conductive path between the emitter diode and the microvia, the path being in electrical communication with the at least one ESD diode. - View Dependent Claims (80, 81, 82)
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83. A method comprising:
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providing a plurality of emitter diodes in or on a substrate; providing a plurality of ESD diodes in or on the substrate; defining a plurality of microvias through the substrate; for each emitter diode of the plurality of emitter diodes, forming an electrically conductive path between the emitter diode and a microvia, the path being in electrical communication with at least one ESD diode of the plurality of ESD diodes; and testing at least one output characteristic of at least two emitter diodes or at least two groups of emitter diodes of the plurality of emitter diodes while the plurality of emitter diodes is disposed in or on the substrate. - View Dependent Claims (84, 85)
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Specification