WAFER LEVEL LENS ARRAYS FOR IMAGE SENSOR PACKAGES AND THE LIKE, IMAGE SENSOR PACKAGES, AND RELATED METHODS

• US 20080290435A1
• Filed: 05/21/2007
• Published: 11/27/2008
• Est. Priority Date: 05/21/2007
• Status: Abandoned Application

• Current Assignee: Aptina Imaging Corporation (ON Semiconductor Corporation)
• Original Assignee: Micron Technology, Inc.
• Inventors: Oliver, Steve, Farnworth, Warren M., Kirby, Kyle K., Akram, Salman, Hiatt, William M.
• Application Number:
  US11/751,206
• Publication Number:
  US 20080290435A1
• Time in Patent Office: Days
• US Class Current: 257/432
• CPC Class Codes: B29D 11/00307 Producing lens wafers
• CPC Class Codes: B29D 11/00375 by moulding lenses in holes through a substrate
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Image sensor packages, lenses therefore, and methods for fabrication are disclosed. A substrate having through-hole vias may be provided, and an array of lenses may be formed in the vias. The lenses may be formed by molding or by tenting material over the vias. An array of lenses may provide a color filter array (CFA). Filters of the CFA may be formed in the vias, and lenses may be formed in or over the vias on either side of the filters. A substrate may include an array of microlenses, and each microlens of the array may correspond to a pixel of an associated image sensor. In other embodiments, each lens of the array may correspond to an imager array of an image sensor. A wafer having an array of lenses may be aligned with and attached to an imager wafer comprising a plurality of image sensor dice, then singulated to form a plurality of image sensor packages.

Claims

1. A method for forming a lens, comprising:

aligning at least one mold platen with a substrate having a plurality of vias formed therethrough;

introducing a flowable material within each of the vias and in contact with the mold platen; and

solidifying the fluid material to form a lens within each via.

2. The method of claim 1, wherein aligning the at least one mold platen comprises aligning a first mold platen having a plurality of concave portions thereon.

3. The method of claim 2, wherein aligning the mold platen comprises aligning each concave portion of the first mold platen with a via of the plurality of vias through the substrate.

4. The method of claim 2, wherein aligning the mold platen further comprises aligning a second mold platen having a plurality of convex portions thereon.

5. The method of claim 4, wherein aligning the mold platen comprises aligning each convex portion of the second mold platen with a via of the plurality of vias through the substrate.

6. The method of claim 2, wherein aligning the mold platen further comprises aligning a second mold platen having a substantially planar surface facing the substrate.

7. The method of claim 1, wherein introducing a flowable material comprises introducing a polymer material.

8. The method of claim 1, wherein introducing a fluid material comprises introducing a material configured to exhibit optical color filtering properties.

9. The method of claim 1, wherein aligning at least one mold platen with a substrate comprises aligning at least one mold platen with a wafer of a silicon or a borosilicate material.

10. The method of claim 1, further comprising etching the substrate to provide spacers adjacent each via.

11. The method of claim 1, wherein aligning at least one mold platen with a substrate comprises aligning at least one mold platen with a substrate having a plurality of vias formed therethrough corresponding to the pixels of an optically active semiconductor die.

12. The method of claim 1, wherein aligning at least one mold platen with a substrate comprises aligning at least one mold platen with a substrate having a plurality of vias formed therethrough corresponding to optically active semiconductor dice of an imager wafer.

13. A method for packaging a semiconductor die, comprising:

forming a plurality of lenses, each lens associated with a via of a plurality of vias through a substrate comprising a lens array wafer;

aligning each lenses of the lens array wafer with an imager array of a semiconductor die of a plurality of semiconductor dice of an imager wafer; and

securing the lens array wafer to the imager wafer.

14. The method of claim 13, further comprising:

cutting the wafer and the substrate to singulate each semiconductor die and the lens secured thereon to form a semiconductor die package.

15. The method of claim 13, wherein securing the lens wafer to the imager wafer comprises bonding by one of fusion bond, anodic bond, and epoxy.

16. The method of claim 13, wherein the imager array of the semiconductor die comprises an optically active region on the surface thereof.

17. The method of claim 16, wherein the plurality of semiconductor dice each comprise one of a CMOS imager and a CCD imager.

18. The method of claim 13, wherein forming a plurality of lenses comprises:

aligning a mold platen with the substrate;

introducing a flowable material within the vias of the substrate; and

solidifying the fluid material to form a lens within each via.

19. The method of claim 13, wherein forming a plurality of lenses comprises forming a polymer lens by injection molding.

20. The method of claim 19, wherein forming a plurality of lenses comprises fabricating the lenses by placing the substrate having vias therethrough into a mold platen defining an array of concave cavities with vias of the substrate adjacent the concave cavities of the mold platen, injecting polymeric molding material into the mold, curing the polymeric material, and removing the substrate from the mold.

21. The method of claim 13, further comprising etching the substrate to form a plurality of spacers.

22. An image sensor package, comprising:

a semiconductor die having an optically active region thereon;

a substrate disposed adjacent the optically active region, the substrate having a plurality of vias therethrough; and

a plurality of lenses, each lens associated with a via of the substrate.

23. The image sensor package of claim 22, further comprising a color filter array comprising:

a filter material disposed in some of the vias of the substrate, the filter material configured to exhibit desired optical filtering properties; and

at least a second filter material disposed in other vias of the substrate, the at least a second filter material configured to exhibit desired optical filtering properties which are different than the desired optical filtering properties of the filter material.

24. The image sensor package of claim 22, wherein each of the plurality of lenses is disposed within the vias.

25. The image sensor package of claim 22, wherein each lens of the plurality of lenses tents over the associated via.

26. The image sensor package of claim 22, wherein at least one lens of the plurality of lenses includes a concave surface and a convex surface.

27. The image sensor package of claim 22, wherein at least one lens of the plurality of lenses includes a protrusion extending from a surface thereof.

28. The image sensor package of claim 27, wherein the protrusion is integral with the lens.

29. The image sensor package of claim 27, wherein the protrusion is attached to the lens.

30. The image sensor package of claim 22, further comprising a second substrate adjacent to the substrate and having a second plurality of vias therethrough, the second plurality of vias substantially aligned with the plurality of vias.

31. The image sensor package of claim 30, wherein each lens of the plurality of lenses includes a first portion associated with the substrate, and a second portion associated with the second substrate.

32. An imaging system, comprising:

an image sensor package, comprising;

a semiconductor die having an optically active region thereon;

a substrate disposed adjacent the optically active region, the substrate having at least one via therethrough; and

at least one lens associated with a via of the substrate;

an electronic signal processor in communication with the image sensor package;

a communication interface in communication with the electronic signal processor; and

a local storage device in communication with the electronic signal processor.

33. The imaging system of claim 32, wherein the imaging system comprises one of a digital camera, camera (cell) phone, PDA, home security system, endoscope, optical storage apparatus and scientific testing apparatus.

34. An image sensor package, comprising:

a first substrate;

an optically active semiconductor die attached to the first substrate;

a second substrate having a via therethrough and integral spacers attached to the first substrate;

a lens disposed within the via.

35. The image sensor package of claim 34, further comprising at least a third substrate having a via therethrough disposed on the second substrate, and at least a second lens disposed within the via of the third substrate.

36. The image sensor package of claim 34, wherein the lens includes a concave surface and a convex surface.

37. The image sensor package of claim 34, wherein the lens includes a protrusion extending from a surface thereof.

38. The image sensor package of claim 37, wherein the protrusion is integral with the lens.

39. The image sensor package of claim 37, wherein the protrusion is attached to the lens.

40. An image sensor package, comprising:

a first substrate;

an optically active semiconductor die attached to the first substrate;

a second substrate attached to the first substrate;

a third substrate substantially aligned with the second substrate and attached thereto;

a via extending through the second substrate and the third substrate and substantially aligned with an optically active region of the optically active semiconductor die;

a first lens tenting over the via and attached to a surface of the second substrate; and

a second lens tenting over the via and attached to a surface of the third substrate.