PROBE NEEDLE PROTECTION METHOD FOR HIGH CURRENT PROBE TESTING OF POWER DEVICES
First Claim
1. A test apparatus for applying high current test stimuli to a semiconductor device in wafer or chip form, said semiconductor device including a plurality of contact points, comprising:
- a plurality of probes for electrically coupling to respective ones of the plurality of contact points on the semiconductor devicea plurality of current limiters electrically coupled to respective ones of the plurality of probes, said current limiters operative to limit current flow in a corresponding probe; and
a current sensor electrically coupled to each of the plurality of probes, said current sensor operative to provide a signal when detected current in any probe exceeds a predetermined level.
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Accused Products
Abstract
A test system, apparatus and method for applying high current test stimuli to a semiconductor device in wafer or chip form includes a plurality of probes for electrically coupling to respective contact points on the semiconductor device, a plurality of current limiters electrically coupled to respective ones of the plurality of probes, and a current sensor electrically coupled to the plurality of probes. The current limiters are operative to limit current flow passing through a respective probe, and the current sensor is operative to provide a signal when detected current in any contact of the plurality of probes exceeds a threshold level.
40 Citations
25 Claims
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1. A test apparatus for applying high current test stimuli to a semiconductor device in wafer or chip form, said semiconductor device including a plurality of contact points, comprising:
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a plurality of probes for electrically coupling to respective ones of the plurality of contact points on the semiconductor device a plurality of current limiters electrically coupled to respective ones of the plurality of probes, said current limiters operative to limit current flow in a corresponding probe; and a current sensor electrically coupled to each of the plurality of probes, said current sensor operative to provide a signal when detected current in any probe exceeds a predetermined level. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 22)
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13. A method for applying high current test stimuli to a semiconductor device in wafer or chip form, said semiconductor device including a plurality of contact points, comprising:
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coupling a plurality of probes to at least one of the plurality of contact points on the semiconductor device; independently limiting current flow through each probe of the plurality of probes to a predetermined level; and providing a signal when detected current in any probe exceeds a predetermined level. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 23)
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21. (canceled)
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24. A test apparatus for applying high current test stimuli to a semiconductor device in wafer or chip form, said semiconductor device including a plurality of contact points, comprising:
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a plurality of probes for electrically coupling to at least one of the plurality of contact points on the semiconductor device a plurality of current limiters electrically coupled to respective ones of the plurality of probes, said current limiters operative to limit current flow in a corresponding probe; a voltage protection circuit electrically coupled to said plurality of current limiters, said voltage protection circuit operative to protect the plurality of probes from an over-voltage condition; and a trigger circuit electrically coupled to each of the plurality of current limiters and to the protection circuit, said trigger circuit operative to detect a voltage drop across the current limiters, and when the voltage drop across any current limiter exceeds a predetermined level, the trigger circuit is operative to command the voltage protection circuit to enter a protection mode. - View Dependent Claims (25)
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Specification