LIGHT EMITTING DIODE LAMP

• US 20080291675A1
• Filed: 03/23/2008
• Published: 11/27/2008
• Est. Priority Date: 05/23/2007
• Status: Abandoned Application

• Current Assignee: Advanced-Connectek Incorporated (ACON Holding, Inc.), Tysun Inc.
• Original Assignee: Advanced-Connectek Incorporated (ACON Holding, Inc.), Tysun Inc.
• Inventors: Lin, Shun-Tian, Huang, Jyun-Wei
• Application Number:
  US12/053,619
• Publication Number:
  US 20080291675A1
• Time in Patent Office: Days
• US Class Current: 362/247
• CPC Class Codes: F21K 9/233 specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
• CPC Class Codes: F21K 9/68 Details of reflectors forming part of the light source
• CPC Class Codes: F21V 29/505 of reflectors
• CPC Class Codes: F21V 29/745 the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
• CPC Class Codes: F21V 29/767 the planes containing the fins or blades having directions perpendicular to the light emitting axis
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A light emitting diode (LED) lamp including a substrate, a plurality of wire units, a plurality of LED chips, a lamp cap, and a control circuit module is provided. The substrate has a carrying portion and a ring frame connected to the periphery thereof. The carrying portion has a plurality of openings. The wire units are respectively disposed inside the openings. Each wire unit has a wire and an insulating material covering the periphery of the wire, such that the wire is electrically isolated from the substrate. The LED chips are disposed on the carrying portion, and each LED chip is electrically connected to the corresponding wires. The lamp, cap is disposed on the bottom of the substrate and has two power contacts. The control circuit module is disposed between the substrate and the lamp cap and electrically connected to wires and power contacts, to control operations of LED chips.

Claims

1. A light emitting diode (LED) lamp, comprising:

a substrate, comprising an inner surface, an outer surface opposite to the inner surface, and a bottom part, wherein the substrate comprises a carrying portion and a ring frame connected to the periphery of the carrying portion, and the carrying portion has a plurality of openings;

a plurality of wire units, respectively disposed in the openings, wherein each wire unit comprises a wire and an insulating material covering the periphery of the wire;

a plurality of LED chips, disposed on the carrying portion of the substrate, wherein each LED chip is electrically connected to the corresponding wires;

a lamp cap, disposed on the bottom part of the substrate and provided with two power contacts; and

a control circuit module, disposed between the substrate and the lamp cap, and electrically connected to the wires and the two power contacts.

2. The LED lamp according to claim 1, wherein the substrate is made of a metal material.

3. The LED lamp according to claim 2, wherein the metal material is select from a group consisting of copper, copper alloy, aluminum, aluminum alloy, composite material formed by copper or copper alloy, and composite material formed by aluminum or aluminum alloy.

4. The LED lamp according to claim 1, wherein the substrate further comprises an optical reflection film, disposed on the inner surface of the substrate.

5. The LED lamp according to claim 4, wherein a material of the optical reflection film is selected from a group consisting of silver, aluminum, stainless steel, and nickel.

6. The LED lamp according to claim 1, wherein the insulating material is selected from a group consisting of polymer material, glass, and ceramic.

7. The LED lamp according to claim 1, wherein the LED chips are electrically connected to the corresponding wires through a wire bonding technique.

8. The LED lamp according to claim 1, wherein the LED chips are electrically connected to the corresponding wires through a flip-chip bonding technique.

9. The LED lamp according to claim 1, wherein the lamp cap is a screw-in lamp cap.

10. The LED lamp according to claim 1, wherein the lamp cap is a bayonet lamp cap.

11. The LED lamp according to claim 1, further comprising a heat sink element, disposed on the outer surface of the substrate.

12. The LED lamp according to claim 11, wherein the heat sink element is selected from a group consisting of a plurality of heat sink fins and a heat pipe.

13. The LED lamp according to claim 1, further comprising a molding compound, disposed within the substrate and covering the LED chips.