LIGHT EMITTING DIODES (LEDs) WITH IMPROVED LIGHT EXTRACTION BY ROUGHENING
First Claim
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1. A method of fabricating a light-emitting diode (LED) device having a roughened surface for scattering light, the method comprising:
- depositing an n-doped layer above a carrier substrate;
depositing an active layer for emitting light above the n-doped layer;
depositing a p-doped layer above the active layer;
forming a conductive substrate above the p-doped layer;
removing the carrier substrate to expose the n-doped layer;
immersing a surface of the n-doped layer in an electrolytic solution;
applying an electrical bias to the conductive substrate; and
illuminating the surface of the n-doped layer such that photo-electrochemical (PEC) oxidation and etching occurs to form the roughened surface of the LED device on the n-doped layer.
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Abstract
Systems and methods are disclosed for fabricating a semiconductor light emitting diode (LED) device by forming an n-gallium nitride (n-GaN) layer on the LED device and roughening the surface of the n-GaN layer to extract light from an interior of the LED device.
36 Citations
7 Claims
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1. A method of fabricating a light-emitting diode (LED) device having a roughened surface for scattering light, the method comprising:
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depositing an n-doped layer above a carrier substrate; depositing an active layer for emitting light above the n-doped layer; depositing a p-doped layer above the active layer; forming a conductive substrate above the p-doped layer; removing the carrier substrate to expose the n-doped layer; immersing a surface of the n-doped layer in an electrolytic solution; applying an electrical bias to the conductive substrate; and illuminating the surface of the n-doped layer such that photo-electrochemical (PEC) oxidation and etching occurs to form the roughened surface of the LED device on the n-doped layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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