METHOD OF FORMING AMORPHOUS CARBON FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

• US 20080293248A1
• Filed: 08/15/2007
• Published: 11/27/2008
• Est. Priority Date: 05/22/2007
• Status: Abandoned Application

• Current Assignee: TES Co., Ltd.
• Original Assignee: TES Co., Ltd.
• Inventors: Lee, Seung Jun, An, Byoung Dae, Park, Keun Oh
• Application Number:
  US11/839,394
• Publication Number:
  US 20080293248A1
• Time in Patent Office: Days
• US Class Current: 438/694
• CPC Class Codes: C23C 16/26 Deposition of carbon only
• CPC Class Codes: G03F 7/11 having cover layers or intermediate layers, e.g. subbing layers G03F7/091 - G03F7/093, B41N3/03 take precedence
• CPC Class Codes: H01L 21/02115 the material being carbon, e.g. alpha-C, diamond or hydrogen doped carbon
• CPC Class Codes: H01L 21/02527 Carbon, e.g. diamond-like carbon
• CPC Class Codes: H01L 21/02592 amorphous
• CPC Class Codes: H01L 21/0262 Reduction or decomposition of gaseous compounds, e.g. CVD
• CPC Class Codes: H01L 21/0276 using an anti-reflective coating anti-reflective coating for lithography in general G03F7/09
• CPC Class Codes: H01L 21/0332 characterised by their composition, e.g. multilayer masks, materials
• CPC Class Codes: H01L 21/3146 Carbon layers, e.g. diamond-like layers

Abstract

The present invention relates to a method of forming an amorphous carbon film and a method of manufacturing a semiconductor device using the method. An amorphous carbon film is formed on a substrate by vaporizing a liquid hydrocarbon compound, which has chain structure and one double bond, and supplying the compound to a chamber, and ionizing the compound. The amorphous carbon film is used as a hard mask film.

It is possible to easily control characteristics of the amorphous carbon film, such as a deposition rate, an etching selectivity, a refractive index (n), a light absorption coefficient (k) and stress, so as to satisfy user'"'"'s requirements. In particular, it is possible to lower the refractive index (n) and the light absorption coefficient (k). As a result, it is possible to perform a photolithography process without an antireflection film that prevents the diffuse reflection of a lower material layer.

Further, a small amount of reaction by-product is generated during a deposition process, and it is possible to easily remove reaction by-products that are attached on the inner wall of a chamber. For this reason, it is possible to increase a cycle of a process for cleaning a chamber, and to increase parts changing cycles of a chamber. As a result, it is possible to save time and cost.

Claims

1. A method of forming an amorphous carbon film, the method comprising:

loading a substrate into a chamber; and

forming an amorphous carbon film on the substrate by vaporizing a chain-structured liquid hydrocarbon compound including one double bond, supplying the compound to the chamber, and ionizing the compound.

2. The method of claim 1, wherein the hydrocarbon compound comprises one of hexene (C₆H₁₂), nonene (C₉H₁₈), dodecene (Cl₂H₂₄), pentadecene (C₁₅H₃₀) and combinations thereof.

3. The method of claim 1, wherein the hydrocarbon compound is supplied at a flow rate in a range of 0.3 to 0.8 g/min.

4. The method of claim 1, wherein the vaporized hydrocarbon compound is ionized by applying radio frequency power in a range of 800 to 2000 W to the chamber.

5. The method of claim 1, wherein low frequency power in a range of 150 to 400 W is further applied to the chamber.

6. The method of claim 1, wherein the amorphous carbon film is formed while a pressure in a range of 4.5 to 8 Torr is maintained in the chamber.

7. The method of claim 1, wherein the chamber includes a shower head for injecting the vaporized hydrocarbon compound, and

a distance between the shower head and the substrate is maintained in a range of 250 to 400 mils.

8. The method of claim 1, wherein the amorphous carbon film is formed at a temperature in a range of 300 to 550°

C.

9. The method of claim 1, wherein the amorphous carbon film is formed at a deposition rate in a range of 15 to 80 Å

/sec.

10. The method of claim 1, wherein the amorphous carbon film comprises carbon and hydrogen, and

a ratio of carbon to hydrogen is controlled according to the radio frequency power, the amount of the hydrocarbon compound, the chamber pressure, and the deposition temperature.

11. The method of claim 10, wherein the content of hydrogen in the amorphous carbon film is controlled by further supplying hydrogen or ammonia gas.

12. The method of claim 1, wherein the amorphous carbon film has a refractive index in a range of 1.7 to 2.2 and a light absorption coefficient in a range of 0.1 to 0.5.

13. The method of claim 1, wherein an etching selectivity of the amorphous carbon film with respect to an oxide film is in the range of 1:

5 to 1;

40, and

an etching selectivity of the amorphous carbon film with respect to a nitride film is in the range of 1;

1 to 1;

20.

14. The method of claim 1, wherein the amorphous carbon film is formed using inert gas, and

the deposition rate and the etching selectivity of the amorphous carbon film are controlled by using the inert gas.

15. A method of manufacturing a semiconductor device, the method comprising:

forming a material layer on a substrate on which predetermined structures are formed;

loading the substrate, on which the material layer is formed, into a chamber;

forming an amorphous carbon film on the substrate by vaporizing a chain-structured liquid hydrocarbon compound including one double bond, and supplying the compound to the chamber, and ionizing the compound;

forming photosensitive film patterns on the amorphous carbon film, and etching the amorphous carbon film while using the photosensitive film patterns as an etching mask; and

etching the exposed material layer, and removing the amorphous carbon film and the photosensitive film patterns.

16. The method of claim 15, wherein the amorphous carbon film is etched using reactive ion etching.

17. The method of claim 15, wherein the amorphous carbon film is etched using one of CF₄ plasma, C₄F₈ plasma, oxygen (O₂) plasma, ozone (O₃) plasma and combinations thereof.

18. The method of claim 15, wherein the amorphous carbon film is etched by remote plasma system using one of oxygen (O₂), NF₃ and combinations thereof.