Novel silicon micromechanical gyroscope

• US 20080295596A1
• Filed: 09/29/2007
• Published: 12/04/2008
• Est. Priority Date: 06/01/2007
• Status: Active Grant

• Current Assignee: Beijing Walkang Science and Technology Limited Company
• Original Assignee: Beijing Walkang Science and Technology Limited Company
• Inventors: Zhang, Wei, Zhang, Fuxue
• Granted Patent: US 7,805,994 B2
• Time in Patent Office: Days
• US Class Current: 73/504.12
• CPC Class Codes: G01C 19/5726 Signal processing
• CPC Class Codes: G01C 19/5769 Manufacturing; Mounting; Housings

Abstract

The present invention relates to a novel silicon micromechanical gyroscope, which is used in control technology field to measure pose measurement of a rotating body, such as aerobat, motor tire and drilling platform, wherein the novel silicon micromechanical gyroscope main includes a sensing element and a signal process circuit. The sensing element further comprises a silicon slice frame, a silicon slice, an upper electrode ceramics plate and a bottom electrode ceramics plate. The signal process circuit further comprises a signal detecting bridge circuit used as bridge arm of the capacitor sensing element, and a SCM signal process circuit with data process module. The novel silicon micromechanical gyroscope is able to replace a drive force from the drive conformation with a rotating force from the rotation of the rotating body so as to achieve a novel silicon micromechanical gyroscope without a drive conformation. The novel silicon micromechanical gyroscope without a drive conformation to mostly achieve purposes like minify in craft, simply in structure and reduced in volume so as to effectively lower cost and save energy.

Claims

1. A novel silicon micromechanical gyroscope, comprising a sensing element adapted for measuring an angular velocity of a rotating body, a signal process circuit adapted for treating a signal from said sensing element, a housing, a base board, a mounting frame and an insulator, wherein said sensing element further comprises a capacitor sensing element without drive conformation, wherein said signal process circuit further comprises a signal detecting bridge circuit used as bridge arm of said capacitor sensing element, and a SCM signal process circuit with data process module.

2. The novel silicon micromechanical gyroscope, as recited in claim 1, wherein said sensing element further comprises a silicon slice frame, a silicon slice, an upper electrode ceramics plate and a bottom electrode ceramics plate, a pair of vibrate beams, a first pair of electrode layers and a second pair of electrode layers, wherein said silicon slice frame is a rectangular flat frame, wherein silicon slice is a rectangular flat vibrate mass, wherein said silicon slice has the area less than that of said silicon slice frame, and has the thickness less than that of said silicon slice frame, wherein said, square through hole is formed in the center of the silicon slice and a plurality of elongated through holes is formed in each of both sides of said square through hole, wherein said silicon slice is connected with said silicon slice frame through each of said pair of vibrate beams 14a, 14b respectively, wherein said pair of vibrate beams 14a, 14b is provided perpendicular to said silicon slice 11, wherein said second pair of electrode layers 22a, 22b is spacedly provided in said bottom electrode ceramics plate 13, wherein said first pair of electrode layers 21a, 21b, said second pair of electrode layers 22a, 22b and said silicon slice 11 are disposed in such manner that a series of electric condensers C1□

C2□

C3□

C4 are formed.

3. The novel silicon micromechanical gyroscope, as recited in claim 1, wherein said signal process circuit further comprises a bridge circuit, a source voltage regulator, a reference voltage source, a square wave signal generating circuit, a bridge circuit signal differential amplifier, a band pass wave filter, a LP wave filter, a phase amendment circuit, a polar choice switch and a SCM circuit.

4. The novel silicon micromechanical gyroscope, as recited in claim 1 or 3, wherein said bridge circuit further comprising four capacities C1, C2, C3 and C4, wherein said capacities C1 and C2 are in parallel connection, said capacities C3 and C4 are in parallel connection, and said capacities C1 and C2 in parallel connection and said capacities C3 and C4 in parallel connection is series connection with two resistances to form four bridge arms of said signal detecting bridge circuit.

5. The novel silicon micromechanical gyroscope, as recited in claim 1, wherein a pair of anti-attacked pads is respectively provided at both sides of the sensing element, wherein a gyroscopic member is sealed into a shell, made of aluminum material, by ethoxyline resin, wherein an anti-attacked pad made of rubber is laid on the bottom surface of said shell.