PHOTOVOLTAIC DEVICE AND METHOD OF MANUFACTURING PHOTOVOLTAIC DEVICES

• US 20080295882A1
• Filed: 05/27/2008
• Published: 12/04/2008
• Est. Priority Date: 05/31/2007
• Status: Abandoned Application

• Current Assignee: Thinsilicon Corporation
• Original Assignee: Thinsilicon Corporation
• Inventors: COAKLEY, KEVIN MICHAEL, HUSSEN, GULEID, STEPHENS, JASON M.
• Application Number:
  US12/127,141
• Publication Number:
  US 20080295882A1
• Time in Patent Office: Days
• US Class Current: 136/244
• CPC Class Codes: H01L 31/0236 Special surface textures
• CPC Class Codes: H01L 31/02363 of the semiconductor body itself, e.g. textured active layers
• CPC Class Codes: H01L 31/046 PV modules composed of a plurality of thin film solar cells deposited on the same substrate
• CPC Class Codes: H01L 31/1872 Recrystallisation
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A photovoltaic device includes a supporting layer, a semiconductor layer stack, and a conductive and light transmissive layer. The supporting layer is proximate to a bottom surface of the device. The semiconductor layer stack includes first and second semiconductor sub-layers, with the second sub-layer having a crystalline traction of at least approximately 85%. A conductive and light transmissive layer between the supporting layer and the semiconductor layer stack, where an Ohmic contact exists between the first semiconductor sub-layer and the conductive and light transmissive layer.

Claims

13. A photovoltaic device comprising:

a substrate;

a reflective electrode located above the substrate,

a light transmissive electrode located above the reflective electrode;

a semiconductor layer stack between the reflective electrode and the light transmissive electrode, the semiconductor layer stack comprising first and second sub-layers, the second sub-layer comprising a polycrystalline semiconductor material having a crystalline fraction of at least approximately 85%; and

an optical spacer layer between the reflective electrode and the semiconductor layer stack, the optical spacer layer comprising a conductive and light transmissive material.

14. The photovoltaic device of claim 13, wherein the semiconductor layer stack comprises a third sub-layer above the second sub-layer, the first sub-layer doped with one of a p- and an n-type dopant, the third sub-layer doped with the other type of dopant.

15. The photovoltaic device of claim 14, wherein a dopant junction exists between the second and third sub-layers, the dopant junction having a junction diffusion width of approximately 100 nanometers or less.

16. The photovoltaic device of claim 14, wherein an Ohmic contact exists between the third sub-layer and the light transmissive electrode.

17. The photovoltaic device of claim 13, wherein the substrate has a softening point below 750 degrees Celsius.

18. The photovoltaic device of claim 13, wherein the substrate comprises approximately ten percent or more of Na₂O by weight.

19. The photovoltaic device of claim 13, wherein the substrate comprises a soda lime float glass.

20. The photovoltaic device of claim 13, wherein the substrate has a surface area of at least four square meters.

21. The photovoltaic device of claim 13, wherein the reflective electrode comprises one or more of silver, molybdenum, titanium, nickel, tantalum, aluminum, and tungsten.

22. The photovoltaic device of claim 13, wherein an Ohmic contact exists between the first sub-layer and the optical spacer layer.

23. The photovoltaic device of claim 13, wherein the second sub-layer comprises a hydrogenated polycrystalline semiconductor material having a final hydrogen content of less than about two atomic percent.

24. The photovoltaic device of claim 13, wherein the second sub-layer comprises a polycrystalline semiconductor material having an average crystalline grain size of at least about 50 nanometers.

25. The photovoltaic device of claim 13, wherein a crystalline fraction of the second sub-layer does not vary more than about 15% throughout a total thickness of the second sub-layer.

26. The photovoltaic device of claim 13, further including a second semiconductor layer stack between the semiconductor layer stack and the light transmissive electrode, the second semiconductor layer stack having a plurality of sub-layers of amorphous semiconductor material.

27. The photovoltaic device of claim 13, wherein a dopant junction exists between the first and second sub-layers, the dopant junction having a junction diffusion width of approximately 100 nanometers or less.

28. The photovoltaic device of claim 13, wherein a dopant junction exists between the first and second sub-layers, the dopant junction having a junction diffusion width of approximately 50 nanometers or less.

29. The photovoltaic device of claim 13, wherein the second sub-layer is deposited in an amorphous state after the optical spacer layer is deposited and a level of crystallinity of the second sub-layer is increased after the second sub-layer is deposited.

30. The photovoltaic device of claim 13, wherein the photovoltaic device comprises a plurality of cells, each of the cells having at least a portion of the reflective electrode, at least a portion of the light transmissive electrode, at least a portion of the semiconductor layer stack and at least a portion of the optical spacer layer, the reflective electrode of one cell electrically contacting the light transmissive electrode of an adjacent cell, the semiconductor layer stack configured to receive light through the light transmissive electrode and to provide a voltage difference between the reflective electrode and the light transmissive electrode when the light is received through the light transmissive electrode, the plurality of cells being configured to provide an additive voltage across adjacent cells.

31. The photovoltaic device of claim 13, wherein the first sub-layer comprises silicon carbide.

32. The photovoltaic device of claim 13, wherein the substrate has a surface area of at least approximately 5.72 square meters and converts incident light into electricity at an efficiency of at least approximately 8%.

33. A photovoltaic device comprising:

a light transmissive superstrate;

a light transmissive electrode located above the superstrate;

a reflective electrode located above the light transmissive electrode;

a semiconductor layer stack between the reflective electrode and the light transmissive electrode, the semiconductor layer stack comprising first and second sub-layers, the second sub-layer comprising a polycrystalline semiconductor material having a crystalline fraction of at least approximately 85%; and

an optical spacer layer between the reflective electrode and the semiconductor layer stack, the optical spacer layer comprising a conductive and light transmissive material.

34. The photovoltaic device of claim 33, wherein the semiconductor layer stack comprises a third sub-layer, the second sub-layer disposed between the first and third sub-layers, the first sub-layer doped with one of a p- and an n-type dopant, the third sub-layer doped with the other type of dopant.

35. The photovoltaic device of claim 34, wherein a dopant junction exists between the second and third sub-layers, the dopant junction having a junction diffusion width of approximately 100 nanometers or less.

36. The photovoltaic device of claim 34, wherein an Ohmic contact exists between the third sub-layer and the reflective electrode.

37. The photovoltaic device of claim 33, wherein the superstrate has a softening point below 750 degrees Celsius.

38. The photovoltaic device of claim 33, wherein the superstrate comprises approximately ten percent or more of Na₂O by weight.

39. The photovoltaic device of claim 33, wherein the superstrate comprises a soda lime float glass.

40. The photovoltaic device of claim 33, wherein the superstrate has a surface area of at least four square meters.

41. The photovoltaic device of claim 33, wherein the reflective electrode comprises one or more of silver, molybdenum, titanium, nickel, tantalum aluminum, and tungsten.

42. The photovoltaic device of claim 33, further comprising a buffer layer between the semiconductor layer stack and the light transmissive electrode, the buffer layer comprising a light transmissive and conductive layer, wherein an Ohmic contact exists between the first sub-layer and the buffer layer.

43. The photovoltaic device of claim 33, wherein the second sub-layer comprises a hydrogenated polycrystalline semiconductor material having a final hydrogen content of less than about two atomic percent.

44. The photovoltaic device of claim 33, wherein the second sub-layer comprises a polycrystalline semiconductor material having an average crystalline grain size of at least about 50 nanometers.

45. The photovoltaic device of claim 33, wherein a crystalline fraction of the second sub-layer does not vary more than about 15% throughout a total thickness of the second sub-layer.

46. The photovoltaic device of claim 33, wherein a dopant junction exists between the first and second sub-layers, the dopant junction having a junction diffusion width of approximately 100 nanometers or less.

47. The photovoltaic device of claim 33, wherein a dopant junction exists between the first and second sub-layers, the dopant junction having a junction diffusion width of approximately 50 nanometers or less.

48. The photovoltaic device of claim 33, wherein the second sub-layer is deposited in an amorphous state after the buffer layer is deposited and a level of crystallinity of the second sub-layer is increased after the second sub-layer is deposited.

49. The photovoltaic device of claim 33, wherein the photovoltaic device comprises a plurality of cells, each of the cells having at least a portion of the superstrate, at least a portion of the light transmissive electrode, at least a portion of the reflective electrode, at least a portion of the semiconductor layer stack and at least a portion of the optical spacer layer, the reflective electrode of one cell electrically contacting the light transmissive electrode of an adjacent cell, the semiconductor layer stack configured to receive light through the superstrate and the light transmissive electrode and to provide a voltage difference between the reflective electrode and the light transmissive electrode when the light is received, the plurality of cells being configured to provide an additive voltage across adjacent cells.

50. The photovoltaic device of claim 33, wherein the first sub-layer comprises silicon carbide.

51. The photovoltaic device of claim 33, wherein the superstrate has a surface area of at least approximately 5.72 square meters and the photovoltaic device converts incident light into electricity at a module efficiency of at least approximately 8%.

52. A method for manufacturing a photovoltaic device, the method comprising:

providing a supporting layer proximate to a bottom surface of the device;

depositing a conductive and light transmissive layer above the supporting layer;

depositing a semiconductor layer stack in an amorphous state above the conductive and light transmissive layer, the semiconductor layer stack comprising first and second sub-layers; and

increasing a level of crystallinity in the second sub-layer, the second sub-layer having a crystalline fraction of at least approximately 85% after increasing the level of crystallinity.

1. A photovoltaic device comprising:

a supporting layer proximate to a bottom surface of the device;

a semiconductor layer stack comprising first and second semiconductor sub-layers, the second sub-layer having a crystalline fraction of at least approximately 85%; and

a conductive and light transmissive layer between the supporting layer and the semiconductor layer stack, wherein an Ohmic contact exists between the first semiconductor sub-layer and the conductive and light transmissive layer.

2. The photovoltaic device of claim 1, wherein the semiconductor layer stack comprises a third sub-layer, the second sub-layer disposed between the first and third sub-layers, the first and third sub-layers each doped with oppositely-charged dopants.

3. The photovoltaic device of claim 2, further comprising a first dopant junction between the first and second sub-layers and a second dopant junction between the second and third sub-layers, a junction diffusion width of each of the first and second dopant junctions being approximately 100 nanometers or less.

4. The photovoltaic device of claim 1, wherein the supporting layer has a softening point below approximately 750 degrees Celsius.

5. The photovoltaic device of claim 1, wherein the supporting layer comprises a soda lime float glass.

6. The photovoltaic device of claim 1, wherein the conductive and light transmissive layer comprises one or more of zinc oxide, aluminum-doped zinc oxide, tin oxide indium tin oxide, fluorine doped tin oxide and titanium dioxide.

7. The photovoltaic device of claim 1, wherein the second sub-layer is deposited in an amorphous state above the conductive and light transmissive layer, a level of crystallinity of the second sub-layer being increased after the second sub-layer is deposited.

8. The photovoltaic device of claim 1, wherein the second sub-layer comprises a hydrogenated polycrystalline semiconductor material having a final hydrogen content of less than about two atomic percent.

9. The photovoltaic device of claim 1, wherein the crystalline fraction does not vary more than about 15% throughout a total thickness of the second sub-layer.

10. The photovoltaic device of claim 1, wherein the photovoltaic device comprises a plurality of photovoltaic cells, each of the cells comprising a reflective electrode, at least a portion of the supporting layer, at least a portion of the semiconductor layer stack, and at least a portion of the conductive and light transmissive layer, the reflective electrode being between the semiconductor layer stack and the supporting layer in each cell, the reflective electrode of one cell electrically contacting the conductive and light transmissive layer in an adjacent cell, the semiconductor layer stack configured to receive light through a top surface of the device and the conductive and light transmissive layer to provide a voltage difference between the reflective electrode and the conductive and light transmissive layer when the light is received, the plurality of cells being configured to provide an additive voltage across adjacent cells.

11. The photovoltaic device of claim 1, wherein the supporting layer comprises a light transmissive layer and the photovoltaic device comprises a plurality of photovoltaic cells, each of the cells comprising a reflective electrode, at least a portion of the supporting layer, at least a portion of the semiconductor layer stack, and at least a portion of the conductive and light transmissive layer, the reflective electrode being between a top surface of the photovoltaic device and the semiconductor layer stack in each cell, the reflective electrode of one cell electrically contacting the conductive and light transmissive layer in an adjacent cell, the semiconductor layer stack configured to receive light through the bottom surface, the supporting layer and the conductive and light transmissive layer to provide a voltage difference between the reflective electrode and the conductive and light transmissive layer when the light is received through a bottom surface of the photovoltaic device, the plurality of cells being configured to provide an additive voltage across adjacent cells.

12. The photovoltaic device of claim 1, wherein the supporting layer has a surface area of at least approximately 5.72 square meters and the photovoltaic device converts incident light into electricity at a module efficiency of at least approximately 8%.

53. The method of claim 52, wherein the semiconductor layer stack comprises a third sub-layer, the second sub-layer disposed between the first and third sub-layers, the first and third sub-layers each doped with oppositely-charged dopants.

54. The method of claim 53, wherein a first dopant junction exists between the first and second sub-layers and a second dopant junction exists between the second and third sub-layers, a junction diffusion width of each of the first and second dopant junctions being approximately 100 nanometers or less after increasing the level of crystallinity in the second sub-layer.

55. The method of claim 52, wherein the increasing the level of crystallinity occurs after depositing the conductive and light transmissive layer.

56. The method of claim 52, wherein the supporting layer has a softening point below 750 degrees Celsius.

57. The method of claim 52, wherein the supporting layer comprises a soda lime float glass.

58. The method of claim 52, wherein the conductive and light transmissive layer comprises one or more of zinc oxide, aluminum-doped zinc oxide, tin oxide, indium tin oxide, fluorine doped tin oxide and titanium dioxide.

59. The method of claim 52, wherein a dopant junction exists between the first and second sub-layers, the dopant junction having a junction diffusion width that does not increase by more than approximately 100 nanometers during increasing the crystallinity of the second sub-layer.

60. The method of claim 52, wherein a dopant junction exists between the first and second sub-layers, the dopant junction having a junction diffusion width that does not increase by more than approximately 50 nanometers during increasing the crystallinity of the second sub-layer.

61. The method of claim 52, further comprising hydrogenating the semiconductor layer stack after increasing the level of crystallinity in the second sub-layer, the semiconductor layer stack having a final hydrogen content of less than about two atomic percent after hydrogenating the semiconductor layer stack.

62. The method of claim 52, wherein the crystalline fraction does not vary more than about 15% throughout a total thickness of the second sub-layer.

63. The method of claim 52, wherein the semiconductor layer stack remains in a solid state during increasing the level of crystallinity in the second sub-layer.

64. The method of claim 52, wherein increasing the level of crystallinity comprises exposing the second sub-layer to one or more electron beams.

65. The method of claim 52, wherein increasing the level of crystallinity comprises heating the second sub-layer at a rate of at least approximately 400 degrees Celsius per second.

66. The method of claim 52, wherein increasing the level of crystallinity comprises exposing the second sub-layer to one or more continuous-wave laser beams.

53-1. The method of claim 52, wherein the semiconductor layer stack comprises a third sub-layer, the second sub-layer disposed between the first and third sub-layers, the first and third sub-layers each doped with different types of dopants.

67. A method for manufacturing a photovoltaic device, the method comprising:

providing a substrate;

depositing a reflective electrode above the substrate;

depositing an optical spacer layer above the reflective electrode, the optical spacer layer comprising a conductive and light transmissive material;

depositing a semiconductor layer stack above the optical spacer layer, the semiconductor layer stack deposited in an amorphous state, the semiconductor layer stack comprising first and second sub-layers;

increasing a level of crystallinity in the second sub-layer, the second sub-layer having a crystalline fraction of at least 85% after increasing the level of crystallinity; and

depositing a light transmissive electrode above the semiconductor layer stack.

68. The method of claim 67, wherein the semiconductor layer stack comprises a third sub-layer, the second sub-layer disposed between the first and third sub-layers, the first sub-layer doped with one of a p and an n-type dopant, the third sub-layer doped with the other type of dopant.

69. The method of claim 68, wherein a dopant junction exists between the second and third sub-layers, the dopant junction having a junction diffusion width of approximately 100 nanometers or less.

70. The method of claim 68, wherein an Ohmic contact exists between the third sub-layer and the light transmissive electrode.

71. The method of claim 67, wherein the substrate has a softening point below 750 degrees Celsius.

72. The method of claim 67, wherein the substrate comprises approximately ten percent or more of Na₂O by weight.

73. The method of claim 67, wherein the substrate comprises a soda lime float glass.

74. The method of claim 67, wherein the reflective electrode comprises one or more of silver, molybdenum, titanium, nickel, tantalum, aluminum, and tungsten.

75. The method of claim 67, wherein an Ohmic contact exists between the first sub-layer and the optical spacer layer.

76. The method of claim 67, further comprising hydrogenating the semiconductor layer stack after increasing the level of crystallinity in the second sub-layer, the semiconductor layer stack having a hydrogen content of less than about two atomic percent after hydrogenating the semiconductor layer stack.

77. The method of claim 67, wherein the second sub-layer comprises a microcrystalline semiconductor material having an average crystalline grain size of at least about 50 nanometers after increasing the level of crystallinity in the second sub-layer.

78. The method of claim 67, wherein a crystalline fraction of the second sub-layer does not vary more than about 15% throughout a total thickness of the second sub-layer after increasing the level of crystallinity in the second sub-layer.

79. The method of claim 67, further comprising depositing a second semiconductor layer stack between the semiconductor layer stack and the light transmissive electrode, the second semiconductor layer stack having a plurality of sub-layers of amorphous semiconductor material.

80. The method of claim 67, wherein a dopant junction exists between the first and second sub-layers, a junction diffusion width of the dopant junction not increasing by more than approximately 100 nanometers during increasing the level of crystallinity in the second sub-layer.

81. The method of claim 67, wherein a dopant junction exists between the first and second sub-layers, a junction diffusion width of the dopant junction not increasing by more than approximately 50 nanometers during increasing the level of crystallinity in the second sub-layer.

82. The method of claim 67, wherein the first sub-layer comprises silicon carbide.

83. The method of claim 67, wherein the substrate has a surface area of at least approximately 5.72 square meters and the photovoltaic device converts incident light into electricity at a module efficiency of at least approximately 8%.

84. The method of claim 67, wherein the semiconductor layer stack remains in a solid state during increasing the level of crystallinity in the second sub-layer.

85. The method of claim 67, wherein increasing the level of crystallinity comprises exposing the second sub-layer to one or more electron beams.

86. The method of claim 67, wherein increasing the level of crystallinity comprises heating the second sub-layer at a rate of at least approximately 400 degrees Celsius per second.

87. The method of claim 67, wherein increasing the level of crystallinity comprises exposing the second sub-layer to one or more continuous-wave laser beams.

88. A method for manufacturing a photovoltaic device, the method comprising:

providing a light transmissive superstrate;

depositing a light transmissive electrode above the superstrate;

depositing a semiconductor layer stack above the light transmissive electrode, the semiconductor layer stack deposited in an amorphous state, the semiconductor layer stack comprising first and second sub-layers;

increasing a level of crystallinity in the second sub-layer, the second sub-layer having a crystalline fraction of at least 85% after increasing the level of crystallinity;

depositing an optical spacer layer above the semiconductor layer stack, the optical spacer layer comprising a conductive and light transmissive material; and

depositing a reflective electrode above the optical spacer layer.

89. The method of claim 88, wherein the semiconductor layer stack comprises a third sub-layer, the second sub-layer disposed between the first and third sub-layers, the first and third sub-layers doped with oppositely-charged dopants.

90. The method of claim 89, wherein a first dopant junction exists between the first and second sub-layers and a second dopant junction exists between the second and third sub-layers, a junction diffusion width of each of the first and second dopant junctions being approximately 100 nanometers or less after increasing the level of crystallinity in the second sub-layer.

91. The method of claim 89, wherein an Ohmic contact exists between the third sub-layer and the optical spacer layer.

92. The method of claim 88, wherein increasing the level of crystallinity occurs after depositing the light transmissive electrode.

93. The method of claim 88, wherein the superstrate has a softening point below 750 degrees Celsius.

94. The method of claim 88, wherein the superstrate comprises approximately ten percent or more of Na₂O by weight.

95. The method of claim 88, wherein the superstrate comprises a float glass.

96. The method of claim 88, wherein the reflective electrode comprises one or more of silver, molybdenum, titanium, nickel, tantalum, aluminum, and tungsten.

97. The method of claim 88, wherein an Ohmic contact exists between the first sub-layer and the light transmissive electrode.

98. The method of claim 88, further comprising hydrogenating the semiconductor layer stack after increasing the level of crystallinity in the second sub-layer, the semiconductor layer stack having a hydrogen content of less than about two atomic percent after hydrogenating the semiconductor layer stack.

99. The method of claim 88, wherein the second sub-layer has an average crystalline grain size of at least about 50 nanometers after increasing the level of crystallinity in the second sub-layer.

100. The method of claim 88, wherein a crystalline fraction of the second sub-layer does not vary more than about 15% throughout a total thickness of the second sub-layer after increasing the level of crystallinity in the second sub-layer.

101. The method of claim 88, wherein a dopant junction exists between the first and second sub-layers, the dopant junction having a junction diffusion width of approximately 100 nanometers or less.

102. The method of claim 88, wherein a dopant junction exists between the first and second sub-layers, the dopant junction having a junction diffusion width of approximately 50 nanometers or less.

103. The method of claim 88, wherein the first sub-layer comprises silicon carbide.

104. The method of claim 88, wherein the superstrate has a surface area of at least approximately 5.72 square meters and the photovoltaic device converts incident light into electricity at a module efficiency of at least approximately 8%.

105. The method of claim 88, wherein increasing the level of crystallinity comprises exposing the second sub-layer to one or more electron beams.

106. The method of claim 88, wherein increasing the level of crystallinity comprises beating the second sub-layer at a rate of at least approximately 400 degrees Celsius per second.

107. The method of claim 88, wherein increasing the level of crystallinity comprises exposing the second sub-layer to one or more continuous-wave laser beams.

108. A photovoltaic device comprising:

a first electrode comprising a light transmissive material;

a second electrode comprising a reflective material; and

a semiconductor layer between the first electrode and the second electrode, the semiconductor layer comprising at least three sub-layers, including a first sub-layer, a second sub-layer and a third sub-layer, the second sub-layer comprising a polycrystalline semiconductor material having a crystalline fraction of at least approximately 85%, wherein at least two dopant junctions exist in the semiconductor layer, a first junction between the first and second sub-layers and a second junction between the second and third sub-layers.

109. The photovoltaic device of claim 108, wherein the reflective electrode comprises one or more of silver, molybdenum, titanium, nickel, tantalum, aluminum, and tungsten.

110. The photovoltaic device of claim 108, wherein the second sub-layer comprises a hydrogenated polycrystalline semiconductor material having a final hydrogen content of less than about two atomic percent.

111. The photovoltaic device of claim 108, wherein the second sub-layer comprises a polycrystalline semiconductor material having an average crystalline grain size of at least about 50 nanometers.

112. The photovoltaic device of claim 108, wherein the second sub-layer comprises a polycrystalline semiconductor material having an average crystalline grain size of at least about 100 nanometers.

113. The photovoltaic device of claim 108, wherein a crystalline fraction of the second sub-layer does not vary more than about 15% throughout a total thickness of the second sub-layer, the total thickness extending between the first and third sub-layers.

114. The photovoltaic device of claim 108, further including a second semiconductor layer stack between the semiconductor layer stack and the light transmissive electrode, the second semiconductor layer stack having a plurality of sub-layers of amorphous semiconductor material.

115. The photovoltaic device of claim 108, wherein each of the first and second junctions have junction diffusion widths of approximately 50 nanometers or less.

116. The photovoltaic device of claim 108, wherein the third sub-layer comprises an amorphous semiconductor.

117. The photovoltaic device of claim 108, wherein the semiconductor layer comprises a fourth sub-layer of amorphous semiconductor material.

118. The photovoltaic device of claim 108, further comprising at least one of a substrate and a superstrate having a surface area of at least approximately two meters by two meters.

119. The photovoltaic device of claim 108, further comprising at least one of a substrate and a superstrate having a surface area of at least approximately 2.6 meters by 2.2 meters.

120. The photovoltaic device of claim 108, wherein the crystalline fraction does not vary by more than 15% across the entire substrate area.