×

Thermally Conductive Adhesive Composition and Adhesion Method

  • US 20080295959A1
  • Filed: 05/16/2008
  • Published: 12/04/2008
  • Est. Priority Date: 05/30/2007
  • Status: Abandoned Application
First Claim
Patent Images

1. A thermally conductive adhesive composition comprising:

  • (A) a polymerizable (meth)acrylic compound comprising at least one of a (meth)acrylic monomer and a (meth)acrylic oligomer;

    (B) an organic peroxide;

    (C) a thermally conductive filler; and

    (D) a vanadium compound,wherein the volume ratio α

    of the polymerizable (meth)acrylic compound (A) to the thermally conductive filler (C) determined by the following formula (1) is 0.40 to 0.65;


    Volume ratio α

    =Volume of Thermally conductive filler (C)/(Volume of Polymerizable(meth)acrylic compound (A)+Volume of Thermally conductive filler (C)) 



    (1)wherein 40 to 100% by mass of the thermally conductive filler (C) is subjected to hydrophobic surface treatment.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×