Thermally Conductive Adhesive Composition and Adhesion Method

• US 20080295959A1
• Filed: 05/16/2008
• Published: 12/04/2008
• Est. Priority Date: 05/30/2007
• Status: Abandoned Application

• Current Assignee: Polymatech Company Limited
• Original Assignee: Polymatech Company Limited
• Inventors: Nakanishi, Yutaka, Aoki, Hisashi, Ishigaki, Tsukasa
• Application Number:
  US12/121,938
• Publication Number:
  US 20080295959A1
• Time in Patent Office: Days
• US Class Current: 156/325
• CPC Class Codes: C08F 220/26 Esters containing oxygen in addition to the carboxy oxygen
• CPC Class Codes: C09J 133/04 Homopolymers or copolymers of esters C09J143/04 takes precedence
• CPC Class Codes: C09J 4/06 Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00

Abstract

A thermally conductive adhesive composition contains a polymerizable (meth)acrylic compound (A) comprising at least one of a (meth)acrylic monomer and a (meth)acrylic oligomer, an organic peroxide (B), a thermally conductive filler (C) and a vanadium compound (D). The volume ratio α of the polymerizable (meth)acrylic compound (A) to the thermally conductive filler (C) determined by the following formula (1) is 0.40 to 0.65. 40 to 100% by mass of the thermally conductive filler (C) is subjected to hydrophobic surface treatment.

Volume ratio α=Volume of Thermally conductive filler (C)/(Volume of Polymerizable(meth)acrylic compound (A)+Volume of Thermally conductive filler (C))   (1)

Claims

1. A thermally conductive adhesive composition comprising:

(A) a polymerizable (meth)acrylic compound comprising at least one of a (meth)acrylic monomer and a (meth)acrylic oligomer;

(B) an organic peroxide;

(C) a thermally conductive filler; and

(D) a vanadium compound,

wherein the volume ratio α

of the polymerizable (meth)acrylic compound (A) to the thermally conductive filler (C) determined by the following formula (1) is 0.40 to 0.65;

Volume ratio α

=Volume of Thermally conductive filler (C)/(Volume of Polymerizable(meth)acrylic compound (A)+Volume of Thermally conductive filler (C)) 

 

(1)

wherein 40 to 100% by mass of the thermally conductive filler (C) is subjected to hydrophobic surface treatment.

2. The thermally conductive adhesive composition according to claim 1, wherein hydrophobic surface treatment subjected to the thermally conductive filler (C) is surface treatment by stearic acid or a titanate coupling agent.

3. The thermally conductive adhesive composition according to claim 1, wherein the thermally conductive adhesive composition contains a hydroperoxide as the organic peroxide (B).

4. The thermally conductive adhesive composition according to claim 3, wherein the thermally conductive adhesive composition contains cumene hydroperoxide as a hydroperoxide.

5. The thermally conductive adhesive composition according to claim 1, wherein the content of the organic peroxide (B) in the thermally conductive adhesive composition is 5 to 10 parts by mass based on 100 parts by mass of the polymerizable (meth)acrylic compound (A) comprising at least one of a (meth)acrylic monomer and a (meth)acrylic oligomer.

6. The thermally conductive adhesive composition according to claim 1, wherein the thermally conductive filler (C) has a particulate form and the thermally conductive filler (C) having a particulate form has an average particle size of 0.2 to 10 μ

m.

7. The thermally conductive adhesive composition according to claim 1, wherein the thermally conductive adhesive composition further contains (E) a condensate of an aldehyde and an amine, and the composition comprises:

a base resin containing the polymerizable (meth)acrylic compound (A), the organic peroxide (B), and the thermally conductive filler (C); and

a primer containing the vanadium compound (D) and the condensate of an aldehyde and an amine (E).

8. The thermally conductive adhesive composition according to claim 7, wherein the content of the condensate of an aldehyde and an amine (E) in the thermally conductive adhesive composition is 50 to 200 parts by mass based on 5 parts by mass of the vanadium compound (D).

9. The thermally conductive adhesive composition according to claim 1, wherein the thermally conductive adhesive composition comprises a first agent and a second agent, and

wherein both of the first agent and the second agent each contain the polymerizable (meth)acrylic compound (A), and only one of the first agent and the second agent further contains the organic peroxide (B), and only the other of the first agent and the second agent contains the vanadium compound (D).

10. A method for adhering a first adherend and a second adherend to each other using the thermally conductive adhesive composition according to claim 7, the method comprising:

applying the base resin to the first adherend;

applying the primer to the second adherend; and

joining the first adherend and the second adherend to each other so that the base resin and the primer contact each other on the joined interface to thereby adhere the first adherend and the second adherend to each other.

11. The method for adhering a first adherend and a second adherend to each other using the thermally conductive adhesive composition according to claim 9, the method comprising:

mixing the first agent and the second agent;

applying the mixture of the first agent and the second agent to at least one of the first adherend and the second adherend; and

joining the first adherend and the second adherend to each other so that the mixture of the first agent and the second agent is present on the joined interface to thereby adhere the first adherend and the second adherend to each other.