EXHAUST ASSEMBLY FOR A PLASMA PROCESSING SYSTEM
First Claim
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1. A plasma processing system configured to process a substrate with plasma, comprising:
- a plasma processing chamber configured to facilitate the formation of a processing plasma;
a substrate holder coupled to said plasma processing chamber and configured to support said substrate;
a plasma generation system coupled to said plasma processing chamber and configured to form said processing plasma from a process gas in a process space adjacent said substrate;
a vacuum pumping system coupled to said plasma processing chamber and configured to evacuate said process gas;
an exhaust assembly coupled to said plasma processing chamber around said substrate holder and separating said process space from a pumping space coupled to said vacuum pumping system; and
an electrical power source coupled to said exhaust assembly and configured to form a secondary plasma in order to alter said processing plasma.
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Abstract
An exhaust assembly is described for use in a plasma processing system, whereby secondary plasma is formed in the exhaust assembly between the processing space and chamber exhaust ports in order to reduce plasma leakage to a vacuum pumping system, or improve the uniformity of the processing plasma, or both. The exhaust assembly includes a powered exhaust plate in combination with a ground electrode is utilized to form the secondary plasma surrounding a peripheral edge of a substrate treated in the plasma processing system.
26 Citations
17 Claims
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1. A plasma processing system configured to process a substrate with plasma, comprising:
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a plasma processing chamber configured to facilitate the formation of a processing plasma; a substrate holder coupled to said plasma processing chamber and configured to support said substrate; a plasma generation system coupled to said plasma processing chamber and configured to form said processing plasma from a process gas in a process space adjacent said substrate; a vacuum pumping system coupled to said plasma processing chamber and configured to evacuate said process gas; an exhaust assembly coupled to said plasma processing chamber around said substrate holder and separating said process space from a pumping space coupled to said vacuum pumping system; and an electrical power source coupled to said exhaust assembly and configured to form a secondary plasma in order to alter said processing plasma. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification