Camera module package

• US 20080296577A1
• Filed: 05/30/2008
• Published: 12/04/2008
• Est. Priority Date: 05/31/2007
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Lim, Chang Hyun, Kim, Dae Jun, Doh, Jae Cheon, Yuan, Jingli, Jeung, Won Kyu
• Application Number:
  US12/155,268
• Publication Number:
  US 20080296577A1
• Time in Patent Office: Days
• US Class Current: 257/59
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device

Abstract

There is provided a camera module package including: a substrate having an image sensor disposed on one surface thereof and a pad electrically connected to the image sensor; a protective cap adhered onto the substrate by an adhesive surrounding the image sensor to seal the image sensor, the protective cap transmitting light; and a supporting part surrounding the protective cap, the supporting part adhering and supporting at least one lens formed corresponding to the image sensor. The camera module package is reduced in thickness and size, and minimized in an error of a focal length between the lens and the image sensor, thereby achieving accuracy and high reliability.

Claims

1. A camera module package comprising:

a substrate having an image sensor disposed on one surface thereof and a pad electrically connected to the image sensor;

a protective cap adhered onto the substrate by an adhesive surrounding the image sensor to seal the image sensor, the protective cap transmitting light; and

a supporting part surrounding the protective cap, the supporting part adhering and supporting at least one lens formed corresponding to the image sensor.

2. The camera module package of claim 1, wherein a micro lens is disposed on a top of the image sensor.

3. The camera module package of claim 1, wherein the supporting part is formed without interruption inside the pad.

4. The camera module package of claim 3, further comprising a pad protection cap on a top of the pad.

5. The camera module package of claim 1, wherein the supporting part is formed without interruption to cover a top of the pad.

6. The camera module package of claim 1, wherein the protective cap has an infrared filter applied on one surface thereof.

7. The camera module package of claim 1, further comprising a through electrode which is disposed in the device wafer connecting to the pad on one surface of the device wafer.

8. The camera module package of claim 7, further comprising an external electrode on another surface of the device wafer connecting to the through electrode.

9. A method of manufacturing a camera module package, the method comprising:

providing a base wafer having a protective cap disposed thereon;

providing a device wafer having an image sensor disposed on one surface thereof to correspond to the protective cap, an adhesive formed around the image sensor and a pad electrically connected to the image sensor;

adhering the protective cap onto the device wafer by the adhesive;

forming a through electrode on one surface of the device wafer to connect to the pad and forming an external electrode on another surface of the device wafer to connect to the through electrode;

bonding the device wafer and the lens wafer together on the one surface of the device wafer by a supporting part, the supporting part covering the pad and surrounding the protective cap; and

dicing a camera module package including the image sensor into individual units.

10. The method of claim 9, wherein the providing a base wafer comprises bonding the protective cap on the one surface of the base wafer and removing a portion excluding the protective cap from the protective cap wafer.

11. The method of claim 9, further comprising removing the base wafer, before the supporting part is provided.

12. The method of claim 9, further comprising polishing the device wafer before the forming an external electrode.

13. A method of manufacturing a camera module package, the method comprising:

providing a base wafer having a protective cap and a pad protection cap disposed thereon;

providing a device wafer having an image sensor disposed on one surface thereof to correspond to the protective cap, a pad formed on an area corresponding to the pad protection cap to electrically connect to the image sensor and an adhesive formed around the image sensor and on the pad, respectively;

bonding the protective cap and the pad protection cap onto the device wafer by the adhesive;

forming a through electrode on one surface of the device wafer to connect to the pad and forming an external electrode on another surface of the device wafer to connect to the through electrode;

bonding the device wafer and the lens wafer onto the one surface of the device wafer by a supporting part, the supporting part formed without interruption between the protective cap and the pad protection cap;

dividing the lens wafer into individual lenses to expose the pad protection cap to the outside; and

dicing a camera module package including the image sensor into individual units.

14. The method of claim 13, wherein the providing a base wafer comprises bonding a protective cap wafer on the one surface of the base wafer and removing portions excluding the protective cap and the pad protection cap from the protection cap wafer.

15. The method of claim 13, further comprising removing the base wafer before the supporting part is provided.

16. The method of claim 13, further comprising polishing the device wafer before the forming an external electrode.