Light-emitting device

• US 20080296608A1
• Filed: 05/29/2008
• Published: 12/04/2008
• Est. Priority Date: 05/31/2007
• Status: Abandoned Application

• Current Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Original Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Inventors: Tajima, Hiroyuki, Takeda, Shigeo, Demukai, Yukihiro
• Application Number:
  US12/155,061
• Publication Number:
  US 20080296608A1
• Time in Patent Office: Days
• US Class Current: 257/100
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

A light-emitting element 10 is fixed on a lead frame 20 with a die-bonding member 13. The light-emitting element 10 is sealed with a silicone resin 22 and further sealed with an epoxy resin 24 from above the silicone resin 22. The die-bonding member 13 is obtainable by dispersing titanium oxide into an alicyclic epoxy resin obtained by curing an alicyclic epoxy compound with a curing agent.

Claims

1. A light emission device, comprising:

a light-emitting element fixed on a substrate with a die-bonding member; and

a resin sealing member for sealing the light-emitting element with a transparent resin;

wherein the die-bonding member is obtainable by dispersing titanium oxide into an alicyclic epoxy resin obtainable by curing an alicyclic epoxy compound with a curing agent.

2. The light emission device according to claim 1, wherein the resin sealing member comprises a silicone sealing part for sealing the light-emitting element with a silicone resin and an epoxy sealing part for further sealing the silicone sealing part with an epoxy resin.

3. The light emission device according to claim 1, wherein the silicone sealing part comprises a methyl-based silicone resin.

4. The light emission device according to claim 2, wherein the epoxy sealing part comprises an alicyclic epoxy resin.

5. The light emission device according to claim 1, wherein the titanium oxide is anatase titanium oxide.