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Chip assembly

  • US 20080296709A1
  • Filed: 05/30/2007
  • Published: 12/04/2008
  • Est. Priority Date: 05/30/2007
  • Status: Active Grant
First Claim
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1. An assembly, comprising:

  • a package element having a top surface;

    an integrated circuit chip having a top surface, a bottom surface, and contacts exposed at the top surface, the package element being disposed below the chip with the top surface of the package element facing toward the bottom surface of the chip;

    at least one spacer element residing between the top surface of the package element and the bottom surface of the chip, the at least one spacer element forming a substantially closed cavity between the package element and the chip.

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