CURRENT SENSOR

• US 20080297138A1
• Filed: 07/11/2008
• Published: 12/04/2008
• Est. Priority Date: 08/26/2003
• Status: Active Grant

• Current Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Original Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Inventors: Taylor, William P., Doogue, Michael C.
• Granted Patent: US 7,598,601 B2
• Time in Patent Office: Days
• US Class Current: 324/117.00H
• CPC Class Codes: G01R 1/18 Screening arrangements against electric or magnetic fields, e.g. against earth's field
• CPC Class Codes: G01R 15/202 using Hall-effect devices Hall elements in arrangements for measuring electrical power G01R21/08
• CPC Class Codes: G01R 15/207 Constructional details independent of the type of device used
• CPC Class Codes: H01L 2224/37147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/37686 with a principal constituent of the material being a non metallic, non metalloid inorganic material
• CPC Class Codes: H01L 2224/3769 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/40095 Kinked
• CPC Class Codes: H01L 2224/40245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4826 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73221 Strap and wire connectors
• CPC Class Codes: H01L 2224/84 using a strap connector
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/37 of an individual strap connector
• CPC Class Codes: H01L 24/40 of an individual strap connector
• CPC Class Codes: H01L 24/41 of a plurality of strap connectors
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/91 : Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor position. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The current sensor can also include an electromagnetic shield disposed between the current conductor portion and the magnetic field sensing elements.

Claims

1. A current sensor, comprising:

a lead frame having a plurality of leads;

a first current conductor portion comprising at least two of the plurality of leads;

a substrate having first and second opposing surfaces, the first surface proximate to said first current conductor portion and the second surface distal from said first current conductor portion;

one or more magnetic field transducers disposed on the first surface of said substrate; and

an electromagnetic shield disposed proximate to the one or more magnetic field transducers and between the first surface of the substrate and the first current conductor portion, wherein said electromagnetic shield has at least one feature selected to reduce an eddy current induced in said electromagnetic shield.

2. The current sensor of claim 1, wherein said electromagnetic shield is substantially planar and has a shape selected to reduce a path length of a closed loop current path in said electromagnetic shield.

3. The current sensor of claim 1, wherein said electromagnetic shield comprises a slot.

4. The current sensor of claim 1, wherein said electromagnetic shield comprises:

a central member; and

a plurality of non-overalapping members coupled to the central member.

5. The current sensor of claim 1, wherein said electromagnetic shield comprises a plurality of interdigitated members.

6. The current sensor of claim 1, wherein a position of the at least one feature relative to said one or more magnetic field transducers is selected to reduce an affect of the eddy current upon the one or more magnetic field transducers.

7. The current sensor of claim 1, wherein each one of the leads has a bend in a direction selected to result in each one of the leads being closer to the first surface of the substrate than to the second surface of the substrate throughout a length of the lead.

8. The current sensor of claim 1, wherein said first current conductor portion comprises a coupling of the at least two of the plurality of leads and wherein said one or more magnetic field transducers are disposed proximate to said first current conductor portion.

9. The current sensor of claim 1, further comprising a second current conductor portion deposited on the first surface of the substrate, disposed proximate to the one or more magnetic field transducers, and coupled to the first current conductor portion.

10. The current sensor of claim 1, further comprising an insulating layer disposed between the first surface of the substrate and the first current conductor portion.

11. The current sensor of claim 1, wherein said substrate has at least one bonding pad coupled to a corresponding one of the plurality of leads with a bond wire.

12. The current sensor of claim 1, wherein said substrate is coupled to said lead frame with a selected one of a solder ball, a gold bump, a eutectic and high lead solder bump, a no-lead solder bump, a gold stud bump, a polymeric conductive bump, an anisotropic conductive paste, or a conductive film coupled to a corresponding one of the plurality of leads.

13. The current sensor of claim 1, wherein at least a portion of said first current conductor portion has a T-shaped cross section.

14. The current sensor of claim 1, wherein at least a portion of said first current conductor portion has a rectangular cross section having a minimum dimension less than a thickness of said lead frame.

15. The current sensor of claim 1, further comprising at least one amplifier disposed on said substrate.

16. The current sensor of claim 1, further comprising a shunt conductor portion comprising a coupling of the at least two of the plurality of leads.

17. The current sensor of claim 16, wherein said first current conductor portion and said shunt conductor portion are adapted to pass respective portions of a current and wherein said shunt conductor portion has a size and a shape selected to provide a selected resistance, which is selected to pass a selected portion of the current.

24. The current sensor of claim 1, wherein the substrate and the lead frame are relatively disposed in a flip chip arrangement.

18. A current sensor, comprising:

a lead frame having a plurality of leads;

a substrate having first and second opposing surfaces;

one or more magnetic field transducers disposed on the first surface of said substrate; and

an electromagnetic shield disposed proximate to the one or more magnetic field transducers, wherein said electromagnetic shield has at least one feature selected to reduce an eddy current induced in said electromagnetic shield.

19. The current sensor of claim 18, wherein said electromagnetic shield is substantially planar and has a shape selected to reduce a path length of a closed loop current path in said electromagnetic shield.

20. The current sensor of claim 18, wherein said electromagnetic shield comprises a slot.

21. The current sensor of claim 18, wherein said electromagnetic shield comprises:

a central member; and

a plurality of non-overalapping members coupled to the central member.

22. The current sensor of claim 18, wherein said electromagnetic shield comprises a plurality of interdigitated members.

23. The current sensor of claim 18, wherein a position of the at least one feature relative to said one or more magnetic field transducers is selected to reduce an affect of the eddy current upon the one or more magnetic field transducers.

25. The current sensor of claim 18, wherein the substrate and the lead frame are relatively disposed in a flip chip arrangement.