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Package Structure for an Inductance Element

  • US 20080297294A1
  • Filed: 10/05/2007
  • Published: 12/04/2008
  • Est. Priority Date: 05/29/2007
  • Status: Abandoned Application
First Claim
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1. A package structure for use in an inductance element, comprising:

  • a casing having two opposite first sidewalls and two opposite second sidewalls, all of which defining a receiving space for receiving the inductance element;

    a plurality of conductive terminals, each having an upper end and a lower end, the upper end extending from an upper portion of one of the first sidewall and being located in a recess defined by the two opposite sidewalls to electrically connect to the inductance element, the lower end extending from a lower portion of the first sidewall and being adapted to electrically connect to a circuit board;

    a lid for covering the inductance element; and

    a positioning device disposed between the lid and at lest one of the first sidewalls to position the lid onto the casing.

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