Lithographic support structure

• US 20080297758A1
• Filed: 06/26/2008
• Published: 12/04/2008
• Est. Priority Date: 03/31/2003
• Status: Abandoned Application

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Tinnemans, Patricius Aloysius Jacobus, Donders, Sjoerd Nicolaas Lambertus, Hoogkamp, Jan Frederik, Buis, Edwin Johan, Tegenbosch, Henricus Gerardus, Visser, Raimond, Van De Sande, Henricus Johannes Adrianus, Van Den Berg, Johannes Charles Adrianus, Van Elp, Jan, Vervoort, Thijs, Van Meer, Aschwin Lodewijk Hendricus, Spanjers, Franciscus Andreas Cornelis, Vermeulen, Johannes Petrus Martinus Ber, Smulders, Patrick Johannes Cornelus
• Application Number:
  US12/213,930
• Publication Number:
  US 20080297758A1
• Time in Patent Office: Days
• US Class Current: 355/72
• CPC Class Codes: B25J 13/089 Determining the position of the robot with reference to its environment
• CPC Class Codes: G03F 7/70741 Handling masks outside exposure position, e.g. reticle libraries
• CPC Class Codes: G03F 7/7075 Handling workpieces outside exposure position, e.g. SMIF box
• CPC Class Codes: G03F 7/70925 Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H02N 13/00 Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Abstract

The invention relates to a transfer apparatus for transferring an object (W). the transfer apparatus comprises a gripper (15) for at least one of gripping the object (W) at a first position and then releasing the object (W) at a second position proximate to a receiver (20) and releasing the object (W) at a first position after gripping the object at a second position proximate to the receiver (20). The transfer apparatus is further provided with a measurement device (22) arranged to measure the relative position of the gripper (15) with respect to the receiver (20) in at least one dimension. Further, a relative position error is defined with respect to a desired relative position based on the relative position measured. The relative position of the gripper (15) and the receiver (20) are adjusted for minimizing the relative position error in the second position.

Claims

1-10. -10. (canceled)

11. A lithographic clamping structure, comprising:

a Johnson-Raybeck effect type clamp having an upper surface to clamp an object; and

an oxidized layer, provided on the upper surface of the Johnson-Raybeck effect type clamp, to minimize heating effects transferred to the object.

23. The lithographic clamping structure of claim 11, further comprising a controller coupled to the Johnson-Raybeck effect type clamp and configured to provide a clamping and de-clamping voltage to the Johnson-Raybeck effect type clamp, wherein the controller is arranged to generate the de-clamping voltage with a decaying AC-profile.

24. The lithographic clamping structure of claim 23, wherein the decaying AC-profile is a RF AC profile.

25. The lithographic clamping structure of claim 11, wherein the Johnson-Raybeck effect type clamp is part of a moveable robot arm configured to support and move the object, and wherein the object comprises a substrate onto which a beam of radiation is to be projected.

13. A lithographic support structure to hold and move an object, comprising:

a Johnson-Raybeck effect type clamp; and

a controller coupled to the Johnson-Raybeck effect type clamp and configured to provide a clamping and de-clamping voltage to the Johnson-Raybeck effect type clamp, wherein the controller is arranged to generate the de-clamping voltage with a decaying AC-profile.

12. The lithographic clamping structure of claim 13, wherein the decaying AC-profile is an RF AC profile.

26. The lithographic support structure of claim 13, wherein the Johnson-Raybeck effect type clamp is part of a moveable robot arm configured to support and move the object, and wherein the object comprises a substrate onto which a beam of radiation is to be projected.

14. Method of cleaning a substrate holder in a lithographic apparatus including a clamp for clamping a substrate, the method comprising:

introducing a substrate in the lithographic apparatus;

clamping the substrate to the substrate holder such that the substrate contacts the substrate holder at a first location;

de-clamping the substrate from the substrate holder;

repeating the clamping and de-clamping a number of times such that the substrate contacts the substrate table repeatedly at the first location, or at a location other than the first location, or both at the first location and the location other than the first location.

27. The method of claim 14, further comprising, after a de-clamping of the substrate, rotating or shifting the substrate before a further clamping of the rotated or shifted substrate.

15-18. -18. (canceled)

19. A lithographic apparatus, comprising:

a support structure configured to support a patterning device, the patterning device configured to impart a desired pattern onto a beam of radiation;

a substrate holder configured to hold a substrate;

a projection system configured to project the patterned beam onto a target portion of the substrate; and

a Johnson Raybeck effect type clamp configured to clamp the substrate, or the patterning device, or both the substrate and the patterning device, the clamp having an upper surface and an oxidized layer, provided on the upper surface, to minimize heating effects transferred to the substrate and/or the patterning device.

28. The lithographic apparatus of claim 19, further comprising a controller coupled to the Johnson-Raybeck effect type clamp and configured to provide a clamping and de-clamping voltage to the Johnson-Raybeck effect type clamp, wherein the controller is arranged to generate the de-clamping voltage with a decaying AC-profile.

29. The lithographic apparatus of claim 28, wherein the decaying AC-profile is a RF AC profile.

30. The lithographic apparatus of claim 19, further comprising a moveable robot arm configured to support and move the substrate, or the patterning device, or both the substrate and the patterning device, the moveable robot arm comprising the Johnson-Raybeck effect type clamp.

20. A lithographic apparatus, comprising:

a support structure configured to support a patterning device, the patterning device configured to impart a desired pattern onto a beam of radiation;

a substrate holder configured to hold a substrate;

a projection system configured to project the patterned beam onto a target portion of the substrate;

a clamp configured to clamp the substrate to the substrate holder such that the substrate contacts the substrate holder at a first location; and

a processor configured to instruct repeated clamping and de-clamping of the substrate by the clamp, such that the substrate contacts the substrate holder repeatedly at the first location, or at a location other than the first location, or both at the first location and the location other than the first location.

31. The lithographic apparatus of claim 20, further comprising a robot configured to, after a de-clamping of the substrate, rotate or shift the substrate before a further clamping of the rotated or shifted substrate.

21. (canceled)

22. A device manufacturing method, comprising:

providing a substrate via a clamping structure, the clamping structure comprising a Johnson-Raybeck effect type clamp having an upper surface and an oxidized layer on the upper surface;

providing a beam of radiation;

imparting a desired pattern onto the beam of radiation using a patterning device; and

projecting the patterned beam of radiation onto a target portion of the substrate.

32. The method of claim 22, further comprising providing a clamping and de-clamping voltage to the Johnson-Raybeck effect type clamp, wherein the de-clamping voltage has a decaying AC-profile.

33. The method of claim 32, wherein the decaying AC-profile is a RF AC profile.

34. The method of claim 22, wherein the Johnson-Raybeck effect type clamp is part of a moveable robot arm supporting and moving the substrate.