LIGHT EMITTING APPARATUS, RESIN MOLDING DEVICE COMPOSING LIGHT EMITTING DEVICE, METHOD FOR PRODUCING THE SAME

• US 20080298063A1
• Filed: 05/30/2008
• Published: 12/04/2008
• Est. Priority Date: 05/31/2007
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Hayashi, Masaki
• Granted Patent: US 7,777,417 B2
• Time in Patent Office: Days
• US Class Current: 362/249.01
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: B29C 45/1671 with an insert
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 2933/0075 relating to heat extraction or cooling elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements

Abstract

A light emitting apparatus includes a plurality of light emitting devices. A first lead and a second lead compose a lead pair. The first and second leads are electrically connected to the light emitting devices. A plurality of the light emitting devices is mounted on the base. The lead pairs are arranged generally symmetrically with respect to the base as the center line of the light emitting apparatus. The first and second leads are electrically insulated from each other. A first resin molding member covers at least parts of the base and the lead pairs. Thus, the first resin molding member, the base, and the lead pairs are integrally formed. A recessed portion is formed in the first resin molding member. The recessed portion is filled with a second resin molding member. The first and second resin molding members are formed of a thermosetting resin material.

Claims

1. A light emitting apparatus comprising:

a plurality of light emitting devices;

a base that is provided with the light emitting devices mounted thereon;

a plurality of first and second leads that are electrically connected to the light emitting devices;

a first resin molding member that is formed of resin that covers at least partially the base and the first and second leads so that the first resin molding member is formed integrally with the base and the first and second leads; and

a second resin molding member that is in contact with at least a part of the first resin molding member and covers the light emitting devices, wherein

the first and second resin molding members are formed of a thermosetting resin material, wherein

a recessed portion is formed in the first resin molding member on a light emitting device mount surface side of the base to open upward and to have a side surface, wherein

the first and second leads are partially exposed in a bottom surface area of the recessed portion, wherein

a plurality of sets of lead pairs are arranged generally symmetrically with respect to the base, and each of the lead pairs is composed of the first lead and the second lead.

2. The light emitting apparatus according to claim 1, wherein the light emitting device includes first and second electrodes, wherein

the first lead includes

a first inner lead portion that includes a connection part that is exposed in the bottom surface area of the recessed portion and is electrically connected to the first electrode of the light emitting device, and a first lead embedded part that is covered by the first resin molding member, and

a first outer lead portion that extends from the first inner lead portion outward of the first resin molding member and is exposed externally of the first resin molding member, wherein

the second lead includes

a second inner lead portion that includes a connection part that is exposed in the bottom surface area of the recessed portion and is electrically connected to the second electrode of the light emitting device, and a second lead embedded part that is covered by the first resin molding member, and

a second outer lead portion that extends from the second inner lead portion outward of the first resin molding member and is exposed externally of the first resin molding member.

3. The light emitting apparatus according to claim 1, wherein the base is at least partially exposed in the bottom surface area of the recessed portion in the first resin molding member, wherein the light emitting devices are mounted in the exposed part of the base.

4. The light emitting apparatus according to claim 2, wherein the base and the connection parts of the first and second leads are spaced away and are insulated from each other.

5. The light emitting apparatus according to claim 1, wherein the base is at least partially exposed from the first resin molding member on a back surface of the base opposite to the mount surface on which the light emitting devices are mounted.

6. The light emitting apparatus according to claim 5, wherein the first and second leads are at least partially exposed from the first resin molding member on back surfaces of the first and second leads opposite to mount surfaces of the first and second leads that are electrically connected to the light emitting devices.

7. The light emitting apparatus according to claim 6, wherein at least two of the exposed portions of the back surfaces of the base and the first and second leads are arranged coplanar with each other.

8. The light emitting apparatus according to claim 6, wherein a thermally conductive heat dissipation member is at least partially coupled onto the exposed portions of the back surfaces of the base and the first and second leads.

9. The light emitting apparatus according to claim 1, wherein the first resin molding member is formed by transfer molding.

10. The light emitting apparatus according to claim 1, wherein the first resin molding member is formed of at least one material selected from the group consisting of epoxy resin, denatured epoxy resin, silicone resin, denatured silicone resin, acrylate resin, urethane resin, and polyimide resin.

11. The light emitting apparatus according to claim 1, wherein the first resin molding member contains at least one material selected from the group consisting of filler, diffusion material, pigment, fluorescent material, reflexive material, light shielding material, ultraviolet absorption material, antioxidant material, and mold release agent.

12. The light emitting apparatus according to claim 1, wherein the second resin molding member contains at least one material selected from the group consisting of filler, diffusion material, pigment, fluorescent material, reflexive material, ultraviolet absorption material, and antioxidant material.

13. The light emitting apparatus according to claim 1, wherein protection devices are mounted on the first or second leads, and the protection devices are covered by the first resin molding member.

14. A resin molding device comprising:

a base;

a plurality of first and second leads to be electrically connected to light emitting devices to be mounted on the base; and

a first resin molding member that at least partially covers the base and the first and second leads so that the first resin molding member is formed integrally with the base and the first and second leads, wherein

two sets of lead pairs are arranged generally symmetrically with respect to the base, and each of the lead pairs is composed of the first lead and the second lead, wherein

a recessed portion is formed in the resin molding device on a mount surface side of the base capable of being provided with the light emitting devices to open upward and to have a side surface, wherein

the first and second leads are partially exposed in a bottom surface area of the recessed portion, wherein

the first lead includes

a first inner lead portion that includes a connection part that is exposed in the bottom surface area of the recessed portion and can be electrically connected to the light emitting device, and a first lead embedded part that is covered by the first resin molding member, and

a first outer lead portion that extends from the first inner lead portion outward of the first resin molding member and is exposed externally of the first resin molding member, wherein

the second lead includes

a second inner lead portion that includes a connection part that is exposed in the bottom surface area of the recessed portion and can be electrically connected to the light emitting device, and a second lead embedded part that is covered by the first resin molding member, and

a second outer lead portion that extends from the second inner lead portion outward of the first resin molding member and is exposed externally of the first resin molding member, wherein

the first resin molding member is formed of a thermosetting resin material.

15. The resin molding device according to claim 14, wherein the base is insulated from the first and second leads.

16. The resin molding device according to claim 14, wherein the base is at least partially exposed on a back surface of the base opposite to the mount surface.

17. The resin molding device according to claim 16, wherein the first and second leads are at least partially exposed on back surfaces of the first and second leads opposite to mount surfaces of the first and second leads that can be electrically connected to the light emitting device.

18. The resin molding device according to claim 17, wherein at least two of the exposed portions of the back surfaces of the base and the first and second leads are arranged coplanar with each other.

19. The resin molding device according to claim 17, wherein thermally conductive heat dissipation members are at least partially connected onto the exposed portions of the back surfaces of the base and the first and second leads.

20. The resin molding device according to claim 14, wherein the resin molding member is formed by transfer molding.

21. The resin molding device according to claim 14, wherein the resin molding member is formed of at least one material selected from the group consisting of epoxy resin, denatured epoxy resin, silicone resin, denatured silicone resin, acrylate resin, urethane resin, and polyimide resin.

22. The resin molding device according to claim 14, wherein the resin molding member contains at least one material selected from the group consisting of filler, diffusion material, pigment, fluorescent material, reflexive material, light shielding material, ultraviolet absorption material, antioxidant material, and mold release agent.

23. The resin molding device according to claim 14, wherein protection devices are mounted on the first or second leads, and the protection devices are covered by the first resin molding member.

24. A production method of a light emitting apparatus including

a plurality of light emitting devices,

a base that is provided with the plurality of light emitting devices mounted thereon,

a plurality of first and second leads that are electrically connected to the light emitting devices,

a first resin molding member that is formed integrally with the base and the first and second leads;

the first resin molding member having a recessed portion that is formed on a light emitting device mount surface side of the base to open upward and to have a side surface, and is provided with the plurality of light emitting devices that are mounted in a bottom surface area of the recessed portion on the base and are aligned in a plurality of rows generally in parallel to each other, and

a second resin molding member that covers the light emitting devices, wherein the method comprising;

a first step that arranges the base, and the first and second leads so that the base, and the first and second leads are spaced away, and arranges a plurality of sets of lead pairs are arranged generally symmetrically with respect to the base, wherein each of the lead pairs is composed of the first lead and the second lead, the first step sandwiching the upper and lower surfaces of the first and second leads by upper and lower dies, wherein the upper die has recessed and protruding parts corresponding to the shape of the recessed portion and comes in contact with at least parts of the upper surfaces of the first and second leads, and the lower die is opposed to the upper die and comes in contact with at least parts of the lower surfaces of the first and second leads;

a second step that fills recessed parts that are defined by the first and second leads, and the opposed upper and lower dies with a first thermosetting resin material by transfer molding;

a third step that heats and cures the first thermosetting resin material to form the first resin molding member;

a fourth step that removes the upper die;

a fifth step that mounts the plurality of light emitting devices in the bottom surface area of the formed recessed portion on the base, and connects the plurality of light emitting devices to the sets of the lead pairs;

a sixth step that brings a second thermosetting resin material into contact with at least a part of the first resin molding member so that the second thermosetting resin material covers the light emitting devices; and

a seventh step that heats and cures the second thermosetting resin material to form the second resin molding member.

25. The production method of a light emitting apparatus according to claim 24, wherein protection devices are mounted on the upper surfaces of the first or second leads prior to the first step.

26. A production method of a resin molding device including

a base,

a plurality of first and second leads to be electrically connected to light emitting devices to be mounted on the base, and

a resin molding member that is formed integrally with the base and the plurality of first and second leads, the resin molding member having a recessed portion that is formed on a light emitting device mount surface side of the base to open upward and to have a side surface, wherein the method comprising:

a first step that arranges the base, and the first and second leads so that the base, and the first and second leads are spaced away, and arranges a plurality of sets of lead pairs are arranged generally symmetrically with respect to the base, wherein each of the lead pairs is composed of the first lead and the second lead, the first step sandwiching the upper and lower surfaces of the first and second leads by upper and lower dies, wherein the upper die has recessed and protruding parts corresponding to the shape of the recessed portion and comes in contact with at least parts of the upper surfaces of the first and second leads, and the lower die is opposed to the upper die and comes in contact with at least parts of the lower surfaces of the first and second leads;

a second step that fills recessed parts that are defined by the first and second leads, and the opposed upper and lower dies with a first thermosetting resin material by transfer molding;

a third step that heats and cures the first thermosetting resin material to form the first resin molding member; and

a fourth step that removes the upper die.