Adhesive Formulation, Method for Production and Use Thereof

• US 20080300347A1
• Filed: 10/26/2006
• Published: 12/04/2008
• Est. Priority Date: 10/31/2005
• Status: Abandoned Application

• Current Assignee: Ems-Chemie AG (Emesta Holding AG)
• Original Assignee: Ems-Chemie AG (Emesta Holding AG)
• Inventors: Kurz, Gunter, Senn, Manuel
• Application Number:
  US12/091,024
• Publication Number:
  US 20080300347A1
• Time in Patent Office: Days
• US Class Current: 524/86
• CPC Class Codes: C08G 18/58 Epoxy resins C08G18/42, C08G18/48 take precedence; reaction products of epoxy resins with at least equivalent amounts of compounds containing active hydrogen C08G18/6407, with at least equivalent amounts of amines C08G18/6415; polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen C08G18/003
• CPC Class Codes: C08G 18/8074 Lactams
• CPC Class Codes: C08L 9/08 Latex

Abstract

The invention relates to an adhesive formulation for the treatment of reinforcing layers which are provided for the production of reinforced polymer products, the adhesive formulation containing dissolved epoxide.

Claims

1. Adhesive formulation in the form of an aqueous dispersion with a solid content of 1 to 50% containing:

a) 0.001 to 5 mol of an epoxide with a molecular weight of 50-290 in dissolved form, relative to 1000 g of the total formulation

b) 0.1 to 20% of a totally or partially blocked isocyanate, as solid and

c) 0.1 to 40% of a resorcinol-formaldehyde-latex (RFL) as solid.

2. Adhesive formulation according to claim 1, wherein the solid content is 5 to 30%.

3. Adhesive formulation according to claim 1 which contains 0.002 to 0.20 mol epoxide in dissolved form, relative to 1000 g of the total formulation.

4. Adhesive formulation according to claim 1, wherein the epoxide is selected from the group consisting of polyglycidyl ethers, epoxy-novolak resins, polyfunctional alkylene epoxides, diglycide ethers and bisphenol-A based resins.

5. Adhesive formulation according to claim 1, wherein the formulation contains 0.0001 to 0.1 mol of a metal compound as catalyst in dissolved form, relative to 1000 g of the total formulation, the catalyst being selected from the metals zinc, strontium, cadmium, sodium, caesium, potassium, silver, barium, titanium, chromium, tin, antimony, manganese, iron, cobalt, nickel, cerium, uranium, copper, calcium, zinc, lead and zirconium.

6. Adhesive formulation according to claim 5, wherein the catalyst is a zinc compound selected from zinc acetate, zinc acetyl acetonate, zinc oxide, zinc chloride, zinc carbonate and/or zinc sulphate.

7. Adhesive formulation according to claim 1, wherein the isocyanate is blocked with a lactam.

8. Adhesive formulation according to claim 1, wherein the isocyanate is selected from 4,4-diisocyanate-diphenylmethane (MDI) and/or toluenediisocynate (TDI) and/or naphthyldiisocyanate (NDI).

9. Adhesive formulation according to claim 1, which contains in addition additives and/or dispersion agents.

10. Adhesive formulation according to claim 1, which contains 0.1 to 10% of blocked or partially blocked isocyanate as solid and 10 to 25% of RFL as solid.

11. Adhesive formulation according to claim 1, wherein the particle diameter of the isocyanate solids is <

5 μ

m.

12. A method for treating reinforcing layers during the production of reinforced polymer products comprising applying the adhesive formulation according to claim 1 to the reinforcing layers.

13. The method according to claim 12, wherein the adhesive formulation is produced immediately before the treatment by mixing the individual components.

14. The method according to claim 12, wherein the adhesive formulation is produced immediately before application by mixing the component c) (RFL) into the formulation already present as mixture with the components a) and b).

15. The method according to claim 12, wherein a non-activated tyre cord is treated.

16. Adhesive formulation according to claim 2 which contains 0.002 to 0.20 mol epoxide in dissolved form, relative to 1000 g of the total formulation.

17. Adhesive formulation according to claim 2, wherein the epoxide is selected from the group consisting of polyglycidyl ethers, epoxy-novolak resins, polyfunctional alkylene epoxides, diglycide ethers and bisphenol-A based resins.

18. Adhesive formulation according to claim 2, wherein the formulation contains 0.0001 to 0.1 mol of a metal compound as catalyst in dissolved form, relative to 1000 g of the total formulation, the catalyst being selected from the metals zinc, strontium, cadmium, sodium, caesium, potassium, silver, barium, titanium, chromium, tin, antimony, manganese, iron, cobalt, nickel, cerium, uranium, copper, calcium, zinc, lead and zirconium.

19. Adhesive formulation according to claim 2, wherein the catalyst is a zinc compound selected from zinc acetate, zinc acetyl acetonate, zinc oxide, zinc chloride, zinc carbonate and/or zinc sulphate.

20. Adhesive formulation according to claim 2, wherein the isocyanate is blocked with a lactam.