Semiconductor light emitting device

• US 20080303045A1
• Filed: 04/08/2008
• Published: 12/11/2008
• Est. Priority Date: 04/09/2007
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Kobayakawa, Masahiko, Hata, Yasunori
• Granted Patent: US 7,868,334 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 2201/09954 More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 3/3426 characterised by the leads
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the semiconductor light emitting element. The lead includes an exposed portion that is not covered by the resin package. The exposed portion includes a first portion and a second portion, where the first portion has a first mount surface oriented backward along the optical axis of the lens, and the second portion has a second mount surface oriented perpendicularly to the optical axis of the lens.

Claims

1. A semiconductor light emitting device comprising:

a semiconductor light emitting element;

a lead electrically connected to the semiconductor light emitting element; and

a resin package covering the semiconductor light emitting element and part of the lead, the resin package including a lens facing the semiconductor light emitting element;

wherein the lead includes an exposed portion extending outside of the resin package, the exposed portion comprising a first portion and a second portion, the first portion including a first mount surface oriented in a backward direction along an optical axis of the lens, the second portion including a second mount surface oriented in a direction perpendicular to the optical axis of the lens.

2. The semiconductor light emitting device according to claim 1, further comprising a third portion for connecting the first portion and the second portion to each other, wherein the third portion includes a surface perpendicular to both the first mount surface and the second mount surface.