LIGHT EMITTING DIODE PACKAGE HAVING MULTIPLE MOLDING RESINS

• US 20080303052A1
• Filed: 08/21/2008
• Published: 12/11/2008
• Est. Priority Date: 09/10/2004
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: LEE, Chung Hoon, LEE, Keon-Young, KIM, Do Hyung
• Granted Patent: US 7,737,463 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals. At least portions of the pair of lead terminals are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding resin covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented.

Claims

1. A light emitting diode package having multiple molding resins, comprising:

a heat sink support ring;

a heat sink inserted into the support ring;

at least two lead terminals disposed at both sides of the support ring and spaced apart from the support ring and heat sink;

a package main body molded with the heat sink and lead terminals to support the heat sink and lead terminals, the package main body having an opening through which the upper end of the heat sink and portions of the lead terminals are exposed;

at least a light emitting diode die mounted on a top surface of the heat sink;

bonding wires for electrically connecting the light emitting diode die and lead terminals;

a first molding resin covering the light emitting diode die; and

a second molding resin covering the first molding resin and having higher hardness than the first molding resin.

2. The light emitting diode package as claimed in claim 1, wherein the first molding resin has a Durometer Shore value of less than 50 A and the second molding resin has a Durometer Shore value of no less than 50 A.

3. The light emitting diode package as claimed in claim 2, wherein the first and second molding resins are formed of an epoxy or silicone resin.

4. The light emitting diode package as claimed in claim 3, wherein the second molding resin is formed in the shape of a lens.

5. The light emitting diode package as claimed in claim 1, wherein the heat sink has a base and a protrusion projecting upward from the center portion of the base and inserted into the support ring.

6. The light emitting diode package as claimed in claim 5, wherein the heat sink is further formed with a support ring receiving groove at a side of the protrusion to receive the support ring.

7. The light emitting diode package as claimed in claim 1, wherein the package main body is formed of a thermosetting resin or a thermoplastic resin by insert molding the lead terminals and heat sink.