Semiconductor device
First Claim
1. A semiconductor device comprising:
- an element layer including a semiconductor element; and
a pair of structure bodies, each of the pair of structure bodies including a stack of a plurality of fibrous bodies which are impregnated with an organic resin,wherein the element layer is fixed between the pair of structure bodies.
1 Assignment
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Accused Products
Abstract
To provide a semiconductor device which can increase reliability with respect to external force, especially pressing force, while the circuit size or the capacity of memory is maintained. A pair of structure bodies each having a stack of fibrous bodies of an organic compound or an inorganic compound, which includes a plurality of layers, especially three or more layers, is impregnated with an organic resin, and an element layer provided between the pair of structure bodies are included. The element layer and the structure body can be fixed to each other by heating and pressure bonding. Further, a layer for fixing the element layer and the structure body may be provided. Alternatively, the structure body fixed to an element layer can be formed in such a way that after a plurality of fibrous bodies is stacked over the element layer, the fibrous bodies are impregnated with an organic resin.
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Citations
34 Claims
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1. A semiconductor device comprising:
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an element layer including a semiconductor element; and a pair of structure bodies, each of the pair of structure bodies including a stack of a plurality of fibrous bodies which are impregnated with an organic resin, wherein the element layer is fixed between the pair of structure bodies. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor device comprising:
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an element layer including a semiconductor element; and a pair of structure bodies, each of the pair of structure bodies including a stack of a plurality of fibrous bodies which are impregnated with an organic resin, wherein a ratio of a thickness of one of the pair of structure bodies to a thickness of the other of the pair of structure bodies is greater than or equal to 0.8 and less than or equal to 1.2, and wherein the element layer is fixed between the pair of structure bodies. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A semiconductor device comprising:
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an element layer including a semiconductor element; and a pair of structure bodies, each of the pair of structure bodies including a stack of a plurality of fibrous bodies which are impregnated with an organic resin, wherein each of the plurality of fibrous bodies uses warp yarns and weft yarns each formed by bundling a plurality of single yarns of an organic compound or an inorganic compound, and - View Dependent Claims (22, 23, 24, 25, 26, 27)
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28. A semiconductor device comprising:
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an element layer including a semiconductor element; and a pair of structure bodies, each of the pair of structure bodies including a stack of a plurality of fibrous bodies which are impregnated with an organic resin, wherein each of the plurality of fibrous bodies uses warp yarns and weft yarns each formed by bundling a plurality of single yarns of an organic compound or an inorganic compound, wherein at least two fibrous bodies of the plurality of fibrous bodies have different directions of the warp yarns and the weft yarns, and wherein the element layer is fixed between the pair of structure bodies. - View Dependent Claims (29, 30, 31, 32, 33, 34)
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Specification