EMI SHIELDING OF DIGITAL X-RAY DETECTORS WITH NON-METALLIC ENCLOSURES

• US 20080304246A1
• Filed: 06/07/2007
• Published: 12/11/2008
• Est. Priority Date: 06/07/2007
• Status: Active Grant

• Current Assignee: GE Medical Systems Global Technology Company LLC (GE Healthcare Technologies, Inc.)
• Original Assignee: GE Medical Systems Global Technology Company LLC (GE Healthcare Technologies, Inc.)
• Inventors: Hennessy, William Andrew, Castleberry, Donald Earl, Vafi, Habib, Utschig, Michael John
• Granted Patent: US 7,687,790 B2
• Time in Patent Office: Days
• US Class Current: 361/818
• CPC Class Codes: A61B 6/102 Protection against mechanical damage, e.g. anti-collision devices
• CPC Class Codes: A61B 6/4233 using matrix detectors

Abstract

An imaging system is provided having an EMI shield configured to shield one or more imaging components. The EMI shield includes a first material having a first plurality of conductive elements integrally formed within a first nonconductive material and also includes a generally nonconductive exterior. A method is provided for shielding EMI in an imaging system. The method includes providing an EMI shielding enclosure that includes a first material having a first plurality of conductive elements disposed in a first non-conductive material, and a second material having a second plurality of conductive elements disposed in a second non-conductive material, wherein the first plurality of conductive elements engages the second plurality of conductive elements to form a conduction path. Another method for shielding EMI in an imaging system is provided, that includes providing an EMI shielding enclosure having a first material that has a non-conductive surface and a second EMI shielding material disposed on the non-conductive surface of the first material.

Claims

1. An imaging system, comprising:

an electromagnetic interference (EMI) shield configured to shield one or more imaging components from electromagnetic interference, wherein the EMI shield comprises a first material having a first plurality of conductive elements integrally formed within a first nonconductive material, wherein the first material has a first generally nonconductive exterior.

2. The imaging system of claim 1, wherein the EMI shield surrounds an image detector panel.

3. The imaging system of claim 1, wherein the EMI shield at least substantially defines a panel-shaped portable housing.

4. The imaging system of claim 1, comprising an imaging component shielded by the EMI shield.

5. The imaging system of claim 4, wherein the imaging component comprises an x-ray component.

6. The imaging system of claim 1, wherein first plurality of conductive elements comprise fibers, particles, or a combination thereof.

7. The imaging system of claim 1, wherein the first material comprises a composite material, a compounded plastic, or a combination thereof.

8. The imaging system of claim 1, wherein the first plurality of conductive elements comprises stainless steel fibers and the first nonconductive material comprises polycarbonate.

9. The imaging system of claim 1, wherein the first plurality of conductive elements comprises carbon particles, or fibers, or a combination thereof, and the first nonconductive material comprises polycarbonate.

10. The imaging system of claim 1, wherein the EMI shield comprises a first component made of the first material and a second component made of a second material different from the first material, wherein the second material comprises a second plurality of conductive elements integrally formed within a second nonconductive material, and the second material has a second generally nonconductive exterior.

11. The imaging system of claim 10, wherein the first and second plurality of conductive materials are conductively coupled together through the first and second generally nonconductive exteriors, respectively.

12. The imaging system of claim 1, comprising a secondary shielding layer.

13. The imaging system of claim 12, wherein the secondary shielding layer comprises a conductive paint, a metallic foil, a woven fabric, or a combination thereof.

14. A method for shielding electromagnetic interference in an imaging system, comprising:

providing an electromagnetic interference (EMI) shielding enclosure comprising a first material consisting essentially of a first plurality of conductive elements disposed in a first non-conductive material and a second material consisting essentially of a second plurality of conductive elements disposed in a second non-conductive material, wherein the first plurality of conductive elements engages the second plurality of conductive elements to form a conduction path.

15. The method of claim 14, comprising conductively coupling the first material with the second material by extending a conductive interface structure into the first material, into the second material, or a combination thereof.

16. The method of claim 15, wherein extending the conductive interface structure comprises inserting or overmolding a metal stud in the first material, or the second material, or a combination thereof.

17. The method of claim 14, comprising conductively coupling the first material with the second material by abrading a non-conductive surface of the first material, or the second material, or both, to reveal a conductive surface having at least some of the conductive elements exposed.

18. The method of claim 14, wherein the first material, or the second material, or both comprise a compounded plastic.

19. The method of claim 14, wherein the first material, or the second material, or both comprise a composite material.

20. The method of claim 14, comprising conductively coupling the first material with the second material by penetrating a non-conductive exterior of the first material, or the second material, or both, to create the conductive path between the first and second plurality of conductive elements.

21. An imaging system, comprising:

image detection circuitry; and

a portable enclosure disposed about the image detection circuitry and at least substantially made of first and second electromagnetic interference (EMI) shielding materials, wherein the first EMI shielding material comprises a first plurality of conductive elements disposed in a first non-conductive material and the second EMI shielding material comprises a second plurality of conductive elements disposed in a second non-conductive material, wherein the first and second plurality of conductive elements are conductively coupled together via a conduction path through non-conductive surfaces of the first and second EMI shielding materials.

22. The system of claim 21, wherein the conductive path comprises an overmolded part in the first EMI shielding material, or second EMI shielding material, or both.

23. The system of claim 21, wherein the conductive path comprises an abraded surface of the first EMI shielding material, or second EMI shielding material, or both.

24. The system of claim 21, wherein the image detection circuitry comprises an x-ray detector panel.

25. The system of claim 21, wherein the portable enclosure has a panel-shaped geometry.

26. The system of claim 21, wherein the first non-conductive material, or the second non-conductive material, or both, comprises polycarbonate, and the first plurality of conductive elements, or the second plurality of conductive elements, or both, comprises carbon fibers, or carbon powder, or stainless steel fibers, or a combination thereof.

27. The system of claim 21, wherein the first EMI shielding material or the second EMI shielding material is a compounded plastic.

28. The system of claim 21, wherein the first EMI shielding material or the second EMI shielding material is a composite material.

29. A method for shielding electromagnetic interference (EMI) in an imaging system, comprising:

providing an EMI shielding enclosure comprising a first material having a non-conductive surface, wherein a second EMI shielding material is disposed on the non-conductive surface of the first material.

30. The method of claim 29, comprising painting the second EMI shielding material onto the non-conductive surface of the first material.

31. The method of claim 29, comprising electroplating or electroless plating the EMI shielding material onto the non-conductive surface of the first material.

32. The method of claim 29, wherein the second material comprises a metallic foil.

33. The method of claim 29, wherein the second material comprises a woven fabric.