PROCESS FOR ELIMINATING BACTERIAL SPORES ON SURFACES AND SPORICIDE FOR USE IN THE PROCESS

• US 20080305183A1
• Filed: 06/06/2008
• Published: 12/11/2008
• Est. Priority Date: 06/08/2007
• Status: Abandoned Application

• Current Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Original Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Inventors: Squire, Mark Wallace, Croud, Vincent Brian, Weaver, Philip James, Ames, Kelly Ann
• Application Number:
  US12/134,340
• Publication Number:
  US 20080305183A1
• Time in Patent Office: Days
• US Class Current: 424/616
• CPC Class Codes: A01N 2300/00 Combinations or mixtures of active ingredients covered by classes A01N27/00 - A01N65/48 with other active or formulation relevant ingredients, e.g. specific carrier materials or surfactants, covered by classes A01N25/00 - A01N65/48
• CPC Class Codes: A01N 25/22 containing ingredients stabilising the active ingredients
• CPC Class Codes: A01N 59/00 Biocides, pest repellants or attractants, or plant growth regulators containing elements or inorganic compounds
• CPC Class Codes: A61L 2/186 Peroxide solutions
• CPC Class Codes: A61L 2/22 Phase substances, e.g. smokes, aerosols or sprayed or atomised substances
• CPC Class Codes: A61L 2202/26 Textiles, e.g. towels, beds, cloths

Abstract

A process for eliminating bacterial spores on surfaces by contacting the surfaces with an aqueous composition comprising 3 to 30 wt. % of hydrogen peroxide and having a pH value of 6 to 8 for a period of 1 to 60 minutes at a temperature of 0 to 35° C., wherein the process does not comprise any germination step.

Claims

1. A process for eliminating bacterial spores on a surface comprising contacting the surface with an aqueous composition comprising 3 to 30 wt. % of hydrogen peroxide and having a pH value of 6 to 8, for a period of 1 to 60 minutes at a temperature of 0 to 35°

C., wherein the process does not comprise any germination step.

2. The process of claim 1, wherein the aqueous composition comprises 5 to 25 wt. % of hydrogen peroxide.

3. The process of claim 1 or 2, wherein the aqueous composition has a pH value of 6.5 to 7.5.

4. The process of claim 1, wherein the aqueous composition comprises:

3 to 30 wt. % of hydrogen peroxide,

0.05 to 0.5 wt. % of alkali hydroxide,

0.005 to 1 wt. % of at least one transition metal sequestering agent,

0 to 10 wt. % of at least one nonionic surfactant,

0 to 10 wt. % of at least one further auxiliary additive selected from the group consisting of anionic surfactants, amphoteric surfactants, hard water sequestrants, corrosion inhibitors, viscosity modifiers, fragrances and dyes, and

the wt. % proportion remaining is water to make 100 wt. %.

5. The process of claim 4, wherein the aqueous composition comprises at least one auxiliary additive selected from the group consisting of anionic surfactants, amphoteric surfactants, nonionic surfactants, hard water sequestrants, corrosion inhibitors, viscosity modifiers, fragrances, dyes and peroxide decomposition stabilizers.

6. The process of claim 4 wherein the transition metal sequestering agents is selected from the group consisting of dimethylglyoxime, 1,4,7-triazacyclononane, dipyridylamine, ethylenediamine-N,N,N′

,N′

-tetraacetic acid and its alkali salts, diethylenetriamine-N,N,N′

,N′

,N″

-pentaacetic acid and its alkali salts, nitrilo-2,2′

,2″

-triacetic acid (NTA) and its alkali salts;

1,2-diaminocyclohexyl tetra(methylene phosphonic acid) and its alkali salts, diethylene triamine penta(methylene phosphonic acid) and its alkali salts, and ethylene diamine tetra(methylene phosphonic acid) and its alkali salts.

7. The process of claim 6, wherein the contact period is 5 to 30 minutes.

8. The process of claim 6, wherein the temperature is 15 to 25°

C.

9. The process of claim 1, wherein the surfaces are selected from the group consisting of wood, wood-based materials, plastics, ceramics, glass, concrete, metals and metal alloys.

10. The process of claim 9, wherein the surfaces are of substrates selected from the group consisting of floors, walls, ceilings, tiles, mirrors, windows, doors, door handles, handrails, furniture, equipment, apparatus housings and bed frames.

11. The process of claim 1, wherein the bacterial spores are selected from the group consisting of bacillus subtilis, bacillus cereus, clostridium sporogenes and clostridium difficile.

12. The process of claim 1, wherein the contact between the surfaces and the aqueous composition is made by an application method selected from the group consisting of wipe, brush, dip, rinse and spray application.

13. A sporicide in the form of an aqueous composition comprising 3 to 30 wt. % of hydrogen peroxide,

0.05 to 0.5 wt. % of alkali hydroxide,

0.005 to 1 wt. % of at least one transition metal sequestering agent,

0 to 10 wt. % of at least one nonionic surfactant,

0 to 10 wt. % of at least one further auxiliary additive selected from the group consisting of anionic surfactants, amphoteric surfactants, hard water sequestrants, corrosion inhibitors, viscosity modifiers, fragrances and dyes, and

the wt. % proportion remaining is water to make 100 wt. %;

and having a pH value of 6 to 8.

14. The sporicide of claim 13 comprising 5 to 25 wt. % of hydrogen peroxide.

15. The sporicide of claim 13 or 14, wherein the pH value is 6.5 to 7.5.

16. The sporicide of claim 13 wherein the transition metal sequestering agents is selected from the group consisting of dimethylglyoxime, 1,4,7-triazacyclononane, dipyridylamine, ethylenediamine-N,N,N′

,N′

-tetraacetic acid and its alkali salts, diethylenetriamine-N,N,N′

,N′

,N″

-pentaacetic acid and its alkali salts, nitrilo-2,2′

,2″

-triacetic acid and its alkali salts;

1,2-diaminocyclohexyl tetra(methylene phosphonic acid) and its alkali salts, diethylene triamine penta(methylene phosphonic acid) and its alkali salts, and ethylene diamine tetra(methylene phosphonic acid) and its alkali salts.

17. The sporicide of claim 16 comprising at least one auxiliary additive selected from the group consisting of anionic surfactants, amphoteric surfactants, nonionic surfactants, hard water sequestrants, corrosion inhibitors, viscosity modifiers, fragrances, dyes and peroxide decomposition stabilizers.