METHOD OF MANUFACTURING AN INTERCONNECT DEVICE WHICH FORMS A HEAT SINK AND ELECTRICAL CONNECTIONS BETWEEN A HEAT GENERATING DEVICE AND A POWER SOURCE

• US 20080307646A1
• Filed: 05/23/2008
• Published: 12/18/2008
• Est. Priority Date: 05/25/2007
• Status: Active Grant

• Current Assignee: Molex Incorporated
• Original Assignee: Molex Incorporated
• Inventors: Ramey, Samuel C., O'Connor, Kevin, Manlapaz, Charlie, Zaderej, Victor, Hagan, Timothy
• Granted Patent: US 7,992,294 B2
• Time in Patent Office: Days
• US Class Current: 29/874
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21V 19/0015 Fastening arrangements intended to retain light sources
• CPC Class Codes: F21V 19/04 with provision for changing light source, e.g. turret auxiliary devices for cleaning, placing, or removing incandescent lamps H01K3/32, fluorescent lamps H01J9/006
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/80 with pins or wires
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10325 Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49208 by assembling plural parts
• CPC Class Codes: Y10T 29/49222 forming array of contacts or terminals

Abstract

An interconnect device is used to mate a heat generating device to a power source. Plated components are provided on the interconnect device to provide a heat sink function for the heat generating device when the heat generating device is connected to the interconnect device, and to provide an electrical path between the heat generating device and the power source. A method of manufacturing same is also disclosed.

Claims

1. A method of manufacturing an interconnect device for connecting to a heat generating device and for connection to a power source, comprising:

forming a base member by a first shot of material;

overmolding a portion of said base member with a material in a second shot;

one of said first and second shots being a non-plateable, insulative material and the other of said shots being a plateable material;

forming a first plated component on said plateable material, said first plated providing a heat sink function for the heat generating device when the heat generating device is connected to the interconnect device; and

forming a second plated component on said plateable material, said second plated providing an electrical path between the heat generating device and the circuit member.

2. The method of claim 1, wherein the shot of a non-plateable material can be formed of a variety of different colors.

3. The method of claim 1, wherein said steps of forming said first plated component and forming said second plated component are performed simultaneously.

4. The method of claim 1, wherein during said step of forming said base member, a recess is formed therein, and thereafter inserting a heat spreader into said recess prior to forming said first plated component.

5. The method of claim 1, wherein during said step of forming said base member, a recess is formed therein, and thereafter inserting a heat spreader into said recess after forming said first plated component.

6. A method of manufacturing an interconnect device for connecting to a heat generating device and for connection to a power source, comprising:

molding a base member by injecting a first shot of material into a mold;

overmolding a portion of said base member by injecting a second shot of material around a portion of said first shot of material;

one of said first and second shots being a non-plateable, insulative material and the other of said shots being a plateable material;

forming a first plated component on said plateable material, said first plated providing a heat sink function for the heat generating device when the heat generating device is connected to the interconnect device; and

forming a second plated component on said plateable material, said second plated providing an electrical path between the heat generating device and the circuit member.

7. The method of claim 6, wherein said steps of forming said first plated component and forming said second plated component are performed simultaneously.

8. The method of claim 6, wherein during said step of molding said base member, a recess is formed therein, and thereafter inserting a heat spreader into said recess prior to forming said first plated component.

9. The method of claim 6, wherein during said step of molding said base member, a recess is formed therein, and thereafter inserting a heat spreader into said recess after forming said first plated component.

10. A method of manufacturing a device including both electrical circuitry and heat dissipating structure, comprising:

(a) forming a base member from a non-conductive material;

(b) determining a desired first pattern of electrical circuitry to be applied to the base member;

(c) determining a desired second pattern of heat dissipating structure to be applied to the base member; and

(d) simultaneously plating said base member with a conductive material to define said first and second patterns.

11. The method as defined in claim 10, wherein said plating step applies a material that is both electrically and thermally conductive.

12. The method as defined in claim 10, further including the step of pre-treating said base member along said first and second patterns prior to said plating step.

13. The method as defined in claim 12, wherein said pre-treating step includes chemically etching said base member.

14. The method as defined in claim 12, wherein said pre-treating step includes laser marking said base member.

15. A method of manufacturing a device comprising:

(a) molding a base member from a non-plateable material;

(b) overmolding said non-plateable base member with a plateable material to form a product;

(c) etching the product with an etchant;

(d) laser marking the product with a desired marking; and

(e) plating the product.

16. A method as defined in claim 15, wherein (a) comprises molding a palladium filled material, in a first shot, that is chromic acid etchable, (b) comprises overmolding, in a second shot, the palladium filled material with a laser direct structureable material that is etchable with caustic etchant to form the product, (c) comprises etching the product with chromic acid etchant, and (d) comprises laser marking the laser direct structureable material with the desired marking.

17. A method as defined in claim 16, wherein said desired marking is a circuit pattern.

18. A method as defined in claim 15, wherein (a) comprises molding a laser direct structureable material that can only be etched in caustic etchant in a first shot, (b) comprises overmolding the laser direct structureable material with a palladium filled material in a second shot thereby forming the product, the palladium filled material only being etchable in chromic acid etchant, (c) comprises etching the product in chromic acid etchant, and (d) comprises laser marking the laser direct structureable material with the desired marking.

19. A method as defined in claim 15, wherein (a) comprises molding a palladium filled material in a first shot, the palladium filled material being etchable in caustic acid etchant, (b) comprises overmolding the palladium filled material with a laser direct structureable material in a second shot thereby forming the product, said laser direct structureable material being etchable with chromic acid etchant and not etchable by caustic acid etchant, (c) comprises etching the product in caustic acid etchant, and (d) comprises laser marking the laser direct structureable material with the desired marking.

20. A method as defined in claim 15, wherein (a) comprises molding a laser direct structureable material in a first shot, the laser direct structureable material not being etchable by caustic acid etchant, (b) comprises overmolding the laser direct structureable material with a palladium filled material in a second shot thereby forming the product, the palladium filled material being etchable by caustic acid etchant, (c) comprises etching the product in caustic acid etchant, and (d) comprises laser marking the laser direct structureable material with the desired marking.

21. A method of manufacturing a device comprising:

(a) molding a base member from a laser direct structureable material;

(b) laser marking the product with a desired marking; and

(c) plating the product.