Method And Apparatus For Forming Microstructures

• US 20080307849A1
• Filed: 11/26/2004
• Published: 12/18/2008
• Est. Priority Date: 11/26/2004
• Status: Abandoned Application

• Current Assignee: Agency For Science Technology and Research (Government of Singapore)
• Original Assignee: Agency For Science Technology and Research (Government of Singapore)
• Inventors: Lim, Chee Yen, Xu, Yuan, Kais, Hbaieb, Tan, Yuan Ling Christina
• Application Number:
  US11/791,567
• Publication Number:
  US 20080307849A1
• Time in Patent Office: Days
• US Class Current: 72/355.4
• CPC Class Codes: A61M 2037/0053 Methods for producing microneedles
• CPC Class Codes: A61M 37/0015 by using microneedles
• CPC Class Codes: B21G 1/08 of hollow needles or needles with hollow end, e.g. hypodermic needles, larding-needles B21G1/10 takes precedence
• CPC Class Codes: B21J 13/02 Dies or mountings therefor
• CPC Class Codes: B21K 23/00 Making other articles

Abstract

A method of micro forming an array of microstructures comprising: advancing a punch having an array of protrusions (620) towards a sheet of material (640) disposed between the punch (620) and a die (630), each protrusion (625) shaped to deform the sheet of material (640) into a corresponding microstructure; providing a holder for holding the sheet of material (640) in place; and punching the sheet of material (640) with the protrusions on the punch (620) to form the array of microstructures on the sheet of material (640).

Claims

1. A method of microforming an array of microstructures comprising:

advancing a punch having an array of protrusions towards a sheet of material disposed between the punch and a die, each protrusion shaped to deform the sheet of material into a corresponding microstructure;

providing a holder for holding the sheet of material in place; and

punching the sheet of material with the protrusions on the punch to form the array of microstructures on the sheet of material.

2. The method as claimed in claim 1, wherein the microstructures comprise microneedles.

3. The method as claimed in claims 1 or 2, further comprising providing a substantially constant counteractive support on the sheet of material in areas of the respective microstructures during microforming.

4. The method as claimed in claim 3, wherein the substantially constant counteractive support is provided by the die.

5. The method as claimed in claim 4, wherein the die is a deformable die.

6. The method as claimed in claim 1, wherein an aspect ratio of the punch is chosen such that for a given thickness of the sheet of material, plane stress is reduced or avoided in the sheet of material during forming of the microstructures.

7. The method as claimed in claim 1, wherein each microstructure is formed with a solid tip.

8. The method as claimed in claim 1, wherein each microstructure is formed with a hole at a tip thereof.

9. The method as claimed in claim 8, wherein the curvature of the tip of each of the protrusions of the punch is chosen such that for a given thickness of the sheet of material, a hole or crack are created at an early stage of microforming, wherein

said hole or crack subsequently expand during microforming and result in an opening at the tip of each of the microstructures.

10. The method as claimed in claim 5, wherein the deformable die is made from a material that recovers at least partially after deformation.

11. The method as claimed in claim 10, wherein the material comprises semi-crystalline polymeric materials.

12. The method as claimed in claim 10, wherein the deformable die is made of a material selected from the group consisting of:

High Density Polyethylene (HOPE), Polypropylene (PP), Teflon (Polytetrafluoroethylene, PTFE), and Polyethylene terephthalate (PET).

13. The method as claimed in claim 1, further comprising applying a solid lubricant to the punch.

14. The method as claimed in claim 13, wherein the solid lubricant comprise a Ta-C coating.

15. The method as claimed in claim 1, further comprising coating on an inner surface of each of the microstructures for hardening the microstructures.

16. The method as claimed in claim 15, wherein the step of coating comprises an electroplating process.

17. The method as claimed in claim 16, wherein the electroplating process comprises nickel plating.

18. The method as claimed in claim 1, wherein the sheet of material is a metallic material chosen from the group consisting of:

steel, aluminium 1100 and copper (99%).

19. An apparatus for microforming an array of microstructures comprising:

a punch having an array of protrusions;

a die; and

a holder for holding a sheet of material in place during microforming, wherein each protrusion is shaped to deform the sheet of material into a corresponding microstructure; and

wherein the sheet of material is punched with the array of protrusions to form the array of microstructures.

20. The apparatus as claimed in claim 19, wherein the microstructures comprise microneedles.

21. The apparatus as claimed in claims 19 or 20, wherein a substantially constant counteractive support is provided to the sheet of material in areas of the respective microstructures during microforming.

22. The apparatus as claimed in claim 19, wherein the substantially constant counteractive support is provided by the die.

23. The apparatus as claimed in claim 22, wherein the die is a deformable die.

24. The apparatus as claimed in claim 19, wherein an aspect ratio of the punch is chosen such that for a given thickness of the sheet of material, plane stress is reduced or avoided in the sheet of material during forming of the microstructures.

25. The apparatus as claimed in claim 19, wherein each microstructure is formed with a solid tip.

26. The apparatus as claimed in claim 19, wherein each microstructure is formed with a hole at a tip thereof.

27. The apparatus as claimed in claim 26, wherein the curvature of the tip of each of the protrusions of the punch is chosen such that for a given thickness of the sheet of material, a hole or crack are created at an early stage of microforming, wherein

said hole or crack subsequently expand during microforming and result in an opening at the tip of each of the microstructures.

28. The apparatus as claimed in claim 23, wherein the deformable die is made from a material that recovers at least partially after deformation.

29. The apparatus as claimed in claim 28, wherein the material comprises semi-crystalline polymeric materials.

30. The apparatus as claimed in claim 28, wherein the deformable die is made of a material selected from the group consisting of:

High Density Polyethylene (HOPE), Polypropylene (PP), Teflon (Polytetrafluoroethylene, PTFE), and Polyethylene terephthalate (PET).

31. The apparatus as claimed in claim 19, wherein a solid lubricant is applied to the punch.

32. The apparatus as claimed in claim 31, wherein the solid lubricant comprise a Ta-C coating.

33. The apparatus as claimed in claim 19, further comprising means for applying a coating on an inner surface of each of the microstructures for hardening the microstructures.

34. The apparatus as claimed in claim 33, wherein the coating comprises an electroplating process.

35. The apparatus as claimed in claim 34, wherein the electroplating process comprises nickel plating.

36. The apparatus as claimed in claim 19, wherein the sheet of material is a metallic material chosen from the group consisting of:

steel, aluminium 1100 and copper (99%).