SYSTEM AND METHOD OF FABRICATING MICRO CAVITIES
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Accused Products
Abstract
A system and method for manufacturing micro cavity packaging enclosure at the wafer level using MEMS (MicroElectroMechanical Systems) process, wherein micro cavities are formed from epoxy-bonded single-crystalline silicon wafer as its cap, epoxy and deposited metal or insulator as at least part of its sidewall, on substrate wafers.
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Citations
36 Claims
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1-21. -21. (canceled)
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22. A plurality of vacuum or hermetic packaging enclosures for protecting MEMS devices formed on an IC wafer, each comprising
a sidewall formed from an adhesive layer and a deposited film; -
a cap formed from a silicon or glass wafer; a substrate or bottom wafer formed from said IC wafer;
whereinsaid adhesive layer forms a flat ring around said enclosure and bonds said cap wafer to said substrate wafer, wherein said adhesive layer is a spacer between said cap wafer and said substrate wafer, said deposited film is a metal or a ceramic layer, wherein said deposited film directly adheres to the entire side surfaces of said enclosure, including the entire side surfaces of said cap wafer and said adhesive layer, and at least a part of said top side surface of said substrate; and
said metal or ceramic layer does not cover said IC wafer completely. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36)
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23-29. -29. (canceled)
Specification