Method of Producing a Transponder and a Transponder

• US 20080309462A1
• Filed: 11/23/2006
• Published: 12/18/2008
• Est. Priority Date: 11/28/2005
• Status: Active Grant

• Current Assignee: NXP B.V. (NXP Semiconductors NV)
• Original Assignee: NXP B.V. (NXP Semiconductors NV)
• Inventors: Zenz, Christian, Rogy, Reinhard
• Granted Patent: US 8,968,510 B2
• Time in Patent Office: Days
• US Class Current: 340/10.1
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19043 being a resistor
• CPC Class Codes: H01L 2924/30105 Capacitance
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

In a method of producing a transponder (T1, T2, T3), a substrate (1, 91) is provided. The substrate (9, 91) comprises a first area (2), a second area (3) adjacent to the first area (2), and a first electric contact (8, 98) adjacent to the second area (3). An electric device (50, 80) is placed in or on the first area (2), preferably without touching the first electric contact (8, 98). Subsequently, a conductive glue (12) is applied on the second area (3) and on the first electric contact (8, 98) so that the conductive glue (12) electrically couples the first electric contact (8, 98) with the electric device (50, 80).

Claims

1. A method of producing a transponder, the method comprising the steps of:

providing a substrate which comprises a first area, a second area adjacent to said first area, and a first electric contact being attached on said substrate adjacent to said second area;

placing an electric device in or on said first area; and

applying a conductive glue on said second area and/or on said first electric contact so that said conductive glue electrically couples said first electric contact with said electric device.

2. The method of claim 1, wherein said electric device is placed in or on said first area without touching said first electric contact.

3. The method of claim 1, comprising a step of curing said conductive glue without pressing said electric device on said substrate.

4. The method of claim 1, comprising a step of conditioning said substrate to be provided, so that said first area has a first wettability and said second area has a second wettability which is higher than said first wettability.

5. The method of claim 1, comprising a step of placing said electric device in or on said first area and at least partly on said second area.

6. The method of claim 1, wherein said electric device has a bottom surface, a top surfaced and a plurality of side surfaces, at least one of which comprises electric contacts;

said method comprising a step of placing said electric device in or on said first area in such a way that said side surface comprising said electric contact faces said first electric contact.

7. The method of claim 6, wherein at least said side surface facing said first electric contact is inclined with respect to said bottom surface of said electric device.

8. The method of claim 1, comprising a step of applying said conductive glue at least partly on said electric device.

9. The method of claim 1, wherein said substrate comprises a third area adjacent to said first area and a second electric contact attached on said substrate adjacent to said third area.

10. The method of claim 9, comprising a step of conditioning said substrate to be provided, so that said first area has a first wettability, said second area has a second wettability, and said third area has a third wettability;

said first wettability being lower than said second and said third wettability.

11. The method of claim 9, wherein said substrate has an antenna attached thereon, and said antenna comprises at least one antenna end being represented by said first electric contact.

12. The method of claim 1, wherein said substrate is a first substrate, said method comprising the following additional steps:

mounting said first substrate on a second substrate on which an antenna with at least one antenna end is attached; and

electrically coupling said first electric contact with said at least one antenna end.

13. A transponder manufactured by means of a method as claimed in claim 11.