PROCESS FOR FABRICATING A FLEXIBLE ELECTRONIC DEVICE OF THE SCREEN TYPE, INCLUDING A PLURALITY OF THIN-FILM COMPONENTS
First Claim
1. A process for fabricating a flexible electronic device of the screen type, including a plurality of thin layer components on a glass support, the process comprising:
- preparing a starting support including a rigid bulk substrate and a glass film attached to the rigid bulk substrate by reversible direct bonding to obtain a debondable interface;
fabricating the plurality of thin layer components on the glass film; and
separating the glass film from the rigid bulk substrate by debonding the interface.
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Accused Products
Abstract
In the fabrication of a thin-film flexible electronic device of the screen type that includes a plurality of thin-film components on a glass support a starting support is prepared, including a rigid bulk substrate and a glass sheet fastened to the rigid bulk substrate by reversible direct bonding so as to obtain a removable interface. The plurality of thin-film components are fabricated on the glass sheet. The glass sheet is separated from the rigid bulk substrate by disassembling the interface and, the glass sheet and the plurality of thin-film components are transferred to a final support.
51 Citations
26 Claims
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1. A process for fabricating a flexible electronic device of the screen type, including a plurality of thin layer components on a glass support, the process comprising:
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preparing a starting support including a rigid bulk substrate and a glass film attached to the rigid bulk substrate by reversible direct bonding to obtain a debondable interface; fabricating the plurality of thin layer components on the glass film; and separating the glass film from the rigid bulk substrate by debonding the interface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 25, 26)
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- 18. A flexible electronic device of the screen type comprising a plurality of thin layer electronic components on a support comprising a glass film having a thickness at most equal to 100 microns, such that significant flexibility it is imparted thereto.
Specification