INTERCONNECT DEVICE WHICH FORMS A HEAT SINK AND ELECTRICAL CONNECTIONS BETWEEN A HEAT GENERATING DEVICE AND A POWER SOURCE

• US 20080310167A1
• Filed: 05/23/2008
• Published: 12/18/2008
• Est. Priority Date: 05/25/2007
• Status: Abandoned Application

• Current Assignee: Molex Incorporated
• Original Assignee: Molex Incorporated
• Inventors: RAMEY, SAMUEL C., HAGAN, TIMOTHY, O'CONNOR, KEVIN, MANLAPAZ, CHARLIE, ZADEREJ, VICTOR
• Application Number:
  US12/126,657
• Publication Number:
  US 20080310167A1
• Time in Patent Office: Days
• US Class Current: 362/294
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21V 19/0015 Fastening arrangements intended to retain light sources
• CPC Class Codes: F21V 19/04 with provision for changing light source, e.g. turret auxiliary devices for cleaning, placing, or removing incandescent lamps H01K3/32, fluorescent lamps H01J9/006
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/80 with pins or wires
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10325 Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49208 by assembling plural parts
• CPC Class Codes: Y10T 29/49222 forming array of contacts or terminals

Abstract

An interconnect device is used to mate a heat generating device to a power source. Plated components are provided on the interconnect device to provide a heat sink function for the heat generating device when the heat generating device is connected to the interconnect device, and to provide an electrical path between the heat generating device and the power source. A method of manufacturing same is also disclosed.

Claims

1. An interconnect device for connecting to a heat generating device and for connection to a power source, comprising:

a base member;

first and second plated components provided on said base member, said first plated component providing a heat sink function for the heat generating device when the heat generating device is connected to the interconnect device, and said second plated component providing an electrical path between the heat generating device and the power source; and

insulative material on said base member between said first plated component and said second plated component, said insulative material electrically isolating at least a portion of said second plated component from said first plated component.

2. The interconnect device of claim 1, wherein said second plated component is completely from said first plated component by said insulative material.

3. In combination, the interconnect device of claim 1 and an LED device.

4. The combination of claim 3, wherein said LED device is permanently mounted to the interconnect device and contacts on said LED device are connected to said second plated component.

5. The combination of claim 3, further including a heat spreader provided in said base member, said heat spreader being mounted underneath said LED device.

6. The combination of claim 5, wherein said heat spreader is a copper slug.

7. The combination of claim 5, wherein the heat spreader includes a base and a plurality of legs extending downwardly therefrom, said legs engaging said first plated component.

8. In combination, the interconnect device of claim 1, an LED device and a circuit member which provides the power source.

9. The combination of claim 8, wherein said LED device is permanently mounted to the interconnect device and contacts on said LED device are mated to said second plated component.

10. The interconnect device of claim 1, further including a base provided thereon, said base being capable of being mated with a lightbulb socket.

11. In combination, the interconnect device of claim 10 and an LED device.

12. The combination of claim 11, wherein said LED device includes a lens cover.

13. The interconnect device of claim 1, wherein said base member is three-dimensional.

14. The interconnect device of claim 1, wherein said base member further includes a reflector, said reflector being plated.

15. The interconnect device of claim 14, wherein said reflector is bowl-shaped.

16. The interconnect device of claim 14, wherein said reflector is electrically isolated from said first plated component.

17. The interconnect device of claim 1, further including a thermal pad attached to said base member.

18. The interconnect device of claim 17, further including a heat spreader provided in said base member, said heat spreader being mounted underneath said thermal pad.

19. The interconnect device of claim 1, wherein said base member includes a base and at least one leg extending therefrom, said first plated component provided on said base, and said second plated component provided on said at least one leg.

20. In combination, the interconnect device of claim 19 and an LED device.

21. The combination of claim 20, wherein said LED device is permanently mounted to the interconnect device and contacts on said LED device are connected to said second plated component.

22. In combination, the interconnect device of claim 19, an LED device and a circuit member which provides the power source.

23. The combination of claim 22, wherein said LED device is permanently mounted to the interconnect device and contacts on said LED device are connected to said second plated component.

24. The interconnect device of claim 19, wherein said base includes a thread form thereon for mating with a thread form on the heat generating device.

25. The interconnect device of claim 19, further including fins provided on said base, said fins extending from said base.

26. The interconnect device of claim 25, wherein said base includes a plurality of vias therethrough.

27. The interconnect device of claim 26, further including a heat spreader provided in said base.

28. The interconnect device of claim 27, wherein said heat spreader is a copper slug.

29. In combination, the interconnect device of claim 25 and an LED device.

30. The combination of claim 29, wherein said LED device is permanently mounted to the interconnect device and contacts on said LED device are mated to said second plated component.

31. The combination of claim 29, further including a heat spreader provided in said base member, said heat spreader being mounted underneath said LED device.

32. In combination, the interconnect device of claim 25, an LED device and a circuit member which provides the power source.

33. The combination of claim 32, wherein said LED device is permanently mounted to the interconnect device and contacts on said LED device are mated to said second plated component.

34. The interconnect device of claim 19, further including a cover provided on said base, wherein in use, the heat generating device is captured between said base and said cover.

35. The interconnect device of claim 34, wherein said cover includes at least two spring beams, said spring beams forming at least part of said electrical path.

36. The interconnect device of claim 34, wherein said cover is hingedly attached to said base.

37. The interconnect device of claim 36, wherein said base includes a locking member and said cover includes a locking member which mates with said locking member on said base.

38. The interconnect device of claim 34, wherein said cover is attached to said base by a snap-fit connection.

39. The interconnect device of claim 38, wherein said base includes a locking member and said cover includes a locking member which mates with said locking member on said base.

40. The interconnect device of claim 34, further including a clip for attaching said cover to said base.

41. The interconnect device of claim 34, wherein said cover is integrally formed with said base.

42. The interconnect device of claim 19, wherein at least three legs are provided and further including a pair of plated spring beams connected to two of said legs, said plated spring beams capable of connecting with said heat generating device and forming at least part of said second plated component.

43. The interconnect device of claim 42, wherein said base includes a passageway therein, the heat generating device being capable of being seated within said passageway.

44. The interconnect device of claim 19, each said leg further including an enlarged foot at a free end thereof.

45. The interconnect device of claim 44, wherein said enlarged foot can be surface mount soldered to the power source or can be snap-fit mounted to the power source.

46. In combination, the interconnect device of claim 44, an LED device and a circuit member which provides the power source.

47. The combination of claim 46, wherein said LED device is permanently mounted to the interconnect device and contacts on said LED device are mated to said second plated component.

48. The interconnect device of claim 1, wherein said base includes a plurality of vias therethrough.

49. The interconnect device of claim 48, further including a heat spreader provided in said base.

50. The interconnect device of claim 49, wherein said heat spreader is a copper slug.

51. An interconnect device for interconnecting a heat generating device to a power source, comprising:

a base member;

a first pattern of plated material disposed on said base member to provide an electrical path between the heat generating device and the power source; and

a second pattern of plated material disposed on said base member distinct from said first portion for providing a heat dissipating surface for said heat generating device, said second pattern being primarily thermally functional and generally electrically non-functional.

52. The interconnect device of claim 51, wherein said second pattern of the plated material extends from and is electrically connected to said first pattern of the plated material.

53. The interconnect device of claim 51, wherein said second pattern of the plated material is electrically distinct from said first pattern of plated material.

54. The interconnect device of claim 51, further comprising a third pattern of the plated material disposed on said base member to provide an additional electrical path between the heat generating device and the circuit member.

55. The interconnect device of claim 54, wherein said second and third patterns are electrically interconnected.

56. The interconnect device of claim 54, wherein said second and third patterns are electrically distinct.

57. The interconnect device of claim 51, wherein said first pattern of plated material and said second pattern of plated material are formed of the same material.