Micro-Fluidic System

• US 20080311000A1
• Filed: 08/30/2005
• Published: 12/18/2008
• Est. Priority Date: 09/03/2004
• Status: Abandoned Application

• Current Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Wimberger-Friedl, Reinhold, Weekamp, Johannus Wilhelmus
• Application Number:
  US11/574,259
• Publication Number:
  US 20080311000A1
• Time in Patent Office: Days
• US Class Current: 422/68.1
• CPC Class Codes: B01L 2200/0689 Sealing
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/502715 characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces

Abstract

Micro-fluidic systems comprise components (4), for instance sensors or pump units, which are intended to measure properties of a fluid or exert influence on this fluid, which is conducted in a channel (7). In the present invention, a micro-fluidic system is proposed in which a component (4) is embedded in castjacket material (5), such that a component structure (49) is formed, parallel to which a channel structure (8) is arranged, wherein a channel (7) is incorporated in the channel structure (8). In such a micro-fluidic system, the component can be positioned in relation to the channel in such a manner that a fluid flow with very good flow properties through the channel can be realized.

Claims

1. Micro-fluidic system with a component structure (49) comprising a component (4) embedded in cast jacket material (5), wherein the component structure (49) has a flat assembly side (48) and comprises a channel structure (8) arranged on the assembly side (48), which channel structure incorporates at least one channel (7) for conducting a fluid, said channel extending parallel to the assembly side (48) at least in the component area, the component (4) being designed for measuring a property of the fluid present in the channel (7) or for influencing said fluid.

2. Micro-fluidic system as claimed in claim 1, characterized in that the component structure (49) forms a boundary wall (7d) of the channel (7), such that the channel height (h) in the component area is substantially constant.

3. Micro-fluidic system as claimed in claim 2, characterized in that the channel height (h) in the component area varies at the most by one-third of the channel height (h), wherein especially for a channel height (h) of about 100 μ

m the height variation (r) of the channel height is not more than about 30 μ

m.

4. Micro-fluidic system as claimed in claim 1, characterized in that electrical leads (2) to the component form a part of the assembly side (48).

5. Micro-fluidic system as claimed in claim 1, characterized in that a substrate layer (1′

) is arranged between the component structure (49) and the channel structure (8).

6. Micro-fluidic system as claimed in claim 1, characterized in that the component (4) is equipped for wireless transmission and/or reception of data and/or energy.

7. Method of manufacturing a micro-fluidic system as claimed in claim 1, comprising the following steps:

Manufacturing a component structure (49) by means of sub-steps;

Arranging at least one component (4) on a flat substrate (1),

Casting a jacket material (5) around component (4)

Partially or completely removing the substrate (1), such that the component structure (49) gets a flat assembly side (48), and

Connecting a channel structure (8) with the component structure (49), such that a channel (7), extending in the component area essentially parallel to the assembly side (48), is created for conducting a fluid.

8. Method as claimed in claim 7, characterized in that it has the following further sub-steps for manufacturing the component structure (49):

Creating at least one electrical lead (2) on the substrate (1) and

connecting at least one contact point (6) of the component (4) with the electrical lead (2).

9. Method as claimed in claim 7, characterized in that it comprises the following additional step:

Providing chemical and/or biochemical areas (10) on an active surface (41) of the component (4).

10. Method as claimed in claim 7, characterized in that it comprises the following additional sub-step for manufacturing the component structure (49):

Depositing filler material (5′

) in interspaces between the component (4) and the substrate (1).