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MICROWAVE INTEGRATED CIRCUIT PACKAGE AND METHOD FOR FORMING SUCH PACKAGE

  • US 20080311682A1
  • Filed: 03/20/2008
  • Published: 12/18/2008
  • Est. Priority Date: 06/14/2007
  • Status: Active Grant
First Claim
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1. A method for packaging a semiconductor device, such method comprising:

  • providing a dielectric layer over the semiconductor device;

    determining patterns and placement of material on the dielectric layer to provide a predetermined magnetic or electric effect for the device, such effects being provided on the device from such patterned and placed material solely by electrical or magnetic waves coupled between such material and the device; and

    forming the material in the determined patterns and placement to provide the predetermined effects.

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