IMPLANTABLE MEDICAL DEVICE WITH POLYMER-POLYMER INTERFACES AND METHODS OF MANUFACTURE AND USE

• US 20080312707A1
• Filed: 08/21/2008
• Published: 12/18/2008
• Est. Priority Date: 05/10/2005
• Status: Active Grant

• Current Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Original Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Inventors: Haller, Matthew I., He, Tom Xiaohai, Anderson, Meredith L.
• Granted Patent: US 8,165,679 B2
• Time in Patent Office: Days
• US Class Current: 607/2
• CPC Class Codes: A61N 1/375 Constructional arrangements, e.g. casings
• CPC Class Codes: B29C 2035/0822 using IR radiation
• CPC Class Codes: B29C 65/1606 Ultraviolet [UV] radiation, e.g. by ultraviolet excimer lasers
• CPC Class Codes: B29C 65/1612 Infrared [IR] radiation, e.g. by infrared lasers
• CPC Class Codes: B29C 65/1616 Near infrared radiation [NIR], e.g. by YAG lasers
• CPC Class Codes: B29C 65/1635 at least passing through one of the parts to be joined, i.e. laser transmission welding
• CPC Class Codes: B29C 65/168 placed at the interface
• CPC Class Codes: B29C 65/1683 coated on the article
• CPC Class Codes: B29C 65/3444 being a ribbon, band or strip
• CPC Class Codes: B29C 65/3468 characterised by the means for supplying heat to said heated elements which remain in the join, e.g. special electrical connectors of windings B29C65/3668 takes precedence
• CPC Class Codes: B29C 65/3476 being metallic
• CPC Class Codes: B29C 65/348 with a polymer coating
• CPC Class Codes: B29C 66/1312 Single flange to flange joints, the parts to be joined being rigid the parts to be joined being flexible B29C66/133
• CPC Class Codes: B29C 66/54 Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
• CPC Class Codes: B29C 66/71 characterised by the composition of the plastics material of the parts to be joined welding bar compositions B29C65/125
• CPC Class Codes: B29C 66/73366 both parts to be joined being transparent or translucent to visible light
• CPC Class Codes: B29C 66/73921 characterised by the materials of both parts being thermoplastics
• CPC Class Codes: B29C 66/8322 Joining or pressing tools reciprocating along one axis
• CPC Class Codes: B29K 2023/00 Use of polyalkenes or derivatives thereof as moulding material
• CPC Class Codes: B29K 2023/12 PP, i.e. polypropylene
• CPC Class Codes: B29K 2023/14 : Copolymers of polypropylene B29K2023/16 takes precedence
• CPC Class Codes: B29K 2027/18 : PTFE, i.e. polytetrafluorethene , e.g. ePTFE, i.e. expanded polytetrafluorethene
• CPC Class Codes: B29K 2071/00 : Use of polyethers , e.g. PEEK, i.e. polyether-etherketone or PEK, i.e. polyetherketone or derivatives thereof, as moulding material
• CPC Class Codes: B29K 2305/14 : Noble metals, e.g. silver, gold or platinum
• CPC Class Codes: B29K 2995/0093 : hydrophobic
• CPC Class Codes: B29L 2022/002 : Globes
• CPC Class Codes: B29L 2031/7532 : Artificial members, protheses

Abstract

An implantable stimulator that includes a housing, a first plastic component, and a second plastic component, where the first and second plastic components form a polymer-polymer interface. A light absorbing metal layer is disposed over at least a portion of the interface and an electronic subassembly is disposed within the housing. The first and second plastic components can be welded together by irradiating the light absorbing metal layer which converts the light to heat.

Claims

1. An implantable stimulator, comprising:

a housing;

a first plastic component comprising a polymeric material;

a second plastic component comprising a polymeric material, wherein the implantable stimulator comprises a polymer-polymer interface comprising a direct polymer-to-polymer bond between portions of the first and second plastic components;

a light absorbing metal layer disposed over at least a portion of the polymer-polymer interface, wherein the direct polymer-to-polymer bond comprises a region in which the first and second plastic components of the implantable stimulator are in direct contact with each other and directly bonded without the light absorbing metal layer between the first and second plastic components; and

an electronic subassembly disposed within the housing.

2. The implantable stimulator of claim 1, wherein the housing comprises the first and second plastic components.

3. The implantable stimulator of claim 1, wherein the light absorbing metal layer is patterned.

4. The implantable stimulator of claim 1, wherein the light absorbing metal layer is electrically coupled to the electronic subassembly.

5. The implantable stimulator of claim 1, further comprising at least one electrode disposed external to the housing and coupled to the electronic subassembly.

6. The implantable stimulator of claim 5, wherein the light absorbing metal layer is electrically coupled to the at least one electrode and provides a conduit for transmission of stimulation signals generated by the electronic subassembly to the at least one electrode external to the housing.

7. The implantable stimulator of claim 5, wherein the at least one electrode is disposed on the housing.

8. The implantable stimulator of claim 1, wherein the light absorbing metal layer is an infrared absorbing metal layer.

9. The implantable stimulator of claim 1, further comprising a second direct polymer-to-polymer bond that is non-contiguous with the polymer-to-polymer bond.

10. The implantable stimulator of claim 1, further comprising a non-conductive light absorbing material over at least some portion of the polymer-polymer interface, wherein that portions is not in contact with the light absorbing metal layer.

11. An implantable stimulator, comprising:

a housing;

an electronic subassembly disposed within the housing;

wherein the housing comprises a polymer-polymer interface comprising a direct polymer-to-polymer bond and wherein the interface is welded using a laser to produce the polymer-to-polymer bond by irradiating a light absorbing metal layer disposed over a portion of the interface.

12. The implantable stimulator of claim 11, further comprising at least one electrode disposed external to the housing and coupled to the electronic subassembly.

13. The implantable stimulator of claim 11, wherein the light absorbing metal layer is patterned.

14. The implantable stimulator of claim 11, wherein the light absorbing metal layer is electrically coupled to the electronic subassembly.

15. The implantable stimulator of claim 12, wherein the light absorbing metal layer is electrically coupled to the at least one electrode and provides a conduit for transmission of stimulation signals generated by the electronic subassembly to the at least one electrode external to the housing.

16. The implantable stimulator of claim 11, wherein the light absorbing metal layer is an infrared absorbing metal layer.

17. The implantable stimulator of claim 11, further comprising a second direct polymer-to-polymer bond that is non-contiguous with the polymer-to-polymer bond, wherein the second direct polymer-to-polymer bond is produced by irradiating the light absorbing metal layer disposed over a portion of the interface.

18. The implantable stimulator of claim 11, further comprising a non-conductive light absorbing material over at least some portion of the polymer-polymer interface, wherein that portion is not in contact with the light absorbing metal layer.